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Plasma txhim kho cov pa tshuaj lom neeg

Tsab xov xwm qhov chaw: Zhenhua lub tshuab nqus tsev
Nyeem: 10
Luam tawm: 22-11-08

Cov khoom ntawm cov ntshav
Qhov xwm txheej ntawm plasma hauv plasma-enhanced tshuaj vapor deposition yog tias nws vam khom lub zog kinetic ntawm cov electrons hauv plasma los ua kom cov tshuaj tiv thaiv hauv cov roj theem. Txij li thaum plasma yog ib qho kev sib sau ua ke ntawm ions, electrons, neutral atoms thiab molecules, nws yog electrically neutral ntawm macroscopic theem. Hauv plasma, ntau lub zog khaws cia rau hauv lub zog sab hauv ntawm plasma. Plasma yog thawj zaug muab faib ua kub plasma thiab txias plasma. hauv PECVD system nws yog txias plasma uas yog tsim los ntawm kev tso tawm roj qis. Cov plasma no tsim los ntawm kev tso tawm qis qis hauv qab ob peb puas Pa yog cov roj plasma tsis sib npaug.
Qhov xwm txheej ntawm cov plasma no yog raws li nram no:
(1) Kev txav tsis tu ncua ntawm cov electrons thiab ions tshaj qhov lawv tau taw qhia.
(2) Nws cov txheej txheem ionization feem ntau yog tshwm sim los ntawm kev sib tsoo ntawm cov electrons ceev nrog cov roj molecules.
(3) Lub zog nruab nrab ntawm kev txav mus los ntawm cov hluav taws xob yog 1 txog 2 qhov kev txiav txim siab siab dua li ntawm cov khoom hnyav, xws li cov molecules, atoms, ions thiab cov radicals dawb.
(4) Lub zog poob tom qab kev sib tsoo ntawm cov electrons thiab cov khoom hnyav tuaj yeem them rov qab los ntawm lub tshav hluav taws xob ntawm kev sib tsoo.
Nws nyuaj rau piav qhia txog cov plasma uas tsis muaj qhov kub thiab txias nrog cov lej me me, vim nws yog cov plasma uas tsis muaj qhov kub thiab txias hauv PECVD system, qhov twg qhov kub ntawm electron Te tsis zoo ib yam li qhov kub thiab txias Tj ntawm cov khoom hnyav. Hauv PECVD technology, lub luag haujlwm tseem ceeb ntawm cov plasma yog los tsim cov tshuaj ions thiab cov free-radicals uas muaj zog. Cov ions thiab cov free-radicals no ua rau muaj kev puas tsuaj nrog lwm cov ions, atoms thiab molecules hauv cov roj theem lossis ua rau muaj kev puas tsuaj rau cov lattice thiab cov tshuaj lom neeg ntawm qhov chaw substrate, thiab qhov tshwm sim ntawm cov khoom siv nquag yog ib qho kev ua haujlwm ntawm electron density, reactant concentration thiab yield coefficient. Hauv lwm lo lus, qhov tshwm sim ntawm cov khoom siv nquag nyob ntawm lub zog hluav taws xob, lub zog roj, thiab qhov nruab nrab ntawm cov khoom me me thaum lub sijhawm sib tsoo. Raws li cov roj reactant hauv plasma dissociates vim yog kev sib tsoo ntawm cov electrons muaj zog siab, qhov kev ua kom muaj zog ntawm cov tshuaj lom neeg tuaj yeem kov yeej thiab qhov kub ntawm cov roj reactant tuaj yeem txo qis. Qhov sib txawv tseem ceeb ntawm PECVD thiab CVD ib txwm muaj yog tias cov ntsiab cai thermodynamic ntawm cov tshuaj lom neeg sib txawv. Qhov kev sib cais ntawm cov roj molecules hauv plasma tsis yog xaiv, yog li cov txheej zaj duab xis uas PECVD tso tawm txawv kiag li ntawm CVD ib txwm muaj. Cov khoom sib xyaw ua ke uas PECVD tsim tawm yuav tsis sib npaug, thiab nws txoj kev tsim tsis raug txwv los ntawm qhov sib npaug ntawm kinetics. Cov txheej zaj duab xis feem ntau yog amorphous state.

Plasma txhim kho cov pa tshuaj lom neeg

Cov yam ntxwv ntawm PECVD
(1) Qhov kub tso tawm qis.
(2) Txo qhov kev ntxhov siab sab hauv uas tshwm sim los ntawm qhov tsis sib xws ntawm cov coefficient nthuav dav ntawm cov ntaub ntawv membrane / hauv paus.
(3) Tus nqi tso dej yog qhov siab, tshwj xeeb tshaj yog qhov kub qis, uas yog qhov zoo rau kev tau txais cov yeeb yaj kiab amorphous thiab microcrystalline.

Vim yog cov txheej txheem kub qis ntawm PECVD, kev puas tsuaj thermal tuaj yeem txo qis, kev sib kis thiab kev sib cuam tshuam ntawm cov zaj duab xis txheej thiab cov khoom siv substrate tuaj yeem txo qis, thiab lwm yam, yog li cov khoom siv hluav taws xob tuaj yeem coated ob qho tib si ua ntej lawv ua lossis vim qhov xav tau rov ua dua. Rau kev tsim cov ultra-large scale integrated circuits (VLSI, ULSI), PECVD thev naus laus zis tau ua tiav rau kev tsim cov zaj duab xis silicon nitride (SiN) ua cov zaj duab xis tiv thaiv kawg tom qab tsim cov Al electrode wiring, nrog rau kev flattening thiab kev tsim cov zaj duab xis silicon oxide ua interlayer rwb thaiv tsev. Raws li cov khoom siv nyias-zaj duab xis, PECVD thev naus laus zis kuj tau ua tiav rau kev tsim cov transistors nyias-zaj duab xis (TFTs) rau LCD zaub, thiab lwm yam, siv iav ua lub substrate hauv txoj kev matrix active. Nrog rau kev txhim kho ntawm cov integrated circuits rau qhov loj dua thiab kev koom ua ke siab dua thiab kev siv dav dav ntawm cov khoom siv semiconductor compound, PECVD yuav tsum tau ua tiav ntawm qhov kub qis dua thiab cov txheej txheem hluav taws xob electron siab dua. Txhawm rau kom ua tau raws li qhov xav tau no, cov thev naus laus zis uas tuaj yeem ua cov zaj duab xis tiaj tiaj siab dua ntawm qhov kub qis dua yuav tsum tau tsim. Cov yeeb yaj kiab SiN thiab SiOx tau raug kawm ntau yam siv ECR plasma thiab cov thev naus laus zis plasma chemical vapor deposition (PCVD) tshiab nrog lub helical plasma, thiab tau mus txog qib kev siv cov yeeb yaj kiab rwb thaiv tsev interlayer rau cov voj voog loj dua, thiab lwm yam.


Lub sijhawm tshaj tawm: Kaum Ib Hlis-08-2022