Kwinkqubela phambili yetekhnoloji ekhula rhoqo, ukufuma kwe-thermal kuye kwaba yindlela ebalulekileyo kumashishini ahlukeneyo. Le nkqubo isetyenziswa kakhulu kwiindawo ezifana ne-elektroniki kunye nesayensi yezinto zombane ukufaka iifilimu ezincinci kwiindawo ezahlukeneyo. Kule posi yebhlog, siza kujonga iingenelo kunye neengxaki zokufuma kwe-thermal, sicacise iinkalo zayo eziphambili, kwaye sinike uhlalutyo olupheleleyo lweengenelo kunye neengxaki zayo.
Iingenelo zokukhupha umphunga kubushushu:
1. Ukuguquguquka: Enye yeenzuzo ezibalulekileyo zokufuma kobushushu kukuguquguquka kwayo ekukhetheni izinto. Le nkqubo inokufaka iintlobo ngeentlobo zezinto, kuquka iintsimbi, ii-alloys, kwanezinto eziphilayo. Ngenxa yoko, ifumana usetyenziso kumashishini ahlukeneyo kuquka ukwenziwa kwee-semiconductor kunye neengubo ze-optical.
2. Ixabiso liphantsi: Ukufuma kobushushu kuphantsi kwexabiso, ingakumbi xa kuthelekiswa nezinye iindlela zokufaka izinto ezifana nokutshiza okanye ukukhupha umphunga ngamakhemikhali (CVD). Ukulula kwayo kunye nokulula kokusetyenziswa kwayo kunceda ekunciphiseni iindleko zezixhobo, nto leyo eyenza ukuba ibe lukhetho olunomtsalane kwimveliso encinci okanye kwiinjongo zophando.
3. Izinga eliphezulu lokufumba: Enye inzuzo yokufuma kobushushu kukuba ivumela amazinga aphezulu okufumba. Oku kuvumela abavelisi ukuba bagqume iindawo ezinkulu ngexesha elifutshane, nto leyo eyonyusa imveliso kunye nokusebenza kakuhle.
Iingxaki zokufuma kobushushu:
1. Ukufana okungekuhle kobukhulu: Ukufikelela kulwabiwo olufanayo lobukhulu befilimu ekuphumeni kobushushu kuyinselele. Inkqubo yokubeka ixhomekeke ekujikeni kwezinto eziphekwe ngomphunga kwi-substrate; nangona kunjalo, ngenxa ye-thermal gradients kunye nezinye izinto, ulwabiwo lobukhulu obungalinganiyo kwi-substrate lunokwenzeka. Olu kusilela luthintela ukusetyenziswa kwayo kwizicelo apho ulawulo oluchanekileyo lobukhulu lubalulekile.
2. Umgangatho wefilimu olinganiselweyo: Nangona ukufuma kobushushu kukulungele ukusetyenziswa okuninzi, kusenokungafaneleki ukuvelisa iifilimu ezikumgangatho ophezulu ezineempawu ezithile. Le nkqubo inokubangela ukuba iifilimu zibe mdaka okanye zinganamatheli kakuhle, nto leyo enokuchaphazela ukusebenza kwayo kumashishini athile, njengee-microelectronics, apho umgangatho wefilimu ubaluleke kakhulu.
3. Ubushushu obuphezulu be-substrate: Ukufuma kwe-thermal kufuna ukufudunyezwa kwe-substrate ukukhuthaza ukunamathela kwezinto. Nangona kunjalo, le mfuneko inokuba yingxaki xa kusetyenziswa ii-substrate ezinobushushu okanye izinto ezibuthathaka. Uxinzelelo lwe-thermal, iimpendulo ezingafunekiyo, kwanomonakalo we-substrate unokwenzeka, nto leyo ethintela uluhlu lwezicelo zale ndlela yokubeka izinto.
Ngamafutshane, ukufuma kobushushu kuneengenelo kunye neentsilelo ezenza kube lukhetho olufanelekileyo kumashishini athile kunye nezicelo. Ukuguquguquka kwayo, ukusebenza kakuhle kweendleko, kunye nezinga eliphezulu lokufaka izinto zibonelela ngeengenelo ezicacileyo, kodwa imida efana nokungalingani kobukhulu, umgangatho wefilimu olinganiselweyo, kunye neemfuno zobushushu be-substrate kufuneka ziqwalaselwe. Ukuqonda ezi nzuzo kunye neentsilelo kuvumela abavelisi kunye nabaphandi ukuba basebenzise ngempumelelo amandla okufuma kobushushu ngelixa benciphisa iintsilelo zayo. Njengoko itekhnoloji iqhubeka ihambela phambili, kubalulekile ukuhlala unolwazi ngophuhliso lwamva nje kunye nezinye iindlela ezityhala imida yokufumba kwefilimu encinci.
Ixesha lokuthumela: Agasti-14-2023