IiVaristors, iithermistors, kunye nee-ceramic capacitors zisetyenziswa kakhulu kwizixhobo zasekhaya, kwii-elektroniki zabathengi, kwizixhobo zamandla, kwizithuthi zamandla amatsha, kwizixhobo zonxibelelwano, nakwiinkqubo zolawulo lwemizi-mveliso, apho ngokuyintloko zenza imisebenzi efana nokukhusela iisekethe, ukuqonda ubushushu, ukugcina amandla, kunye nokucoca.
Iimpawu zokusebenza kweeseramikhi ze-elektroniki zixhomekeke kakhulu kwiifomyula zazo zezinto, iinkqubo zokusebenzisa idoping, kunye neenkqubo zokusila. Iiseramikhi ze-Zinc oxide (ZnO) zibonisa iimpawu ze-varistor kwaye ke ngoko zisetyenziswa ekwenziweni kwee-varistor, apho zijika khona i-surge current xa kwenzeka i-transient overvoltage. Ezinye iiseramikhi ze-oxide kunye nezinto ezisekwe kwi-barium titanate zingasetyenziselwa ukwenza ii-thermistors, ngelixa iiseramikhi ze-dielectric ezifana ne-barium titanate kunye ne-calcium titanate zisetyenziswa kakhulu kwi-ceramic capacitors.
Nangona ezi zinto zifumana iipropati zazo ze-varistor, i-thermistor, okanye i-dielectric emva kokwenziwa nokutshiswa, zihlala zisebenza njengemizimba ye-ceramic kwaye azikakwazi ukudityaniswa ngokuthe ngqo kwiisekethe zombane. Ukuze zibe zizinto ze-elektroniki ezinokufakelwa kwiibhodi zesekethe eziprintiweyo, ii-electrode zesilivere kufuneka zenziwe kwiindawo zazo eziphezulu nezisezantsi. Ke ngoko, ukwenziwa kwee-electrode zesilivere yinkqubo ebalulekileyo ekuvelisweni kwezixhobo ze-ceramic ze-elektroniki.
1. Kutheni iiCeramics ze-elektroniki zifuna iSilver Electrode Coating?
Ukugqunywa kwe-electrode yesilivere kwiiseramikhi ze-elektroniki kubandakanya ukwenza ii-electrode eziqhubayo kwiindawo eziphezulu nezisezantsi ze-ceramic substrate, ezibonelela nge-metallic interface eqinileyo yokusetyenziswa kwe-voltage, i-current conduction, kunye ne-lead attachment. Emva kokwenziwa kwe-electrode, imizimba yeseramikhi idla ngokuvavanywa nge-lead bonding, encapsulation, kunye novavanyo lombane ngaphambi kokuba idityaniswe kwii-varistors ezigqityiweyo, ii-thermistors, okanye ii-capacitors zeseramikhi.
Ii-electrode ze-ceramic ze-elektroniki zihlala zisebenzisa isakhiwo se-metallization esinee-multilayer. I-Ti okanye i-NiCr ingasetyenziswa njengomaleko wokuncamathelisa ukuphucula ukubopha phakathi kwe-coating kunye ne-ceramic substrate, ngelixa i-Cu okanye i-Ag inokubekwa njengomaleko ophezulu wokuhambisa umbane ukuhlangabezana neemfuno zokuqhuba umbane kunye nokudityaniswa kwe-solder.
Kwizicelo ezininzi, kuphela iindawo eziphezulu nezisezantsi ze-ceramic ye-elektroniki ezifakwe isinyithi, ngelixa iindawo ezisecaleni kufuneka zihlale zigqunywe ngombane. Ubukhulu befilimu obungalinganiyo, imingxunya ye-pinhole, okanye ukushiyeka kwe-coating yendawo kunokubangela ukumelana okungazinziyo koqhagamshelwano, ukungaguquguquki kwe-solder, kunye nokuphambuka kokusebenza kombane. Ukufakwa kwe-coating kwiindawo ezisecaleni kunokudibanisa ii-electrode eziphezulu nezisezantsi ngombane, ngelixa amandla okunamathela anganeleyo anokukhokelela ekuqhekekeni kwefilimu. Ke ngoko, i-coating ye-electrode yesilivere yee-ceramics ze-elektroniki kufuneka ifezekise ulungelelwano phakathi kokufana kwefilimu, uxinano lwefilimu, amandla okunamathela, kunye nolawulo oluchanekileyo lwendawo yokufaka.
2. Iingxaki zeMpahla kunye neNdleko zeNkqubo zokwenziwa kweSilivere yesiqhelo
Ezinye iimveliso ze-ceramic ze-elektroniki zisebenzisa ukuprintwa kwesikrini se-silver paste kulandele ukutshayelwa, okanye i-wet chemical silver plating, ukwenza ii-electrode zesilivere. Ubukhulu obuqhelekileyo besilivere bumalunga ne-20 μm, nangona ubukhulu bokwenyani bumiselwa ziimfuno ezithile zemveliso kunye nenkqubo. Ukuprintwa kunye nokutshayelwa kwesikrini se-silver paste ngokubanzi kubandakanya ukucocwa komphezulu, ukuprintwa kwesikrini, ukulinganisa kunye nokomisa, ukutshisa, kunye nokuhlolwa. Ukutshayelwa kwesilivere yekhemikhali emanzi kudla ngokuquka unyango lwangaphambi kwexesha, ukuziva kunye nokusebenza, ukutshayelwa kwesilivere yekhemikhali, ukuhlamba, ukomisa, kunye nokuhlola.
Ukususela ngo-2026, amaxabiso esilivere anyuke kakhulu kwaye ahlala ekwizinga eliphezulu, nto leyo eyandisa ngakumbi impembelelo yeendleko zezinto zesilivere kwimveliso ye-electrode ye-ceramic ye-elektroniki. Iileya zesilivere ezixineneyo eziveliswa kukuprintwa kwesilivere kunye nokudubula okanye iinkqubo zesilivere ezimanzi zinokubangela ukusetyenziswa kwesilivere okukhulu. Kwimveliso ephezulu, oku kwandisa ngokuthe ngqo iindleko zezinto ngecandelo ngalinye.
Ukongeza, amanqanaba okomisa kunye nokutshisa okushisa okuphezulu afunekayo ekuprintweni kwepeyinti yesilivere, kunye namanqanaba onyango lwangaphambi kokunyanga, ukwazisa kunye nokusebenza, ukuhlamba, kunye nokomisa abandakanyeka ekufakeni isilivere emanzi, kunyusa ngakumbi ukusetyenziswa kwamandla, ixesha lokuqhuba imveliso, kunye neendleko zokulawula inkqubo.
3. Ukucoca ngeVacuum Magnetron ukuze kulinganiswe ukusebenza kweFilimu kunye noLawulo lweendleko
Ukutshiza nge-vacuum magnetron yinkqubo ye-PVD apho amasuntswana anamandla aphezulu aqhumisa ithagethi yesinyithi phantsi kwe-vacuum, nto leyo ebangela ukuba iiathom ekujoliswe kuzo zitshizeke zize zibekwe phezu komphezulu we-ceramic ukuze zenze ifilimu yesinyithi efanayo nexineneyo.
Ngokweemfuno ezithile zemveliso, i-electrode inokwamkela isakhiwo esineengqimba ezininzi esiqulathe umaleko wokuncamathelisa we-Ti okanye i-NiCr odityaniswe nomaleko oqhuba i-Cu okanye i-Ag, kunye nobukhulu befilimu iyonke obulawulwa malunga ne-6–7 μm. Xa kuthelekiswa nobukhulu besilivere obuqhelekileyo obumalunga ne-20 μm, le ndlela inokunciphisa ubukhulu besilivere obungeyomfuneko kunye nokusetyenziswa kwesinyithi esixabisekileyo, ngaloo ndlela inciphise iindleko zezinto kwimveliso ephezulu.
Inkqubo yokugquma i-vacuum inokwenziwa lula ekucoceni nasekulayisheni, ekubekeni i-vacuum, nasekuhloleni, ukunciphisa amanqanaba enkqubo afana nokutsha kwe-binder, ukutshisa ngobushushu obuphezulu, kunye nonyango oluninzi lweekhemikhali ezimanzi. Idityaniswe nolawulo oluchanekileyo lobukhulu befilimu kunye nezixhobo zokufihla ezizinikeleyo, le nkqubo inokuphucula ukuhambelana kweefilimu ezifakwe kwiindawo eziphezulu nezisezantsi ngelixa igcina iindawo ezisecaleni zigqunywe ngombane.
4. Isisombululo sesilivere se-Zhenhua Vacuum se-Metallization se-Electronic Ceramics
Umgca wemveliso yesilivere yesilivere ye-ceramic ye-Zhenhua Vacuum ungalungiselelwa nge-Ti, NiCr, Cu, Ag, kunye nezinye izinto zokugquma ngokweemfuno zenkqubo yomthengi. Iileya ezininzi zesinyithi zinokufakwa kwiindawo eziphezulu nezisezantsi zezinto ze-ceramic ngaphakathi komjikelo ofanayo we-vacuum, ukubonelela ngesisombululo se-vacuum coating esiphezulu se-electrode metallization ye-varistors, i-thermistors, ii-capacitors ze-ceramic, kunye nezinye izinto ze-ceramic ze-elektroniki.
Iingenelo zezixhobo
1. Iteknoloji yeNkqubo ePhambili
Le nkqubo isebenzisa iteknoloji yokutshiza i-vacuum magnetron ukuze kwenziwe i-electrode ye-ceramic metallization nge-elektroniki. Iitekhnoloji ezinxulumene nayo zikhuselwe ziipatenti zokuvelisa ezizimeleyo, ezivumela ukufakwa kwe-electrode ngokuchanekileyo kunye nokuphuculwa kokuhambelana kwe-batch-to-batch.
2. Iingenelo zokusebenza kunye neendleko
Ngoyilo lwefilimu olunemigangatho emininzi kunye nolawulo oluchanekileyo lobukhulu befilimu, le nkqubo inokuhlangabezana neemfuno zamandla okunamathela, ukuhanjiswa kombane, kunye nokukwazi ukunyibilikisa ngelixa kunciphisa ukusetyenziswa kwesilivere kunye nokwenza lula amanyathelo okuvelisa, ngaloo ndlela kunciphisa iindleko zokuvelisa kwimveliso ephezulu.
3. Amava amaninzi obunjineli
Ngamava angaphezu kweminyaka engama-30 kushishino lokugquma i-vacuum coating, i-Zhenhua Vacuum iseke iilabhoratri zeenkqubo zobungcali kunye namaqela obunjineli anakho ukubonelela ngenkxaso yobugcisa kuyo yonke inkqubo, ukusuka kuphuhliso lwenkqubo kunye nokuqinisekiswa kwesampuli ukuya kwimveliso yovavanyo kunye nemveliso enkulu.
4. Izisombululo ezenzelwe wena kunye nokugcinwa kwemfihlo
Izixhobo kunye nezisombululo zenkqubo zingenziwa ngokwezifiso ngokweemfuno zemveliso yomthengi, amandla emveliso, kunye neemfuno zokugquma ezinee-multilayer. I-Zhenhua Vacuum ikwagcina ukhuseleko oluqinileyo lwepropathi yobukrelekrele yomthengi kunye namaxwebhu obuchwephesha.
Izicelo
Ezi zixhobo zinokufaka i-Ti, i-NiCr, i-Cu, i-Ag, kunye nezinye iifilimu zesinyithi, nto leyo eyenza ukuba zifaneleke kwi-electrode metallization yezinto ze-ceramic ze-elektroniki ezifana ne-varistors, ii-thermistors, kunye nee-ceramic capacitors. Le teknoloji inokwandiswa nakwizicelo eziquka ii-ceramic substrates kunye neepakeji ze-ceramic LED.
5. Isiphelo
Ngokuchasene namaxabiso esilivere ahlala ephezulu kunye neemfuno ezingqongqo zokuhambelana nokuthembeka ekwenzeni izinto ze-elektroniki, i-vacuum magnetron sputtering ibonelela ngesisombululo esisebenzayo se-metalization kwiiseramikhi ze-elektroniki. Ngenxa yeenzuzo zayo zokunciphisa ubukhulu befilimu, ukubekwa okufanayo, kunye nolawulo oluchanekileyo lobukhulu, le nkqubo inika indlela esebenzayo yokulinganisela ukusebenza kwe-coating, ukusebenza kakuhle kwemveliso, kunye neendleko zezinto.
I-Zhenhua Vacuum iza kuqhubeka nokwenza ngcono izixhobo, iinkqubo zokugquma, kunye neenkqubo zokuzenzekelayo ezihambelana neemfuno ze-electronic ceramic silver metallization, inika abathengi inkxaso yobugcisa kulo lonke umjikelo wemveliso, ukusuka ekuqinisekisweni kwe-R&D kunye nemveliso yovavanyo ukuya kwimveliso enkulu.
-Eli nqaku lipapashwe ngu umenzi wezixhobo zokugquma nge-vacuum I-Zhenhua Vacuum
Ixesha lokuthumela: Agasti-14-2026