Ekuguqukeni kwedijithali kwanamuhla, ukukhula okukhulu kokudluliswa kwedatha kuqhutshwa ukusebenzisana okuvamise kakhulu kuma-smartphone, okuhlangenwe nakho kwe-AR/VR okucwilisayo, kanye nomsebenzi omkhulu wokubala kumakhompyutha asebenza kahle kakhulu. Ukupakisha kwendabuko kwe-2D—okunezindlela ezinde zokuxhumanisa kanye nokulahlekelwa okukhulu kokudluliswa—akusakwazi ukugqashula ezinkingeni zokusebenza.
Ngenxa yalokho, ukufaka ama-chip stacking kanye nokupakishwa kwe-3D kuye kwavela njengesiqondiso samasu embonini. Ukuze kuvunyelwe ukuxhumana kwe-3D okuphumelelayo ngempela, ubuchwepheshe be-Through Glass Via (TGV) buvelele ngezinzuzo zabo eziyingqayizivele, busuka ekugcinweni kwe-R&D kuya ekusetshenzisweni kwezimboni. I-TGV manje isiba yinto ebalulekile evumela amadivayisi kagesi esizukulwane esilandelayo.
1. Ubuchwepheshe be-TGV: “Ibhuloho” Lokuxhumana kwe-3D
1.1 Umqondo Oyinhloko: Iyini ngempela i-TGV?
Ingqikithi ye-TGV ukwenziwa kwama-microvia aqondile nge-substrate yengilazi. Lawa ma-via asebenza njengamabhuloho kagesi, axhumanisa ngqo ama-chips noma izingxenye ezihlanganisiwe, okwenza kube lula kokubili ukudluliselwa kwesignali kanye namandla. Uma kuqhathaniswa "nocingo oluhleliwe" lwendabuko, ukuxhumeka okuqondile kunciphisa kakhulu izindlela zokudlulisela futhi kusekela ukwenziwa kwedivayisi kube kuncane kanye nokuhlanganiswa okuphezulu.
1.2 Kungani Izingxenyana Zengilazi Ziyisithwali Semvelo Se-TGV
I-TGV idlula i-TSV (Nge-Silicon Via) ngenxa yezinzuzo ezintathu ezibalulekile zengilazi:
I-dielectric constant ephansi – ukuvikela izimpawu zemvamisa ephezulu: Ingilazi ngokwemvelo ine-dielectric constant ephansi, inciphisa ukulahleka kwe-dielectric ngesikhathi sokudlulisa futhi igcina ubuqotho besignali ezinhlelweni zokusebenza zemvamisa ephezulu njenge-5G kanye ne-HPC.
Ukuhambisana kokwanda kokushisa ne-silicon – okuthuthukisa ukuthembeka: Ingilazi ifana kakhulu ne-coefficient ye-silicon yokwanda kokushisa, inciphisa ukucindezeleka kwe-thermo-mechanical kanye nokwehluleka ngesikhathi sokujikeleza kokushisa, ngaleyo ndlela yandisa isikhathi sokuphila kwedivayisi.
Ukukhanya okuphezulu kokukhanya - okuvumela ukuhlanganiswa kwe-optoelectronic: Ngokungafani ne-silicon engacacile, ukukhanya kwengilazi kusekela izinhlelo zokusebenza ze-electro-optical hybrid. Isibonelo, kumamojula we-silicon photonics, ingilazi ivumela kokubili ukuxhumana kukagesi kanye nokudluliselwa kwesignali ye-optical; kuma-microdisplay e-AR/VR, ukukhanya kunciphisa ukuvinjelwa kokukhanya futhi kuthuthukisa ukukhanya nokucaca.
1.3 Kusukela ku-TSV kuya ku-TGV: Ukuvela Kwemvelo
Ngaphambi kwe-TGV, i-TSV yayiyiyona ubuchwepheshe obuphambili bokuxhumana kwe-3D. Kodwa-ke, i-TSV ibhekene nezinselele ezikhulayo njengoba ubuningi bokuhlanganiswa bukhuphuka:
Izindleko eziphezulu: Ukugeleza kwenqubo eyinkimbinkimbi—ukugqwala, ukufudumala, ukwenziwa kwensimbi—kwenza i-TSV ingafaneleki kangako ekukhiqizweni okukhulu.
Ukukhathazeka ngokuthembeka: Ukungafani kokukhula kokushisa phakathi kwe-silicon nezinye izinto kuvame ukuholela ekuqhekekeni noma ekuhlulekeni kwejoyinti le-solder.
Ububanzi besicelo obulinganiselwe: Ukungacaci kwe-Silicon akubandakanyi i-TSV kuzinhlelo zokusebenza ze-optoelectronic ezidinga ukucaca.
I-TGV ibhekana ngempumelelo nalezi zinkinga, okwenza kube yisisombululo esithandwayo sokuxhumana kwesizukulwane esilandelayo.
2. Ngokumboza: I-Core Enabler Eyenza I-TGV Isebenze
2.1 Ukuqonda Okubalulekile: Ngaphandle Kokumboza, i-TGV “iyiThubhu Elingenalutho”
Ama-glass vias avikela ngokwemvelo futhi awakwazi ukuhambisa ugesi. Ukuze kusebenze ukuxhumana, ungqimba oluhambisayo oluguquguqukayo (ngokuvamile ifilimu yensimbi) kumele lubekwe eceleni kwezindonga ze-via. Lolu ngqimba lusebenza njengomgwaqo omkhulu wesignali—onquma isivinini, ukulahleka, kanye nokuqina. Ukumbozwa okungafani noma okunephutha kubangela ukumelana okuphezulu, ukuncishiswa kwesignali, noma ngisho namasekethe avulekile, okwenza nge-metallization kube umzila wokuphila wobuchwepheshe be-TGV.
2.2 Izinselele: Amaphuzu Amabili Obuhlungu Obubucayi
Ukumbozwa Kwesilinganiso Esiphezulu
Ububanzi be-TGV manje busebangeni le-micrometer (kuze kufike ku-~30 μm) ngokujula okungaphezu kwesilinganiso se-aspect esingu-10:1. Izindlela zokubeka zendabuko ziyazabalaza ukufeza ukumbozwa okuphansi kanye namafilimu afanayo aseceleni, ngokuvamile zishiya "izindawo ezifile" ezingamboziwe ezilimaza ukusebenza kokuxhumana.
Ukulawula Okuphelele - Umbulali Ofihliwe
Amakhona kanye nama-rough ngezindonga eziseceleni kuthambekele ekufakweni kwezikhala noma amabhamuza. Lokhu kukhubazeka kubangela ukujiya kokumelana kwendawo noma ukuvula amasekethe, okuphula ngqo ukuxhumana phakathi kwama-chip namadivayisi. Ngakho-ke ukucindezela ukukhubazeka kuyinselele eyinhloko yokugqoka kwe-TGV.
3. Izindlela Ezine Zokumboza: Amandla Nemikhawulo
Ukususwa Komusi Womzimba (i-PVD): Kuvuthiwe Kodwa Kulinganiselwe
Izinqubo ezifana nokuhwamuka kanye nokuphalaza zinikeza amafilimu ahlanzekile kakhulu, anamathela ngokuqinile. Kodwa-ke, ngenxa yemvelo yayo "yokubona", i-PVD ilwa nama-via esilinganiso esiphakeme futhi ifaneleka kakhulu kuma-via angaphansi kuka-5:1 aspect ratios.
Ukususwa Komusi Wekhemikhali (i-CVD): Isilinganiso Esiphezulu Sokubukeka Kuyakwazi Kodwa Kubiza Kakhulu
I-CVD isebenzisa izandulela zegesi ezisakazeka ngezindonga eziseceleni, ziveza ukumbozwa okufanayo ngisho nasezindlini ezinesilinganiso esiphakeme. Kodwa-ke, izinga lokushisa eliphezulu kanye nezimo zokucindezela ziyingozi ekulimazeni izingqimba zengilazi, futhi izindleko zemishini ziphezulu, okwenza ifaneleke kakhulu ekusetshenzisweni okuphezulu.
Ukufakwa Kwe-Electrochemical (ECD): Ukukhiqizwa Kwesisindo Okungabizi Kakhulu
Ama-ECD afaka amafilimu okuhambisa ngokunciphisa ama-ion ensimbi ngokusebenzisa izindonga eziseceleni. Inikeza izindleko eziphansi kanye nomthamo ophezulu, okulungele ukukhiqizwa kwevolumu. Kodwa-ke, ukulawulwa okuqinile kokuhlushwa kwe-electrolyte kanye nobuningi bamanje kubalulekile—ukuphambuka kuholela kumafilimu anezimbobo noma ukungcola. Ngokuvamile kufakwa kuma-vias angu-5–50 μm ububanzi.
Ukufakwa Kwezingqimba Ze-Atomic (ALD): Isixazululo Esinembile
I-ALD ifinyelela ukulawulwa kobukhulu besikali se-athomu kanye nokuhambisana okuhle kakhulu, okwenza kube kuhle kakhulu kuma-vias anesilinganiso esiphakeme kakhulu. Ixazulula inselele yokumboza kodwa ihlushwa amazinga okufakwa ahamba kancane kakhulu kanye nezindleko eziphakeme. Ngakho-ke, i-ALD igcinelwe ikakhulukazi izinzwa zezindiza kanye nezinokwethenjelwa okuphezulu.
4. Inani Lokumboza Nge-TGV: Ukusebenza Kokuxhumana Kwe-3D Okuqhutshwayo
Ukuthuthukiswa Kwesivinini – Ukuxhumana Okuqondile Okusheshayo
Ekupakisheni kwe-2D, amasignali kumele ahambe amabanga amade, okwandisa ukulahleka. Ngokwenziwa kwensimbi kwe-TGV, ukuxhumana kwe-chip-to-board kanye ne-chip-to-system kuba mfushane, kuqonde phezulu, futhi kulahlekelwa kancane. Kumaseva e-HPC, ama-vias ambozwe yi-TGV avumela isivinini sokuxhumana se-CPU-to-memory/GPU ukuba sithuthuke ngaphezu kuka-30%, kunciphisa ukubambezeleka futhi kukhuphule ukusebenza kahle kohlelo.
Ukusetshenziswa Kahle Kwamandla - Ukubambezeleka Okuphansi Nokusetshenziswa Kwamandla
Izindlela ezimfushane zokuxhumanisa zinciphisa ukubambezeleka, kuyilapho izembozo ezingamelani kahle zinciphisa ukushisa kwe-Joule. Isibonelo, ukupakishwa kwama-chip e-smartphone anikwe amandla yi-TGV kunganciphisa ukusetshenziswa kwamandla ayisisekelo ngo-15-20%, kwandise impilo yebhethri futhi kuthuthukise ulwazi lomsebenzisi.
5. I-Zhenhua Vacuum: Izixazululo Zokumboza Ezithuthukisiwe ze-TGV
Izinzuzo Zemishini
Ukuthuthukisa i-Deep-Via
Ubuchwepheshe bokumboza imbobo ejulile buvumela ukufakwa kwezingqimba zembewu okufanayo ngisho nasezingcezu ezincane njenge-30 μm ezinezilinganiso zobukhulu ezingaphezu kuka-10:1—ukuxazulula enye yezinselele ezinzima kakhulu embonini.
Ukuphathwa Kwe-Substrate Okungenziwa Ngokwezifiso
Isekela ububanzi bosayizi be-substrate yengilazi, kufaka phakathi u-600 × 600 mm / 510 × 515 mm, kanye nokukhula kumafomethi amakhulu.
Ukuguquguquka Kwenqubo – Ukuhambisana Kwezinto Eziningi
Isekela amafilimu aqhubayo futhi asebenzayo njenge-Cu, Ti, W, Ni, kanye ne-Pt, ihlangabezana nezidingo ezahlukahlukene zohlelo lokusebenza lokulawula ugesi kanye nokumelana nokugqwala.
Ukusebenza Okuzinzile Nokulungiswa Okulula
Ifakwe izinhlelo zokulawula izinqubo ezihlakaniphile zokuqapha ukufana kobukhulu befilimu ngesikhathi sangempela, kanye nomklamo we-modular wokulungisa okulula kanye nesikhathi esincishisiwe sokungasebenzi.
Ububanzi Besicelo
Kusebenza ekupakisheni okuthuthukisiwe kwe-TGV/TSV/TMV, okuvumela ukufakwa kwengqimba yembewu eguquguqukayo kuma-vias ajulile anezilinganiso zobukhulu obungu-10:1.
—Lesi sihloko sishicilelwe ngu imishini yokumboza nge-vacuum umenzi we-Zhenhua Vacuum
Isikhathi sokuthunyelwe: Septhemba-27-2025