Hauv kev txhim kho thev naus laus zis tsis tu ncua, thermal evaporation tau dhau los ua ib txoj hauv kev tseem ceeb hauv ntau yam lag luam. Cov txheej txheem feem ntau yog siv rau hauv kev lag luam xws li hluav taws xob thiab cov ntaub ntawv tshawb fawb los tso cov yeeb yaj kiab nyias mus rau cov substrates sib txawv. Nyob rau hauv no blog ncej, peb yuav delve rau hauv qhov zoo thiab qhov tsis zoo ntawm thermal evaporation, qhia meej nws cov ntsiab lus tseem ceeb, thiab muab kev ntsuam xyuas dav dav ntawm nws qhov zoo thiab qhov tsis zoo.
Qhov zoo ntawm thermal evaporation:
1. Versatility: Ib qho ntawm qhov zoo ntawm thermal evaporation yog nws versatility hauv cov khoom xaiv. Cov txheej txheem tuaj yeem tso ntau yam khoom siv, suav nrog hlau, alloys, thiab txawm tias organics. Yog li ntawd, nws pom cov ntawv thov hauv ntau qhov kev lag luam nrog rau kev tsim khoom semiconductor thiab kho qhov muag.
2. Tus nqi zoo: Thermal evaporation yog tus nqi zoo, tshwj xeeb tshaj yog thaum piv rau lwm txoj kev tso nyiaj xws li sputtering lossis tshuaj vapor deposition (CVD). Nws txoj kev yooj yim thiab yooj yim ntawm kev siv yuav pab txo cov nqi khoom siv, ua rau nws yog ib qho kev xaiv zoo rau kev tsim khoom me me lossis kev tshawb fawb.
3. High deposition npaum li cas: Lwm qhov zoo ntawm thermal evaporation yog tias nws ua kom muaj cov deposition siab. Qhov no tso cai rau cov tuam txhab tsim cov txheej txheem loj hauv lub sijhawm luv luv, ua kom muaj txiaj ntsig thiab ua haujlwm tau zoo.
Disadvantages ntawm thermal evaporation:
1. Tsis zoo thickness uniformity: Ua tiav cov yeeb yaj kiab thickness faib hauv thermal evaporation yog qhov nyuaj. Cov txheej txheem deposition cia siab rau condensation ntawm vaporized khoom mus rau lub substrate; Txawm li cas los xij, vim yog thermal gradients thiab lwm yam, tsis yog-uniform thickness distributions ntawm lub substrate yuav tshwm sim. Qhov kev tsis txaus no txwv nws qhov kev siv tau rau cov ntawv thov uas qhov kev tswj xyuas tuab yog qhov tseem ceeb.
2. Cov yeeb yaj kiab tsis zoo: Thaum thermal evaporation yog qhov zoo tagnrho rau ntau daim ntawv thov, nws yuav tsis tsim nyog rau kev tsim cov yeeb yaj kiab zoo nrog cov yam ntxwv tshwj xeeb. Cov txheej txheem tuaj yeem ua rau cov yeeb yaj kiab siab porosity lossis tsis muaj adhesion, uas tuaj yeem cuam tshuam rau nws cov kev ua tau zoo hauv qee qhov kev lag luam, xws li microelectronics, qhov zoo ntawm zaj duab xis yog qhov tseem ceeb.
3. Qhov kub ntawm lub substrate: Thermal evaporation yuav tsum tau cua sov ntawm lub substrate los txhawb cov khoom adhesion. Txawm li cas los xij, qhov kev xav tau no tuaj yeem ua teeb meem thaum siv cov khoom kub-sensitive substrates los yog cov khoom muag. Kev ntxhov siab kub, tsis xav tau, thiab txawm tias muaj kev puas tsuaj rau substrate tuaj yeem tshwm sim, txwv kev siv ntau yam ntawm txoj kev tso tawm no.
Hauv cov ntsiab lus, thermal evaporation muaj qhov zoo thiab qhov tsis zoo uas ua rau nws muaj kev xaiv zoo rau qee qhov kev lag luam thiab kev siv. Nws versatility, nqi-effectiveness, thiab siab deposition tus nqi muab qhov zoo meej, tab sis cov kev txwv xws li tsis zoo thickness uniformity, tsawg zaj duab xis zoo, thiab substrate kub yuav tsum tau xav txog. Kev nkag siab txog qhov zoo thiab qhov tsis zoo no tso cai rau cov tuam txhab tsim khoom thiab cov kws tshawb fawb los siv cov peev txheej ntawm thermal evaporation thaum txo nws qhov tsis zoo. Raws li thev naus laus zis txuas ntxiv mus, nws yog qhov tseem ceeb kom nyob twj ywm ntawm qhov kev tsim kho tshiab thiab lwm txoj hauv kev uas thawb cov ciam teb ntawm nyias zaj duab xis tso tawm.
Post lub sij hawm: Aug-14-2023