Isingeniso: Kusukela Kuma-Interconnects Kuya Kuzinselele Zezinga Le-Micron
Ngokuthuthuka okusheshayo kokuxhumana kwe-5G, amaseva e-AI, kanyeubuchwepheshe obuthuthukisiwe bokupakisha,Ukukhiqizwa kwe-PCB (Printed Circuit Board) sekuphenduke ipulatifomu eqhutshwa yi-microvia enobuningi obukhulu. Ukwamukelwa kwamabhodi e-HDI, ama-PCB anezingqimba eziningi, kanye ne-IC Substrates kukhombisa ukushintshela enkathini yokukhiqiza ye-micron-scale, lapho ukubhoboza kudlala indima ebalulekile ekwakheni ukuxhumana kukagesi okunokwethenjelwa phakathi kwezingqimba (Via Interconnects). Kodwa-ke, njengoba ububanzi bokubhoboza buncipha ngaphansi kuka-0.2 mm ngisho no-0.1 mm, izindlela zomshini ezivamile ziya ngokuya zingakwazi ukuhlangabezana nezidingo zezinto ezivame kakhulu kanye nokukhiqizwa okunembile kakhulu, okwenza amathuluzi aguge, ukuphuka kwe-micro drill, kanye nezinselele ezibalulekile zekhwalithi yodonga lwembobo ezingazinzile ezithinta isivuno se-PCB kanye nokuvumelana kokukhiqiza.
Izinselele Zokucubungula Emsebenzini Wokubhoboza Ama-Microvia
Ekwenziweni kwe-PCB enobuningi obukhulu, ukubhoboza okuncane kuyinqubo ebucayi kakhulu elawulwa isimo samathuluzi, ukuziphatha kwezinto, kanye nokuguquguquka kokusika. Ngesivinini se-spindle esiphezulu kakhulu, esivame ukufinyelela amashumi ezinkulungwane kuya kumakhulu ezinkulungwane ze-RPM, umkhawulo wokusika olinganiselwe kakhulu wama-micro drill wenza ukuthi atholakale kalula emiphumeleni yokushisa, okusheshisa ukuguguleka kwamathuluzi, kwandise i-coefficient of friction, futhi kuholele ezimweni zokusika ezingazinzile. Njengoba umkhawulo wokusika uwohloka, ukususwa kwezinto kuyashintsha kube ukuguqulwa nokuqhekeka, okuholela ekubeni lukhuni kodonga lwembobo, ukwakheka kwe-burr, kanye nokunamathela kwe-resin, konke okuqongelela kuma-microvia arrays aminyene futhi kunciphisa kakhulu ukuzinza kwenqubo.
Le nkinga iba sobala nakakhulu lapho kusetshenziswa ama-substrate asezingeni eliphezulu njenge-PTFE, i-BT resin, kanye nezinto ze-ABF, lapho i-modulus ephansi kanye nezici zokunamathela okuphezulu kukhuthaza i-resin smear (Smear) kanye nemiphumela ye-wicking (Wicking) ezindongeni ezidlulayo. Lezi ziphambeko ziphambuka nge-geometry, zibeka engcupheni ukunemba kobukhulu, futhi zithinta kabi izinqubo ezingezansi okuhlanganisa i-metalization kanye nokuthembeka kwe-electroplating, okubeka izingozi ezinkulu zezinhlelo zokusebenza eziphezulu njenge-IC Substrates, lapho ukubekezelelana kweziphambeko kuphansi kakhulu.
Ukukhethwa Kobunjiniyela Bomphezulu Nobuchwepheshe Bokumboza
Ukuze kuthuthukiswe ukusebenza kokubhoboza okuncane, ubunjiniyela bendawo ngokusebenzisa ubuchwepheshe obuthuthukisiwe bokumboza bubalulekile. Nakuba ukugoqa okungenawo ugesi kanye ne-CVD (Chemical Vapor Deposition) kungathuthukisa ubulukhuni bendawo ngezinga elithile, kuveza imikhawulo ekusetshenzisweni kwezinga elincane, okuhlanganisa ukufana kobukhulu bokumboza okungekuhle, izinga lokushisa eliphezulu lokufaka, umonakalo ongaba khona we-substrate, kanye nokucindezeleka okuphezulu okusele okuholela ekuhlukaniseni ukumboza ngaphansi kwezimo zomshini wesivinini esikhulu.
Ngokuphambene nalokho, i-PVD (Physical Vapor Deposition) Vacuum Coating Technology inikeza ikhambi elifaneleka kakhulu lezicelo zokubhoboza ezincane, njengoba ivumela ukufakwa kwamafilimu amancane aqinile, afanayo anokunamathela okuhle kakhulu, ukuncipha kokuqina kokungqubuzana, kanye nokumelana nokuguguleka okuthuthukisiwe, okuqinisa ngempumelelo inqubo yokusika ngenkathi kunciphisa i-resin smear futhi kuthuthukisa ubuqotho bodonga lwembobo.
Isixazululo Sokumboza I-Zhenhua Vacuum Micro Drill
Uhlelo Lokumboza i-MFA0605 PVD lwakhiwe ngokukhethekile ukuze lusetshenziswe ekumbozeni amathuluzi okusebenza okuphezulu embonini ye-PCB. Luhlonyiswe ngohlelo lokuhlunga i-arc ion plating oluzithuthukisile, luqeda ngempumelelo izinhlayiya ezinkulu ezikhiqizwa ngesikhathi sokufakwa, luqinisekisa ikhwalithi ephezulu yefilimu kanye nokufana kokufakwa. Uhlelo lusekela ukumbozwa kwe-Ta-C (tetrahedral amorphous carbon) okuthuthukisiwe, lunikeza ubulukhuni obuphezulu obufika ku-63 GPa, kanye ne-coefficient ephansi yokungqubuzana, ukumelana nokugqwala okuhle kakhulu, kanye nokuphila kwamathuluzi okweluliwe kakhulu. Ngesikhathi esifanayo, luyakwazi ukufaka uhla olubanzi lokumbozwa okuphezulu njenge-AlTiN, AlCrN, TiCrAlN, TiAlSiN, kanye ne-CrN, okwenza lukwazi ukuzivumelanisa nezimo kakhulu ne-PCB micro drills, amathuluzi okusika, isikhunta esinembile, kanye nezingxenye zezimoto, ngenkathi lugcina ukunamathela okuqinile kokumboza, ukuhambisana okuhle kakhulu kwe-batch, kanye nokusebenza kahle kokufakwa kwefilimu encane ezindaweni zokukhiqiza ngobuningi.
Isiphetho
Njengoba ukukhiqizwa kwe-PCB kuqhubeka nokuthuthuka kuya ekuxineni okuphezulu, ama-via amancane, kanye nezakhiwo eziyinkimbinkimbi kakhulu, ikhono lokubhoboza okuncane seliyisici esichazayo kwikhwalithi yokukhiqiza kanye nokuncintisana. Kulesi simo, ukumboza amathuluzi akuseyona into eyengeziwe yokuthuthukisa kodwa ubuchwepheshe obubalulekile obuvumelayo obunquma ngqo isikhathi sokuphila kwamathuluzi, ikhwalithi yemigodi, kanye nokuqina kwenqubo iyonke. Isebenzisa ubuchwepheshe be-PVD Vacuum Coating, i-Zhenhua Vacuum ithuthukisa njalo ukufana kokumboza, ukuzinza kwefilimu, kanye nokuvumelana kokukhiqiza, okuvumela ukusebenza okuthembekile ezintweni ezivame kakhulu kanye nokubhoboza i-microvia okuhle kakhulu.
— Kushicilelwe yi-Zhenhua Vacuum, omunye wabakhiqizi abayishumi abaphezulu of imishini yokumboza nge-vacuum
Isikhathi sokuthunyelwe: Mashi-16-2026