Njengoba amadivayisi e-semiconductor eqhubeka nokwehla ngenkathi ehlanganisa imisebenzi eminingi, ubuchwepheshe bokupakisha bubhekene nezinselele ezingakaze zibonwe. Ukufakwa kwe-vacuum coating kuvele njengenqubo eyinhloko evumela ukufakwa kwe-semiconductor okuthuthukisiwe, okuqinisekisa ukwenziwa kwedivayisi kube kuncane, ukusebenza okuphezulu, kanye nokuthembeka kwesikhathi eside. Ngokusebenzisa amasu obunjiniyela be-thin-film njengokufakwa kwe-physical vapor (PVD), ukufakwa kwe-chemical vapor (CVD), kanye nokufakwa kwe-atomic layer (ALD), abakhiqizi bangabhekana nezidingo ezibalulekile zokuvikelwa kwezithiyo, ukusebenza kukagesi, kanye nokuphathwa kokushisa kuma-chips esizukulwane esilandelayo.
Izinselele Ezivamile Ekupakisheni Kwe-Semiconductor
Ukupakishwa kwe-semiconductorakuseyona isinyathelo esilula sokuvikela kodwa kuyisigaba esibalulekile ekusebenzeni. Izinselele ezivamile zifaka:
Ukungena Komswakama Nomoya-mpilo
Amadivayisi afakwe ngaphakathi azwela kakhulu ekuchayekeni kwemvelo. Ngisho namazinga amancane omswakama noma ukusabalala komoya-mpilo kungaholela ekugqwaleni, ekufudukeni kwensimbi, noma ekuwohlokeni kwe-dielectric.
Ukuthembeka Kwesendlalelo Sesithiyo
Ama-polymer encapsulants avamile avame ukubonisa izakhiwo ezinganele zokuvimbela. Ngaphandle kwezembozo eziqinile zefilimu encane, ama-chips avame ukwehluleka ukuthembeka ezimweni ezinomswakama ophezulu noma ezimweni zokushisa okuphezulu.
Ukufuduka kwe-Electro kanye nokuZinza kokuxhumana
Ubuningi bamandla aphezulu kuma-node athuthukile kusheshisa ukufuduka kwe-electro. Ukunamathela okungekuhle noma ukumbozwa okungafanele kungalimaza impilo yokuxhumana.
Ukulinganiselwa Kokushabalalisa Ukushisa
Njengoba ubuningi bamandla edivayisi bukhuphuka, ukugqokwa okunganele kokuphathwa kokushisa kungaholela ezindaweni ezishisayo zasendaweni, ukwehla kokusebenza, kanye nokunciphisa isikhathi sokuphila kwedivayisi.
Ukuhlanganiswa kwe-Miniaturization kanye ne-Aspect Ratio
Izakhiwo zokupakisha ezithuthukisiwe njenge-Through-Silicon Vias (TSVs) kanye ne-Through-Glass Vias (TGVs) zidinga ukumbozwa okuvumelanayo ngaphakathi kwemisele nama-via anesilinganiso esiphakeme, okuhlala kuyisithiyo esibalulekile sobuchwepheshe.
Izixazululo Zokumboza Nge-Vacuum
1. Izimbozo Zokuvinjelwa Komswakama/Umoya-mpilo
Amafilimu amancane e-SiO₂, SiNₓ, kanye ne-Al₂O₃ afakwe nge-PVD noma i-ALD asebenza njengezendlalelo zokufaka i-hermetic encapsulation, anciphisa kakhulu amazinga okudluliselwa komphunga wamanzi (i-WVTR).
Izinqwaba zezithiyo ezinezingqimba eziningi ezihlanganisa izingqimba ezingaphili kanye nezihlanganisiwe zifinyelela ukuthembeka okuphezulu, okubaluleke kakhulu kumamojula e-RF kanye nokupakishwa kwe-MEMS.
2. Izingqimba Zokukhuthaza Ukunamathela kanye Nezingqimba Zokuxhumana
Izendlalelo zokunamathela ze-Ti, Cr, noma i-TiN zithuthukisa amandla okubopha phakathi kwezendlalelo ze-metallization kanye ne-dielectrics, zivimbela ukuhlukaniswa ngesikhathi sokujikeleza kokushisa.
Ukwelashwa kobuso be-plasma kuthuthukisa kakhulu ukumanzisa kanye nokwakheka kwefilimu ezindaweni ezingaphansi kwamandla aphansi.
3. Izingqimba Zokucindezela Ukusabalalisa Nokufuduka Kwama-Electromigration
Izingqimba zesithiyo se-Ta, i-TaN, kanye ne-Ru ezifakwe nge-magnetron sputtering zisebenza njengezithiyo zokusabalalisa ezisebenzayo kuma-Cu interconnect.
Lezi zendlalelo zinciphisa ukufuduka kwe-electro, zilondoloze ukuhanjiswa kwe-interconnect ngaphansi kokucindezeleka okuphezulu kwamanje.
4. Izimbozo Zokuphathwa Kokushisa
Izimbozo zokushisa eziphezulu ezifana ne-carbon efana nedayimane (i-DLC) noma amafilimu e-AlN zithuthukisa ukushabalaliswa kokushisa.
Izembozo ezilungiselelwe zivumela ukuhlanganiswa kumamojula we-power semiconductor, amadivayisi e-SiC/GaN, kanye nama-chip e-high-performance computing (HPC).
5. Izimbozo Ezivumelanayo Zezakhiwo Ezinesilinganiso Esiphezulu
I-ALD inikeza ukulawula kwezinga le-athomu, iqinisekisa amafilimu angenazo izimbobo eziqondile kuma-TSV nama-TGV anezilinganiso zesici ezidlula u-10:1.
Lokhu kubalulekile ekupakisheni kwe-3D IC, lapho ubuningi bokuxhumana kanye nokuthembeka kuthinta ngqo isivuno.
Izicelo Zecala
Ukupakishwa kwe-MEMS: Ukumbozwa kwefilimu encane enezitaki ze-Al₂O₃/SiNₓ kuthuthukisa ukuqina komoya, kwandise isikhathi sokuphila kwedivayisi ezindaweni zezimoto nezimboni.
Amamojula E-RF Front-End: Izimbozo zokuvimbela ezinezingqimba eziningi zinciphisa amandla ezinambuzane kanye nokugeleza kokusebenza okubangelwa umswakama.
Amandla E-elekthronikhi: Izimbozo ze-DLC zokusakaza ukushisa zithuthukisa ukushabalaliswa kokushisa kuma-MOSFET asekelwe ku-SiC, okwenza kube nokusebenza kahle okuphezulu.
Ukuhlanganiswa kwe-3D: Ukwembozwa kwe-ALD okuvumelanayo ku-TSV/TGV kuqinisekisa ukuthembeka ngokufakwa kokushisa kanye nokwenza insimbi kumadivayisi enkumbulo ye-bandwidth ephezulu (i-HBM).
Izinzuzo Zokumboza Nge-Vacuum Ekupakisheni
Ukuthembeka Okuphezulu: Isithiyo esiphezulu kanye nokusebenza kokunamathela kuqinisekisa ukuzinza kwedivayisi isikhathi eside.
Ukusabalala: Izinhlelo zokufaka ezisekelwe ku-vacuum zisekela ukupakishwa kwezinga le-wafer (i-WLP) kanye nokupakishwa kwezinga lephaneli (i-PLP), okuvumela ukukhiqizwa kwesisindo okungabizi kakhulu.
Ukuguquguquka Kwenqubo: Iyahambisana nezinto ezahlukahlukene (i-Si, i-GaAs, i-SiC, ingilazi, ama-polymer), ihlangabezana nezidingo zokuhlanganiswa ezingafani.
Ukuthobela Imvelo: Kuqeda izinqubo ezimanzi ezingcolisa kakhulu njengokufaka i-electroplating, okuhambisana nezindinganiso zokukhiqiza eziluhlaza.
Isiphetho
Ukugqoka nge-vacuum sekuyinto ebalulekile ekupakisheni kwe-semiconductor okuthuthukisiwe, okubhekana nezinselele ekuvikelweni kwezithiyo, ukuphathwa kokushisa, kanye nokumbozwa kwesilinganiso esiphezulu. Njengoba imboni ishintshela ekuhlanganisweni okungafani, ukwakheka kwe-chiplet, kanye nokufakwa kwe-3D, isidingo sokufakwa kwefilimu encane ngokunemba sizokhula kakhulu.
Ngokusebenzisa izinto ezintsha eziqhubekayo kumapulatifomu okuhlanganisa i-PVD, i-ALD, kanye ne-hybrid coating, izixazululo zokuhlanganisa i-vacuum azigcini nje ngokuthuthukisa ukuthembeka kodwa futhi zivumela ngenkuthalo ikusasa lokupakisha kwe-semiconductor.
—Lesi sihloko sishicilelwe nguimishini yokumboza nge-vacuumumenzi we-Zhenhua Vacuum
Isikhathi sokuthunyelwe: Septhemba-27-2025