Pamene zipangizo zamagetsi zamagetsi zamagetsi zikupitirira kuchepa pamene zikuphatikiza ntchito zambiri, ukadaulo wopaka ma CD ukukumana ndi mavuto osaneneka. Kupaka vacuum kwakhala njira yofunika kwambiri yopezera ma CD apamwamba a zamagetsi zamagetsi zamagetsi, kuonetsetsa kuti zipangizozo zimakhala zochepa, zimagwira ntchito bwino, komanso zimakhala zodalirika kwa nthawi yayitali. Pogwiritsa ntchito njira zamakono zopangira mafilimu monga physical vapor deposition (PVD), chemical vapor deposition (CVD), ndi atomic layer deposition (ALD), opanga amatha kuthana ndi zofunikira zofunika kwambiri zotetezera zotchinga, magwiridwe antchito amagetsi, komanso kuyang'anira kutentha kwa ma chips a m'badwo wotsatira.
Mavuto Ofala mu Kupaka Semiconductor
Kupaka kwa semiconductorSilinso gawo losavuta loteteza koma gawo lofunika kwambiri pakuchita bwino. Mavuto ambiri ndi awa:
Kulowa kwa Chinyezi ndi Mpweya wa Oxygen
Zipangizo zotsekedwa zimakhala zovuta kwambiri kukhudzana ndi chilengedwe. Ngakhale kuchuluka kwa chinyezi kapena kufalikira kwa mpweya kungayambitse dzimbiri, kusamuka kwa zitsulo, kapena kuwonongeka kwa dielectric.
Kudalirika kwa Zitsulo Zotchinga
Ma polima okhazikika nthawi zambiri amakhala ndi zotchinga zosakwanira. Popanda zokutira zolimba zopyapyala, ma chips amatha kulephera kudalirika m'malo omwe ali ndi chinyezi chambiri kapena kutentha kwambiri.
Kusamuka kwa Ma Electro ndi Kukhazikika kwa Ma Connection
Kuchulukana kwa mphamvu yamagetsi m'ma node apamwamba kumathandizira kusuntha kwa magetsi. Kusagwirizana bwino kapena zophimba zosafanana zimatha kuwononga nthawi yonse yolumikizirana.
Zolepheretsa Kutaya kwa Kutentha
Pamene mphamvu ya chipangizo ikukwera, kusakhala ndi zophimba zokwanira zosamalira kutentha kungayambitse malo otenthetsera, kuchepa kwa magwiridwe antchito, komanso kufupikitsa nthawi ya moyo wa chipangizocho.
Kuchepetsa Kuchuluka kwa Zinthu ndi Kuchuluka kwa Mawonekedwe
Mapangidwe apamwamba a ma CD monga Through-Silicon Vias (TSVs) ndi Through-Glass Vias (TGVs) amafuna zophimba zobisika mkati mwa ngalande ndi ma vias okhala ndi chiŵerengero chapamwamba, zomwe zimakhalabe vuto lalikulu laukadaulo.
Mayankho Ophimba Zotsukira
1. Zophimba Zotchinga Chinyezi/Oxygen
Mafilimu opyapyala a SiO₂, SiNₓ, ndi Al₂O₃ omwe amaikidwa kudzera mu PVD kapena ALD amagwira ntchito ngati zigawo zozungulira mpweya, zomwe zimachepetsa kwambiri kuchuluka kwa nthunzi ya madzi (WVTR).
Ma multilayer barrier stacks ophatikiza inorganic ndi hybrid layers amakhala odalirika kwambiri, ofunikira kwambiri pa ma RF modules ndi ma MEMS packaging.
2. Kulimbikitsa Kumatira ndi Ma Interface Layers
Zigawo zomatira za Ti, Cr, kapena TiN zimawonjezera mphamvu yolumikizana pakati pa zigawo za metallization ndi dielectrics, zomwe zimaletsa delamination panthawi ya kutentha.
Kuchiza pamwamba pa plasma kumawonjezera kunyowa ndi kufalikira kwa filimu pa zinthu zopanda mphamvu zambiri.
3. Kufalikira ndi Kusamutsa Ma Electromigration Layers
Zigawo zotchinga za Ta, TaN, ndi Ru zomwe zimayikidwa kudzera mu magnetron sputtering zimakhala ngati zotchinga zofalitsa bwino mu Cu interconnects.
Zigawo zimenezi zimachepetsa kusuntha kwa magetsi, kusunga mphamvu yolumikizirana pakati pa mphamvu yamagetsi yapamwamba.
4. Zophimba Zosamalira Kutentha
Zophimba zotentha kwambiri monga diamond-like carbon (DLC) kapena mafilimu a AlN zimathandizira kutayika kwa kutentha.
Zophimba zopangidwa mwaluso zimathandiza kuti zigwirizane ndi ma module a semiconductor amphamvu, zida za SiC/GaN, ndi ma chips a high-performance computing (HPC).
5. Zophimba Zogwirizana ndi Maonekedwe Abwino Kwambiri
ALD imapereka mphamvu yowongolera mulingo wa atomiki, kuonetsetsa kuti mafilimu opanda ma pinhole ndi ma pinhole mu ma TSV ndi ma TGV okhala ndi ma aspect ratios opitilira 10:1.
Izi ndizofunikira kwambiri pa ma CD a 3D IC, pomwe kuchulukana kwa ma connection ndi kudalirika kumakhudza mwachindunji phindu.
Kugwiritsa Ntchito Milandu
Kupaka MEMS: Kuphimba kwa filimu yopyapyala yokhala ndi ma Al₂O₃/SiNₓ kumawonjezera kuuma kwa chipangizocho, ndikuwonjezera moyo wa chipangizocho m'malo ogwirira ntchito zamagalimoto ndi mafakitale.
Ma RF Front-End Modules: Zophimba zotchinga zambiri zimachepetsa mphamvu ya parasitic komanso kusuntha kwa magwiridwe antchito komwe kumachitika chifukwa cha chinyezi.
Zamagetsi Zamagetsi: Zophimba za DLC zotenthetsera zimathandizira kutayika kwa kutentha mu ma MOSFET okhala ndi SiC, zomwe zimapangitsa kuti ntchito ikhale yogwira ntchito bwino kwambiri.
Kuphatikiza kwa 3D: Zophimba za ALD zomwe zili mu TSV/TGV zimatsimikizira kuti ndi zodalirika kudzera mu insulation ndi metallization ya zida zosungiramo zinthu zambiri (HBM).
Ubwino wa Kuphimba Vacuum mu Kupaka
Kudalirika Kwambiri: Chotchinga chapamwamba komanso magwiridwe antchito omatira amatsimikizira kukhazikika kwa chipangizocho kwa nthawi yayitali.
Kukula: Makina osungira zinthu pogwiritsa ntchito vacuum amathandizira kulongedza zinthu mopanda waya (WLP) ndi kulongedza zinthu mopanda mapanelo (PLP), zomwe zimathandiza kupanga zinthu zambiri mopanda mtengo.
Kusinthasintha kwa Njira: Kugwirizana ndi zipangizo zosiyanasiyana (Si, GaAs, SiC, galasi, ma polima), kukwaniritsa zosowa zosiyanasiyana zophatikizana.
Kutsatira Malamulo Okhudza Zachilengedwe: Kumachotsa njira zonyowa zomwe zimawononga kwambiri monga kuyika ma electroplating, mogwirizana ndi miyezo yopangira zinthu zachilengedwe.
Mapeto
Kupaka vacuum kwakhala maziko a ma CD apamwamba a semiconductor, kuthana ndi mavuto okhudzana ndi chitetezo cha zotchinga, kasamalidwe ka kutentha, komanso kuphimba kwa chiŵerengero chapamwamba. Pamene makampani akusintha kupita ku kuphatikizana kosiyanasiyana, mapangidwe a chiplet, ndi 3D stacking, kufunikira kwa kuyika filimu yopyapyala molondola kudzawonjezeka.
Kudzera mu luso lopitilira mu PVD, ALD, ndi nsanja zophikira zosakanikirana, njira zophikira zotsukira vacuum sizimangowonjezera kudalirika komanso zimathandiza tsogolo la ma phukusi a semiconductor.
—Nkhaniyi yafalitsidwa ndizida zophikira zotsukirawopanga Zhenhua Vacuum
Nthawi yotumizira: Sep-27-2025