Njengoba ukukhiqizwa kwe-PCB kuqhubekela phambili ekuxineni okuphezulu, isikhala esincane semigqa, ukubalwa kwezingqimba okuphezulu kanye nezindinganiso zekhwalithi yemigodi ezidinga kakhulu, ukubhoboza okuncane sekungenye yezinqubo ezibaluleke kakhulu ezithinta isivuno, ukunemba kobukhulu kanye nezindleko zokukhiqiza. Ekubhobozeni kwe-PCB okusheshayo, kudingeka ukubhoboza okuncane ukuze kunqunywe i-foil yethusi, i-fiber yengilazi, izinhlelo ze-resin kanye nezinto zokugcwalisa ezikhula ngokushesha ngenkathi kugcinwa imiphetho yokusika ebukhali, ukuphuma kwe-chip okuzinzile kanye nekhwalithi yodonga lwemigodi eqhubekayo. Imibiko yezimboni iphawule ukuthi ekwakhiweni kwe-PCB enobunzima obukhulu, ukwehluleka kokubhoboza kuhlobene kakhulu nokunamathela kwe-resin, ukuguguleka okusheshayo komphetho, ukuguqulwa kwemigodi kanye nokufakwa kabusha kwamathuluzi njalo, ikakhulukazi njengoba isivinini sokubhoboza kanye nenani lezingqimba kuqhubeka nokukhula.
Ngokwalesi sizathu,Isembozo se-PCB micro-drillakuseyona inqubo elula "yokumelana nokuguguleka kwesendlalelo". Sekuba yisisombululo sobunjiniyela bokuphezulu obunembile esidinga ukusebenza okuphezulu kakhulu kwemishini yokumboza nge-vacuum. Ingubo kumele ithuthukise ubulukhuni, inciphise ukungqubuzana, icindezele ukunamathela kwe-resin okwakhiwe, ithuthukise ukugcinwa komphetho futhi igcine i-geometry yokuqala yama-carbide drills amancane. Lokhu kubeka izidingo ezintsha ekulawulweni kwesakhiwo sefilimu, ukuzinza kwe-plasma, ukucindezela izinhlayiya, ukuphathwa kwezinga lokushisa kanye nokuvumelana kweqembu.
Isidingo sokuqala ukulawula ukugqoka okunciphile kakhulu futhi okufanayo kakhulu. Ama-PCB micro-drill anobubanzi obuncane kakhulu, imiphetho yokusika ebukhali kanye nama-geometri ayinkimbinkimbi e-flute. Ubukhulu obukhulu bokugqoka bungase buzungeze umphetho wokusika, buthinte ukususwa kwe-chip noma bushintshe indawo yokusika eklanyelwe. Ngakho-ke, imishini yokugqoka kumele ikwazi ukufaka amafilimu aminyene, aqhubekayo futhi afanayo esikalini se-micron noma ngisho ne-sub-micron, ngenkathi iqinisekisa ukumbozwa okuhle emphethoni wokusika, ebusweni bombhobho kanye ne-drill tip. Ngezingubo ezifana ne-ta-C, i-DLC, i-AlTiN, i-AlCrN, i-TiAlSiN noma i-multilayer hard coatings, imishini kumele ilawule ngokunembile izinga lokufakwa, amandla e-ion kanye nobukhulu befilimu ukuze ilinganisele ubulukhuni, ukunamathela kanye nobukhali bomphetho.
Isidingo sesibili ikhono lokufaka izinhlayiya ezincane. Ukufakwa kwe-arc ye-cathodic yendabuko kunikeza izinga eliphezulu le-ionization kanye nokunamathela okuqinile kwefilimu, kodwa ama-macroparticles angaba umthombo wesici esibalulekile samathuluzi amancane. Kuma-micro-drill e-PCB, ngisho nezinhlayiya ezincane onqenqemeni oluphambili zingabangela ukugxilisa ingqondo kwendawo, ukubhoboza okungazinzile, ukuklwebheka odongeni lwemigodi noma ukwehluleka kokumboza ngaphambi kwesikhathi. Yingakho ubuchwepheshe be-arc ehlungiwe nge-magnetic, izinhlelo ze-arc ye-vacuum ye-cathodic ehlungiwe kanye nezakhiwo zokuhlunga ze-plasma ezilungiselelwe kubaluleke kakhulu. Ukuhlunga nge-magnetic kunganciphisa izinhlayiya ezinkulu futhi kuthuthukise ukushelela kokumboza, okubaluleke kakhulu kuma-DLC kanye ne-ta-C superhard coating asetshenziswa kuma-micro-drill.
Isidingo sesithathu ukunamathela okuqinile ngaphandle kokulimala kokushisa. Ama-PCB micro-drill avame ukwenziwa nge-carbide eqinisiwe, futhi ukusebenza kwawo kokusika kuncike kakhulu ku-geometry yomngcele oqondile. Uma izinga lokushisa lokugqoka liphezulu kakhulu, i-substrate, isakhiwo esino-brazed noma ukunemba komngcele kungathinteka. Ngakho-ke imishini yokugqoka yesimanje ye-micro-drill idinga ukufakwa okuzinzile kokushisa okuphansi, ukuhlanza ama-ion okusebenza kahle kakhulu kanye nomklamo othembekile we-interlayer. Ubuchwepheshe obufana nokusika umthombo we-ion, ukufakwa okusizwa yi-bias, izendlalelo zokuguqulwa kwensimbi noma ze-Cr, kanye nezendlalelo ezilinganiselwe zisiza ukuthuthukisa amandla okubopha phakathi kokugqoka kanye ne-substrate ye-carbide. Ezinye izinqubo zokugqoka ze-ta-C ezihlungiwe zingafakwa ngaphansi kuka-100 °C, zisize ukulondoloza i-geometry yama-carbide drill amancane.
Isidingo sesine ubulukhuni obuphezulu obuhlanganiswe nokungqubuzana okuphansi. Ekubholeni kwe-PCB, ukumbozwa kumele kumelane nokuguguleka okubangelwa yi-glass fiber, ithusi, i-resin kanye ne-ceramic fillers, kuyilapho kunciphisa ukushisa okungqubuzanayo kanye nokunamathela kwe-resin. Ifilimu eqinile kodwa eqinile ingandisa ukumelana nokusika futhi isheshise ukuvaleka kwe-chip. Ifilimu ebushelelezi kodwa engenawo amandla okuthwala umthwalo ingase yehluleke ngokushesha ngaphansi kokubholwa ngesivinini esikhulu. Ngakho-ke, imishini kumele ikwazi ukukhiqiza ukumbozwa okunesakhiwo esincane esiminyene, okuqukethwe okuphezulu kwe-sp³ kwezinhlelo ze-ta-C noma ze-DLC, i-coefficient ephansi yokungqubuzana kanye nokumelana okuhle kokuguguleka. Ucwaningo ngamafilimu edayimane e-PCB drills lukhombisile ukuthi izakhiwo zedayimane ezisezingeni eliphezulu zingathuthukisa impilo yokubhoboza kanye nekhwalithi yemigodi lapho kulungiswa izinto ze-PCB ezingqubuzanayo eziqukethe ama-alumina ceramic fillers.
Isidingo sesihlanu ukuphindaphindwa okuhle kakhulu kokumbozwa komkhiqizo ngobuningi. Ama-PCB micro-drill avame ukumbozwa ngamaqoqo amakhulu, futhi yonke i-drill kumele igcine ukujiya kwefilimu okuhambisanayo, umbala, ubulukhuni, ukunamathela kanye nokusebenza kwe-tribological. Noma yimuphi umehluko endaweni yokufakwa, ubuningi be-plasma, isimo sokuguguleka kwethagethi, ukusatshalaliswa kokugeleza kwegesi noma i-bias voltage kungaholela ekuhlukeni kokusebenza phakathi kwama-drill. Ngakho-ke, izinhlelo zokumboza zama-PCB micro-drill kumele zibe nokusebenza okuzinzile kokupompa i-vacuum, ukulawula okunembile kokugeleza kobuningi, ukusatshalaliswa kwe-plasma okufanayo, izinto zokujikeleza/ukuguquka okuthembekile kanye nokulawula iresiphi ephindaphindwayo. Kubakhiqizi bamathuluzi, inani langempela lemishini yokumboza aligcini nje ngokuthola umphumela omuhle wesampula, kodwa futhi nokugcina ukusebenza okuzinzile kuwo wonke amaqoqo okukhiqiza okuqhubekayo.
Isidingo sesithupha ukwakheka okukhethekile kwe-fixture kanye nokulayisha kwamathuluzi amancane okunemba. Uma kuqhathaniswa ne-molds ezinkulu noma amathuluzi okusika ajwayelekile, ama-PCB micro-drill amancane kakhulu, abuthakathaka kakhulu futhi azwela kakhulu ekuqineni kwe-clamping. I-fixture kumele iqinisekise umthamo wokulayisha ophezulu ngenkathi igwema imiphumela yokuvikela, ukugqoka okungalingani kanye nomonakalo womshini. Ukujikeleza kwe-Multi-axis, ukuhlelwa kokulayisha okuxinene, ukubeka amathuluzi okunembile kanye nokuvezwa kwe-plasma okulungiselelwe kuyadingeka ukuze kufezwe ukugqoka okufanayo endaweni yokubhoboza nendawo yombhobho. Kubakhiqizi abaphishekela ukudlula okuphezulu, imishini yokumboza kumele ilinganise umthamo we-batch kanye nokufana kwefilimu, esikhundleni sokwandisa nje inani lokulayisha.
Ngaphezu kwalokho, imishini yokumboza ye-PCB micro-drill kumele isekele ukuhlanganiswa kwezinqubo eziningi. Uhlelo lokumboza oluncintisanayo akufanele lukhawulelwe ohlotsheni olulodwa lwefilimu. Kufanele lukwazi ukusekela ukuhlanzwa kwe-ion, ukufakwa kwengqimba yokuguquguquka, ukufakwa kwengqimba eqinile, ukufakwa kwengqimba esekelwe ku-carbon kanye nomklamo wokumboza wengqimba eminingi noma ehlanganisiwe. Isibonelo, i-ta-C, i-DLC, i-AlTiN, i-AlCrN, i-TiAlSiN, i-CrN kanye nezingubo eziqinile ze-hybrid zingakhethwa ngokuya ngezinto ezahlukene ze-PCB, isivinini sokumboza, ububanzi bemigodi kanye nezidingo zamakhasimende. Ukuguquguquka kwemishini kunquma ngqo ukuthi umhlinzeki wokumboza angasabela yini ezintweni ze-PCB ezishintshayo kanye nezimo zokumboza.
Ngokombono wokukhiqiza i-PCB, inhloso yokugcina yokugqoka i-micro-drill ukunciphisa izindleko ngomgodi ngamunye, ukwandisa isikhathi sokuphila kwamathuluzi, ukuthuthukisa ikhwalithi yodonga lwemigodi, ukunciphisa ama-burrs kanye neziphambeko zokubhoboza izinzipho, kanye nokuqinisa ukusebenza kokubhoboza. Njengoba amabhodi e-PCB eba yinkimbinkimbi kakhulu futhi izinto ziba nzima ukuzisebenzisa ngomshini, imishini yokugqoka kumele iguqukele ezinhlelweni zokugqoka eziqinile ezivamile ibe amapulatifomu obunjiniyela bomphezulu obunembile kakhulu, obunezinhlayiya eziphansi, obuphansi kanye nobuphindaphindwayo kakhulu.
Esikhathini esizayo, ukuncintisana kwe-PCB micro-drill coating ngeke kuncike kuphela ebulukhunini be-coating. Kuzoncika emandleni aphelele emishini ye-vacuum coating: ukulawulwa kwe-plasma, ukuhlunga izinhlayiya, ukuzinza kwezinga lokushisa, ubunjiniyela bokunamathela, ukwakheka kwe-fixture, ukuphindaphindwa kwenqubo kanye nokuthembeka kokukhiqiza ngobuningi. Kubakhiqizi bemishini ye-vacuum coating, lokhu kuyinselele yobuchwepheshe kanye nethuba lemakethe. Noma ngubani onganikeza izixazululo ze-coating ezizinzile, ezisebenza kahle kakhulu nezigxile ekusetshenzisweni kwe-PCB micro-drills uzothola isikhundla esiqinile esizukulwaneni esilandelayo sokukhiqiza i-PCB ephezulu.
-Lesi sihloko sishicilelwe nguumenzi wemishini yokumboza nge-vacuumI-Zhenhua Vacuum
Isikhathi sokuthunyelwe: Meyi-06-2026