Hoʻolauna ʻenehana HiPIMS

No.1 Kumu o ka mana kiʻekiʻe pulsed magnetron sputtering
Hoʻohana ka mana kiʻekiʻe pulsed magnetron sputtering i ka mana pulse peak kiʻekiʻe (2-3 kauoha o ka nui ma mua o ka magnetron sputtering maʻamau) a me ka haʻahaʻa pulse duty cycle (0.5% -10%) e hoʻokō ai i nā kiʻekiʻe dissociation metala kiʻekiʻe (> 50%), i loaʻa mai ka magnetron sputtering hiʻohiʻona, e like me ka mea i hōʻike ʻia ma Pic 1, kahi i hōʻike ʻia ma ka Pic 1, kahi i hōʻike ʻia ma ka Pic 1. ka hoʻokuʻu uila U, I = kUn (n he mea mau e pili ana i ka hoʻolālā cathode, ke kahua magnetic a me nā mea). Ma nā ha'aha'a mana ha'aha'a (volta ha'aha'a) ma'amau ka helu n ma waena o 5 a 15; me ka piʻi ʻana o ka volta hoʻokuʻu, piʻi wikiwiki ka nui o kēia manawa a me ka nui o ka mana, a ma ke kiʻekiʻe ka nui o ka helu n e lilo i 1 ma muli o ka nalowale o ka hoʻopaʻa ʻana i ka māla magnetic. Inā ma nā haʻahaʻa mana haʻahaʻa, hoʻoholo ʻia ka hoʻokuʻu kinoea e nā ion kinoea i loko o ke ʻano hoʻokuʻu pulsed maʻamau; inā ma ka density mana kiʻekiʻe, piʻi ka nui o nā ion metala i loko o ka plasma a hoʻololi kekahi mau mea, aia i ke ʻano hoʻoheheʻe ponoʻī, ʻo ia hoʻi, mālama ʻia ka plasma e ka ionization o ka sputtered neutral particles a me nā ion metala lua, a hoʻohana ʻia nā kinoea inert e like me Ar e puhi wale i ka plasma, a ma hope iho o ka sputtered metala i hoʻopaʻa ʻia i hope a hoʻokuʻu ʻia nā ʻāpana metala. ka pahuhopu ma lalo o ka hana a ka magnetic a me ka uila e mālama i ka hoʻokuʻu kiʻekiʻe o kēia manawa, a ʻo ka plasma he mau mea metala ionized loa. Ma muli o ke kaʻina hana sputtering o ka hopena wela ma ka pahu hopu, i mea e hōʻoia ai i ka hana paʻa o ka pahuhopu i nā noi ʻoihana, ʻaʻole hiki ke nui loa ka mana o ka mana i hoʻopili pololei ʻia i ka pahu hopu, ma ke ʻano maʻamau ka hoʻoluʻu ʻana o ka wai a me ka mea i hoʻopaʻa ʻia i ka thermal conductivity i ka hihia o 25 W / cm2 ma lalo, ka hoʻoheheʻe ʻana i ka wai, ʻoi aku ka maikaʻi o ka mea i hoʻopaʻa ʻia i ka thermal conductivity. hiki wale ma 2 ~ 15 W / cm2 ma lalo, ma lalo o nā koi o ka mana kiʻekiʻe. Hiki ke hoʻopau ʻia ka pilikia o ka wela wela ma ka hoʻohana ʻana i nā pulses mana kiʻekiʻe. Ua wehewehe ʻo Anders i ka mana kiʻekiʻe pulsed magnetron sputtering e like me ke ʻano o ka pulsed sputtering kahi i ʻoi aku ka nui o ka mana kiʻekiʻe ma mua o ka mana awelika ma ka 2 a hiki i 3 mau kauoha o ka nui, a ʻo ka pahuhopu ion sputtering e hoʻomalu i ke kaʻina sputtering, a ua hoʻokaʻawale loa ʻia nā atom sputtering.

No.2 Nā ʻano o ka mana kiʻekiʻe pulsed magnetron sputtering coating deposition

Hiki i ka mana kiʻekiʻe pulsed magnetron sputtering hiki ke hana i ka plasma me ka kiʻekiʻe dissociation rate a me ka ikehu ion kiʻekiʻe, a hiki ke hoʻopili i ke kaomi bias e hoʻolalelale i nā ion i hoʻopiʻi ʻia, a ua hoʻomake ʻia ke kaʻina deposition coating e nā mea ikaika kiʻekiʻe, ʻo ia ka ʻenehana IPVD maʻamau. He hopena koʻikoʻi ko ka ikehu ion a me ka hāʻawi ʻana i ka maikaʻi o ka uhi a me ka hana.
E pili ana i ka IPVD, ma muli o ke kumu hoʻohālike kaulana ʻo Thorton structural region, ua hāʻawi ʻo Anders i kahi kumu hoʻohālike ʻāina e pili ana i ka plasma deposition a me ka ion etching, e hoʻolōʻihi i ka pilina ma waena o ka hoʻopili ʻana a me ka mahana a me ke kaomi ea ma ka Thorton structural region model i ka pilina ma waena o ka hoʻopili ʻana, ka wela a me ka ikehu ion, e like me ka hōʻike ʻana ma Pic 2. Me ka piʻi ʻana o ka mahana deposition, ʻo ka hoʻololi ʻana mai ka ʻāpana 1 (nā kristal porous porous) a i ka ʻāpana T (nā kristal fiber paʻa), ka ʻāpana 2 (nā kristal columnar) a me ka ʻāpana 3 (ʻāpana recrystallization); me ka piʻi ʻana o ka ikehu ion deposition, e emi ana ka mahana hoʻololi mai ka ʻāina 1 a i ka ʻāpana T, ka ʻāpana 2 a me ka ʻāpana 3. Hiki ke hoʻomākaukau i nā kristal fiber kiʻekiʻe a me nā kolamu kolamu i ka haʻahaʻa haʻahaʻa. Ke piʻi aʻe ka ikehu o nā ion i waiho ʻia i ke kauoha o 1-10 eV, e hoʻonui ʻia ka pōʻino a me ke kahakaha ʻana o nā ion ma ka ʻili o nā uhi i waiho ʻia a hoʻonui ʻia ka mānoanoa o nā uhi.

No.3 Ka hoʻomākaukau ʻana i ka papa uhi paʻakikī e ka mana kiʻekiʻe pulsed magnetron sputtering ʻenehana
ʻO ka uhi i hoʻomākaukau ʻia e ka mana kiʻekiʻe pulsed magnetron sputtering ʻenehana ʻoi aku ka denser, me ka ʻoi aku ka maikaʻi o nā waiwai mechanical a me ke kūpaʻa wela kiʻekiʻe. E like me ka mea i hōʻike ʻia ma Pic 3, ʻo ka magnetron sputtered TiAlN coating maʻamau he ʻano aniani kolamu me ka paʻakikī o 30 GPa a me ka modulus o Young o 460 GPa; ʻo ka uhi ʻana o HIPIMS-TiAlN he 34 GPa paʻakikī a ʻo ka modulus o ka Young he 377 GPa; ʻO ka lakio ma waena o ka paʻakikī a me ka modulus Young kahi ana o ka paʻakikī o ka uhi. ʻOi aku ka paʻakikī a ʻoi aku ka liʻiliʻi o Young's modulus ʻoi aku ka paʻakikī. ʻO ka uhi ʻana o HIPIMS-TiAlN ʻoi aku ka maikaʻi o ke kūpaʻa wela kiʻekiʻe, me ka AlN hexagonal phase precipitated i loko o ka uhi TiAlN maʻamau ma hope o ka mālama ʻana i ka annealing kiʻekiʻe ma 1,000 °C no 4 mau hola. Ke emi nei ka paʻakikī o ka uhi ʻana i ka wela kiʻekiʻe, ʻoiai ʻo ka uhi ʻana o HIPIMS-TiAlN ʻaʻole i hoʻololi ʻia ma hope o ka mālama ʻana i ka wela ma ka mahana like a me ka manawa. ʻO ka uhi ʻana o HIPIMS-TiAlN ʻoi aku ka kiʻekiʻe o ka hoʻomaka ʻana o ka wela wela ma mua o ka uhi maʻamau. No laila, hōʻike ka uhi HIPIMS-TiAlN i ka hana ʻoi aku ka maikaʻi ma nā mea hana ʻoki kiʻekiʻe ma mua o nā mea hana i uhi ʻia i hoʻomākaukau ʻia e ka hana PVD.