Thaum cov khoom siv semiconductor txuas ntxiv mus txo qis thaum koom ua ke ntau yam kev ua haujlwm, cov thev naus laus zis ntim khoom ntsib teeb meem tsis tau muaj dua. Kev txheej txheej nqus tsev tau tshwm sim ua ib qho txheej txheem tseem ceeb hauv kev ntim khoom semiconductor siab heev, ua kom ntseeg tau tias cov khoom siv me me, kev ua haujlwm siab dua, thiab kev ntseeg tau ntev. Los ntawm kev siv cov txheej txheem engineering nyias-zaj duab xis xws li lub cev vapor deposition (PVD), tshuaj lom neeg vapor deposition (CVD), thiab atomic layer deposition (ALD), cov chaw tsim khoom tuaj yeem daws cov kev xav tau tseem ceeb rau kev tiv thaiv kev thaiv, kev ua haujlwm hluav taws xob, thiab kev tswj hwm thermal hauv cov chips tiam tom ntej.
Cov Teeb Meem Feem Ntau Hauv Kev Ntim Khoom Semiconductor
Cov khoom ntim semiconductortsis yog ib kauj ruam yooj yim los tiv thaiv lawm tab sis yog ib theem tseem ceeb uas yuav tsum tau ua kom tau zoo. Cov teeb meem feem ntau muaj xws li:
Cov dej noo thiab cov pa oxygen nkag mus
Cov khoom siv uas muab kaw rau hauv lub thawv muaj kev cuam tshuam heev rau qhov chaw ib puag ncig. Txawm tias cov dej noo me me lossis cov pa oxygen diffusion kuj tuaj yeem ua rau xeb, hlau tsiv teb tsaws chaw, lossis dielectric degradation.
Kev Txhim Kho Txheej Txheem
Cov polymer encapsulants feem ntau tsis muaj cov khoom thaiv txaus. Yog tsis muaj cov txheej txheej nyias nyias, cov chips yuav ua rau tsis muaj kev ntseeg siab hauv cov av noo siab lossis kub siab.
Kev sib txuas hluav taws xob thiab kev ruaj khov ntawm kev sib txuas
Cov hluav taws xob ntau hauv cov nodes siab heev ua rau electromigration sai dua. Kev nplaum tsis zoo lossis cov txheej tsis sib xws tuaj yeem ua rau lub neej ntawm kev sib txuas puas tsuaj.
Kev Txwv ntawm Kev Kub Ntxhov
Thaum lub zog ntawm cov khoom siv nce siab, cov txheej txheem tswj cua sov tsis txaus tuaj yeem ua rau muaj qhov kub thiab txias hauv zos, kev ua haujlwm poob qis, thiab lub neej ntawm cov khoom siv luv dua.
Kev Ua Kom Me Me Thiab Qhov Sib Piv Ntawm Qhov Sib Piv
Cov qauv ntim khoom siab heev xws li Through-Silicon Vias (TSVs) thiab Through-Glass Vias (TGVs) xav tau cov txheej txheem conformal hauv cov qhov sib piv siab thiab vias, uas tseem yog qhov tseem ceeb ntawm kev siv tshuab.
Cov Kev daws teeb meem txheej tshuab nqus tsev
1. Cov Tshuaj Pleev Xim Uas Tiv Thaiv Dej/Oxygen
Cov yeeb yaj kiab nyias nyias SiO₂, SiNₓ, thiab Al₂O₃ uas tau tso los ntawm PVD lossis ALD ua haujlwm ua cov txheej hermetic encapsulation, txo cov nqi kis dej pa (WVTR) ntau heev.
Cov txheej txheem thaiv ntau txheej uas sib xyaw ua ke cov txheej inorganic thiab hybrid ua tiav kev ntseeg siab zoo dua, tseem ceeb rau RF modules thiab MEMS ntim khoom.
2. Cov Txheej Txheem Txhawb Kev Sib Txuas thiab Cov Txheej Txheem Sib Txuas
Cov txheej nplaum Ti, Cr, lossis TiN ua rau lub zog sib txuas ntawm cov txheej metallization thiab dielectrics txhim kho, tiv thaiv kev tawg thaum lub sijhawm thermal cycling.
Kev kho mob ntawm cov ntshav hauv cov ntshav ua rau kom cov dej ntub thiab cov zaj duab xis nucleation ntawm cov substrates uas muaj zog tsawg.
3. Cov Txheej Txheem Tiv Thaiv Kev Sib Kis thiab Kev Tawm Tsam Hluav Taws Xob
Cov txheej txheem thaiv Ta, TaN, thiab Ru uas tau tso los ntawm magnetron sputtering ua haujlwm ua cov teeb meem diffusion zoo hauv Cu interconnects.
Cov khaubncaws sab nraud povtseg no txo qhov kev sib txuas ntawm hluav taws xob, khaws cia kev sib txuas conductivity nyob rau hauv kev ntxhov siab tam sim no.
4. Cov Txheej Txheem Tswj Xyuas Kub
Cov txheej txheem thermal conductivity siab xws li cov pa roj carbon zoo li pob zeb diamond (DLC) lossis AlN zaj duab xis txhim kho kev tso cua sov.
Cov txheej txheem tshwj xeeb ua rau muaj kev sib koom ua ke rau hauv cov modules semiconductor fais fab, SiC / GaN cov khoom siv, thiab cov chips computing ua tau zoo (HPC).
5. Cov Txheej Txheem Conformal rau Cov Qauv High Aspect Ratio
ALD muab kev tswj hwm theem atomic, ua kom ntseeg tau tias cov yeeb yaj kiab conformal thiab pinhole tsis muaj qhov hauv TSVs thiab TGVs nrog cov piv ntawm cov duab tshaj 10: 1.
Qhov no yog qhov tseem ceeb rau 3D IC ntim khoom, qhov twg qhov sib txuas ceev thiab kev ntseeg tau ncaj qha cuam tshuam rau cov txiaj ntsig.
Cov Ntawv Thov Rau Cov Neeg Mob
MEMS Ntim Khoom: Kev ntim cov zaj duab xis nyias nrog Al₂O₃/SiNₓ stacks txhim kho hermeticity, ntev lub neej ntawm cov khoom siv hauv tsheb thiab kev lag luam.
RF Front-End Modules: Cov txheej txheem thaiv ntau txheej txo cov peev xwm parasitic thiab cov dej noo ua rau muaj kev ua haujlwm tsis zoo.
Cov Khoom Siv Hluav Taws Xob: Cov txheej txheem thermal spreader DLC txhim kho kev tso cua sov hauv SiC-based MOSFETs, ua rau muaj kev ua haujlwm zoo dua.
3D Kev Sib Koom Tes: Cov txheej txheem ALD conformal hauv TSV / TGV ua kom ntseeg tau los ntawm kev rwb thaiv tsev thiab metallization rau cov khoom siv nco bandwidth siab (HBM).
Cov txiaj ntsig ntawm Kev Txheej Txheem Nqus Tsev hauv Kev Ntim Khoom
Kev Ntseeg Siab: Kev thaiv zoo tshaj plaws thiab kev ua kom zoo nkauj ua kom ruaj khov rau lub sijhawm ntev.
Kev Loj Hlob Tau: Cov txheej txheem tso cov khoom siv hauv lub tshuab nqus tsev txhawb nqa wafer-level packaging (WLP) thiab panel-level packaging (PLP), ua rau muaj kev tsim khoom ntau thiab pheej yig.
Kev Yooj Yim ntawm Cov Txheej Txheem: Sib xws nrog ntau yam khoom siv (Si, GaAs, SiC, iav, polymers), ua tau raws li qhov xav tau sib xyaw ua ke.
Kev Ua Raws Cai Ib Puag Ncig: Tshem tawm cov txheej txheem ntub dej uas muaj kuab paug ntau xws li electroplating, ua raws li cov qauv tsim khoom ntsuab.
Xaus lus
Kev txheej txheej nqus tsev tau dhau los ua lub hauv paus tseem ceeb ntawm kev ntim khoom semiconductor siab heev, daws cov teeb meem hauv kev tiv thaiv kev thaiv, kev tswj cua sov, thiab kev npog qhov sib piv siab. Thaum kev lag luam hloov mus rau kev sib koom ua ke sib txawv, cov qauv chiplet, thiab 3D stacking, qhov kev thov rau kev tso cov zaj duab xis nyias nyias yuav tsuas yog nce ntxiv.
Los ntawm kev tsim kho tshiab tas mus li hauv PVD, ALD, thiab cov platform txheej hybrid, cov kev daws teeb meem nqus tsev tsis yog tsuas yog txhim kho kev ntseeg siab xwb tab sis kuj ua rau yav tom ntej ntawm kev ntim khoom semiconductor ua haujlwm tau zoo.
— Tsab xov xwm no tau luam tawm los ntawmcov khoom siv nqus tsev txheejChaw tsim khoom Zhenhua Lub Tshuab Nqus Tsev
Lub sijhawm tshaj tawm: Cuaj hlis-27-2025