Kwinkqubela phambili yetekhnoloji ehlala ikhula, ukufudumala kwe-thermal kuye kwaba yindlela ebalulekileyo kumashishini ahlukeneyo. Inkqubo iqhele ukusetyenziswa kwimimandla efana ne-elektroniki kunye nesayensi yemathiriyeli ukufaka iifilimu ezibhityileyo kwiisubstrates ezahlukeneyo. Kule posi yebhlog, siza kuphonononga iingenelo kunye nezingeloncedo zokunyuka kwe-thermal evaporation, sicacise imiba yayo ephambili, kwaye sinikeze uhlalutyo olubanzi lwezinto eziluncedo kunye nezingeloncedo.
Izinto eziluncedo zokuphuphuma kwe-thermal:
1. I-Versatility: Enye yeenzuzo ezibalulekileyo zokuphuphuma kwe-thermal kukuguquguquka kwayo ekukhetheni izinto eziphathekayo. Inkqubo inokufaka iindidi ezininzi zemathiriyeli, kubandakanywa isinyithi, i-alloys, kunye ne-organics. Ke ngoko, ifumana izicelo kumashishini ahlukeneyo kubandakanya ukwenziwa kwe-semiconductor kunye neengubo zokukhanya.
2. Iindleko ezingeyomfuneko: Ukufuduka kwe-Thermal kuyindleko, ngakumbi xa kuthelekiswa nezinye iindlela zokubeka ezifana ne-sputtering okanye i-chemical vapor deposition (CVD). Ukulula kwayo kunye nokulula kokuphunyezwa kunceda ukunciphisa iindleko zezixhobo, okwenza kube yinto ekhangayo kwimveliso encinci okanye iinjongo zophando.
3. Izinga eliphezulu lokubeka: Enye inzuzo yokuphuphuma kwe-thermal kukuba yenza amazinga aphezulu okubekwa. Oku kuvumela abavelisi ukuba banxibe iindawo ezinkulu ngexesha elifutshane, ukwandisa imveliso kunye nokusebenza kakuhle.
Ububi bokuphuphuma kwe-thermal:
1. Ukufaniswa kobungqingqwa obubi: Ukufikelela ukwabiwa kobungqingqwa befilim obufanayo kubushushu be-thermal kulucelomngeni. Inkqubo yokubeka ixhomekeke ekujikeni kwemathiriyeli engumphunga kwi-substrate; nangona kunjalo, ngenxa yokuthambeka kwe-thermal kunye nezinye izinto, ukuhanjiswa kobukhulu obungafaniyo kwi-substrate kunokwenzeka. Le ntsilelo inciphisa ukusetyenziswa kwayo kwizicelo apho ulawulo oluchanekileyo lubalulekile.
2. Umgangatho wefilimu olinganiselweyo: Ngelixa i-evaporation ye-thermal ilungile kwizicelo ezininzi, isenokungafaneleki ukuvelisa iifilimu ezikumgangatho ophezulu ezineempawu ezithile. Inkqubo inokubangela i-porosity ephezulu yefilimu okanye ukungabikho kokubambelela, okunokuchaphazela ukusebenza kwayo kumashishini athile, njenge-microelectronics, apho umgangatho wefilimu ubaluleke kakhulu.
3. Ubushushu be-substrate obunyusiweyo: Ukufudumala kwe-Thermal kufuna ukufudumeza kwe-substrate ukukhuthaza ukunamathela kwezinto. Nangona kunjalo, le mfuneko inokuba yingxaki xa usebenzisa ii-substrates ezingeva lubushushu okanye izinto ezibuthathaka. Uxinzelelo lobushushu, ukuphendula okungafunekiyo, kunye nomonakalo we-substrate kunokwenzeka, ukuthintela uluhlu lwezicelo zale ndlela yokubeka.
Isishwankathelo, ukufudumala kwe-thermal kunezo zombini iingenelo kunye nokungalunganga okwenza kube yinto efanelekileyo kumashishini athile kunye nokusetyenziswa. Ukuguquguquka kwayo, ukusebenza kakuhle kweendleko, kunye nezinga eliphezulu lokubeka i-deposition libonelela ngezibonelelo ezicacileyo, kodwa imida efana nokungafani kobunzima, umgangatho wefilimu olinganiselweyo, kunye neemfuno zobushushu be-substrate kufuneka ziqwalaselwe. Ukuqonda ezi zinto ziluncedo kunye nezingeloncedo kuvumela abavelisi kunye nabaphandi ukuba basebenzise ngokufanelekileyo amandla okuba ngumphunga we-thermal ngelixa uthomalalisa ukungalungi. Njengoko itekhnoloji iqhubeka nokuhambela phambili, kuyafuneka ukuba uhlale unolwazi ngophuhliso lwamva nje kunye nezinye iindlela ezityhala imida yokubekwa kwefilimu ebhityileyo.
Ixesha lokuposa: Aug-14-2023