Factory directly Plasma Sputtering Machine - Horizontal double-sided semiconductor coating production line – Zhenhua
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PRODUCT DESCRIPTION
The coating line adopts modular structure, which can increase the chamber according to the process and efficiency requirements, and can be coated on both sides, which is flexible and convenient. Equipped with ion cleaning system, rapid heating system and DC magnetron sputtering system, it can efficiently deposit simple metal coating. The equipment has fast beat, convenient clamping and high efficiency.
The coating line is equipped with ion cleaning and high-temperature baking system, so the adhesion of the deposited film is better. The small angle sputtering with rotating target is favorable for the deposition of film on the inner surface of small aperture.
1. The equipment has compact structure and small floor area.
2. The vacuum system is equipped with molecular pump for air extraction, with low energy consumption.
3. Automatic return of material rack saves manpower.
4. The process parameters can be traced, and the production process can be monitored in the whole process to facilitate the tracking of production defects.
5. The coating line has a high degree of automation. It can be used with the manipulator to connect the front and rear processes and reduce the labor cost.
It can replace silver paste printing in capacitor manufacturing process, with higher efficiency and lower cost.
It is applicable to Ti, Cu, Al, Cr, Ni, Ag, Sn and other simple metals. It has been widely used in semiconductor electronic components, such as ceramic substrates, ceramic capacitors, led ceramic supports, etc.
PRODUCT FEATURE
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