Entuthukweni yezobuchwepheshe ekhula njalo, ukuhwamuka kokushisa sekuyindlela ebalulekile ezimbonini ezahlukahlukene. Inqubo ivamise ukusetshenziswa emikhakheni efana ne-electronics kanye nesayensi yezinto zokwakha ukufaka amafilimu amancanyana kuma-substrates ahlukene. Kulokhu okuthunyelwe kwebhulogi, sizocubungula izinzuzo nezingozi zokuhwamuka kokushisa, sicacise izici zako ezibalulekile, futhi sinikeze ukuhlaziya okuphelele kwezinzuzo zakho kanye nokubi.
Izinzuzo zokuhwamuka kwe-thermal:
1. Ukuhlukahluka: Enye yezinzuzo ezibalulekile zokuhwamuka kokushisa ukuguquguquka kwawo ekukhetheni izinto. Inqubo ingafaka izinhlobonhlobo zezinto zokwakha, kufaka phakathi izinsimbi, ama-alloys, ngisho nezinto eziphilayo. Ngakho-ke, ithola izinhlelo zokusebenza ezimbonini ezahlukahlukene ezihlanganisa ukukhiqizwa kwe-semiconductor kanye nama-optical coatings.
2. Imali engabizi kakhulu: Ukuhwamuka kwe-thermal kuyabiza, ikakhulukazi uma kuqhathaniswa nezinye izindlela zokubeka ezifana ne-sputtering noma i-chemical vapor deposition (CVD). Ubulula bayo kanye nokusebenziseka kalula kusiza ukunciphisa izindleko zemishini, kuyenze ibe inketho ekhangayo yokukhiqiza okuncane noma izinjongo zocwaningo.
3. Izinga eliphezulu lokubeka: Enye inzuzo yokuhwamuka kokushisa ukuthi yenza amazinga aphezulu okubekwa. Lokhu kuvumela abakhiqizi ukuthi bagqoke izindawo ezinkulu ngesikhathi esifushane, okwandisa ukukhiqiza nokusebenza kahle.
Ububi bokuhwamuka kwe-thermal:
1. Ukufana kogqinsi okungekuhle: Ukuzuza ukusatshalaliswa kogqinsi kwefilimu efanayo ekuhwamukeni okushisayo kuyinselele. Inqubo yokubeka incike ekujikeni kwempahla ehwamukile ku-substrate; nokho, ngenxa yamagradient ashisayo nezinye izici, ukusatshalaliswa kogqinsi okungajwayelekile ku-substrate kungase kwenzeke. Lokhu kushiyeka kukhawulela ukusebenza kwayo ezinhlelweni lapho ukulawulwa kogqinsi olunembile kubalulekile.
2. Ikhwalithi yefilimu enomkhawulo: Nakuba ukuhwamuka okushisayo kulungele izinhlelo eziningi zokusebenza, kungase kungafaneleki ukukhiqiza amafilimu ekhwalithi ephezulu anezici ezithile. Inqubo ingabangela i-porosity ephezulu yefilimu noma ukungabi khona kokunamathela, okungathinta ukusebenza kwayo ezimbonini ezithile, njenge-microelectronics, lapho ikhwalithi yefilimu ibalulekile.
3. Ukushisa kwe-substrate ephakeme: Ukuhwamuka okushisayo kudinga ukushiswa kwe-substrate ukukhuthaza ukunamathela kwezinto. Kodwa-ke, le mfuneko ingaba yinkinga uma kusetshenziswa ama-substrates azwela ukushisa noma izinto ezithambile. Ingcindezi yokushisa, ukusabela okungafuneki, ngisho nokulimala kwe-substrate kungenzeka, kukhawulele ububanzi bokusetshenziswa kwale ndlela yokubeka.
Kafushane, ukuhwamuka okushisayo kunakho kokubili okuhle nokubi okwenza kube inketho esebenzayo ezimbonini ezithile nasezinhlelweni zokusebenza. Ukuguquguquka kwayo, ukusebenza kahle kwezindleko, kanye nezinga eliphezulu lokubeka i-deposition kunikeza izinzuzo ezicacile, kodwa imikhawulo efana nokufana kogqinsi oluphansi, ikhwalithi yefilimu elinganiselwe, nezimfuneko zokushisa ze-substrate kufanele kucatshangelwe. Ukuqonda lezi zinzuzo kanye nokubi kuvumela abakhiqizi nabacwaningi ukuthi basebenzise ngempumelelo amandla okuhwamuka okushisayo ngenkathi kunciphisa ukubi. Njengoba ubuchwepheshe buqhubeka nokuthuthuka, kubalulekile ukuthi uhlale wazi ngentuthuko yakamuva nezinye izindlela ezicindezela imingcele yokubekwa kwefilimu emincane.
Isikhathi sokuthumela: Aug-14-2023