Uko ibikoresho bya semiconductor bikomeza kugabanuka mu gihe bihuza imikorere myinshi, ikoranabuhanga ryo gupakira rihura n'imbogamizi zidasanzwe. Gupfuka irangi rya vacuum byagaragaye nk'inzira y'ingenzi yo gutuma ibikoresho bipakira irangi rya semiconductor, bigamije ko ibikoresho bito bikoreshwa, imikorere myiza, no kwizerwa igihe kirekire. Binyuze mu gukoresha tekiniki z'ubuhanga bwa thin-film nka physical vapor deposition (PVD), chemical vapor deposition (CVD), na atomic layer deposition (ALD), abakora bashobora gukemura ibibazo by'ingenzi byo kurinda imbogamizi, imikorere y'amashanyarazi, no gucunga ubushyuhe mu bikoresho bishya.
Imbogamizi zikunze kugaragara mu gupakira ibikoresho bya semiconductor
Gupakira ibikoresho bya semiconductorNtabwo ikiri intambwe yoroshye yo kwirinda ahubwo ni intambwe y'ingenzi mu mikorere. Imbogamizi zisanzwe zirimo:
Ubushuhe n'ubwinjirire bwa ogisijeni
Ibikoresho bifungishijwe ibyuma biremereye cyane iyo bihuye n’ibidukikije. Ndetse n’urugero ruto rw’ubushuhe cyangwa umwuka wa ogisijeni bishobora gutera ingese, kwimuka kw’ibyuma, cyangwa kwangirika kwa dielectric.
Kwizerwa kw'urutonde rw'inzitizi
Udupira dusanzwe twa polymer dukunze kugaragaza ubushobozi buke bwo kurengera. Iyo tudafite utwenda duto cyane, udupira dushobora kwangirika mu gihe hari ubushuhe bwinshi cyangwa ubushyuhe bwinshi.
Guhindagurika kw'amashanyarazi n'imiyoboro y'itumanaho
Ubucucike bwinshi bw'amashanyarazi mu tuzu twateye imbere bwihutisha imikorere y'amashanyarazi. Gufata nabi cyangwa gusiga irangi ritari rimwe bishobora kwangiza igihe cyose cyo guhuza.
Inzitizi zo gusohora ubushyuhe
Uko ingufu z'ibikoresho ziyongera, ubwinshi bw'ibikoresho mu gucunga ubushyuhe budahagije bushobora gutuma ahantu hashyuha cyane, imikorere yabyo ikagabanuka, kandi bikagabanya igihe cyo kubaho kw'ibikoresho.
Gupima Ubunini n'Ubunini bw'Ikigereranyo
Imiterere igezweho yo gupfunyikamo nka Through-Silicon Vias (TSVs) na Through-Glass Vias (TGVs) isaba ko habaho irangi rijyanye n’imiterere y’ibice biri mu miyoboro n’ibice biri mu rwego rwo hejuru, ibyo bikaba ari imbogamizi ikomeye mu buhanga.
Ibisubizo byo gusiga irangi ry'umwuka
1. Ibyuma bikingira ubushuhe/ogisijeni
Udupira duto twa SiO₂, SiNₓ, na Al₂O₃ twashyizwe muri PVD cyangwa ALD dukora nk'uduce tw'urukiramende, bigabanya cyane igipimo cyo kohereza umwuka w'amazi (WVTR).
Imiterere y’ibiziba by’inyongera ivanze n’ibiziba by’inyongera irushaho kuba ingirakamaro, ikaba ari ingenzi cyane ku bikoresho bya RF na MEMS.
2. Uburyo bwo Guteza Imbere Gufatana n'Uburyo bwo Guhuza
Uduce twa Ti, Cr, cyangwa TiN twongera imbaraga zo guhuza hagati y’uduce twa metallization na dielectric, bikarinda gutandukana kw’utundi mu gihe cy’ubushyuhe.
Uburyo bwo kuvura ubuso bwa plasma burushaho kunoza uburyo bwo kunywesha no gukurura filime ku bintu bifite ingufu nkeya.
3. Uduce two gukwirakwiza no gukata amashanyarazi
Uduce tw’urukuta rwa Ta, TaN, na Ru twashyizwe binyuze mu gukwirakwiza magnetron dukora nk'imbogamizi zikora neza mu guhuza Cu.
Izi ngingo zigabanya imikorere y'amashanyarazi, zigatuma habaho imikorere y'amashanyarazi mu gihe cy'umuvuduko mwinshi w'amashanyarazi.
4. Imyambaro yo gucunga ubushyuhe
Imitako yo hejuru y’ubushyuhe nka diyama nka karuboni (DLC) cyangwa filimi za AlN yongera ubushyuhe.
Irangi rikozwe mu buryo bunoze rituma habaho kwinjizwa muri module za semiconductor zikoresha ingufu, ibikoresho bya SiC/GaN, na chips za HPC zikora neza cyane.
5. Imyambaro yo mu bwoko bwa Conformal Coatings yo gushyiramo imiterere y'igipimo cyo hejuru
ALD itanga uburyo bwo kugenzura urwego rwa atome, ikagenzura ko filime zidafite imyenge n'udupira muri TSV na TGV zifite ikigereranyo kirenze 10: 1.
Ibi ni ingenzi cyane ku gupakira 3D IC, aho ubucucike bw'imiyoboro n'ubwizigirwa bigira ingaruka ku musaruro.
Ubusabe bw'imanza
Gupakira MEMS: Gupfunyika mu cyuma gito hamwe na Al₂O₃/SiNₓ bituma igikoresho kidapfukirana, bikongera igihe cyo kubaho mu binyabiziga no mu nganda.
RF Front-End Modules: Ibyuma byinshi bigabanya ubushobozi bwa parasite ndetse n'imikorere iterwa n'ubushuhe.
Ibyuma bikoresha ingufu: Ibyuma bikwirakwiza ubushyuhe bya DLC byongera ubushyuhe mu MOSFET zishingiye kuri SiC, bigatuma habaho imikorere myiza.
Guhuza 3D: Irangi rya ALD risanzwe muri TSV/TGV rituma rikora neza binyuze mu gukingira no gushyira mu cyuma ibikoresho bifite ububiko bwa bandwidth nyinshi (HBM).
Ibyiza byo gusiga irangi ry'ubushyuhe mu gupakira
Kwizerwa cyane: Inzitizi nziza n'imikorere myiza yo gufata neza bitanga umutekano mu gihe kirekire ku gikoresho.
Uburyo bwo kwagura: Sisitemu zo gushyiramo ibikoresho zishingiye ku cyuma gifunga amazi zishyigikira uburyo bwo gupakira ibintu ku rwego rwa wafer (WLP) n'uburyo bwo gupakira ibintu ku rwego rwa panel (PLP), bigatuma umusaruro ukorwa ku bwinshi uhendutse.
Uburyo bworoshye bwo gukora: Ihuye n'ibikoresho bitandukanye (Si, GaAs, SiC, ikirahure, polymers), ihura n'ibikenewe bitandukanye byo guhuza.
Iyubahirizwa ry’ibidukikije: Bikuraho imyanda myinshi ihumanya ikirere nko gusimbuza amashanyarazi, bikurikije amahame ngenderwaho mu gukora ibintu bidafite ibidukikije.
Umwanzuro
Gusiga irangi ry’ibikoresho byo mu bwoko bwa vacuum byabaye inkingi ikomeye mu gupakira ibikoresho bya semiconductor bigezweho, bikemura ibibazo mu kurinda imbogamizi, gucunga ubushyuhe, no gukwirakwiza ubwiza bw’ibipimo by’ubushyuhe. Uko inganda zigenda zihinduka zigana ku guhuza ibintu bitandukanye, imiterere ya chiplet, no gukusanya 3D, icyifuzo cyo gushyiramo filime nto neza kizakomeza kwiyongera.
Binyuze mu guhanga udushya duhoraho muri PVD, ALD, na hybrid coating platforms, ibisubizo byo gusiga irangi mu buryo bwa vacuum ntabwo byongera ubwizerwe gusa ahubwo binafasha cyane ahazaza ho gupakira ibikoresho bya semiconductor.
—Iyi nkuru yasohotse naibikoresho byo gusiga irangi ry'umwukauruganda rwa Zhenhua Vacuum
Igihe cyo kohereza: 27 Nzeri 2025