Kab rov tav ob-sided semiconductor txheej ntau lawm kab
Tau Ib Daim Ntawv Qhia
KHOOM PLIG
Cov txheej txheej siv cov qauv qauv, uas tuaj yeem ua kom lub chamber raws li cov txheej txheem thiab kev ua haujlwm tau zoo, thiab tuaj yeem coated ntawm ob sab, uas yog hloov tau thiab yooj yim. Nruab nrog ion tu system, cua kub ceev thiab DC magnetron sputtering system, nws muaj peev xwm ua tau zoo deposit yooj yim hlau txheej. Cov khoom siv tau nrawm nrawm, yooj yim clamping thiab ua haujlwm siab.
Cov txheej txheej yog nruab nrog ion tu thiab high-temperature baking system, yog li cov adhesion ntawm deposited zaj duab xis yog zoo dua. Lub kaum me me sputtering nrog rotating lub hom phiaj yog qhov zoo rau cov deposition ntawm zaj duab xis nyob rau hauv lub puab nto ntawm me me aperture.
1. Cov khoom siv muaj cov qauv compact thiab me me hauv pem teb.
2. Lub tshuab nqus tsev yog nruab nrog lub twj tso kua mis molecular rau huab cua rho tawm, nrog kev siv hluav taws xob tsawg.
3. Tsis siv neeg rov qab ntawm cov khoom khib nyiab txuag cov neeg ua haujlwm.
4. Cov txheej txheem tsis tuaj yeem taug qab, thiab cov txheej txheem tsim khoom tuaj yeem soj ntsuam tag nrho cov txheej txheem los pab txhawb kev taug qab ntawm cov khoom tsis raug.
5. Cov kab txheej txheej muaj qib siab ntawm automation. Nws tuaj yeem siv nrog tus neeg siv khoom los txuas cov txheej txheem pem hauv ntej thiab nram qab thiab txo cov nqi zog.
Nws tuaj yeem hloov cov nyiaj paste luam ntawv hauv cov txheej txheem tsim khoom, nrog kev ua haujlwm zoo dua thiab tus nqi qis dua.
Nws muaj feem xyuam rau Ti, Cu, Al, Cr, Ni, Ag, Sn thiab lwm yam hlau yooj yim. Nws tau siv dav hauv cov khoom siv hluav taws xob semiconductor, xws li ceramic substrates, ceramic capacitors, coj ceramic txhawb, thiab lwm yam.
KHOOM PLIG
Nyem Saib
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