Ekwenziweni kwezinto zikagesi ze-3C—ama-smartphone, ama-laptop, kanye nezinto ezigqokwayo—ikhwalithiizembozo zomphezuluKuzo zombili izingxenye zokuhlobisa nezisebenzayo kunquma ngqo ukuqina kanye nolwazi lomsebenzisi. Amafilimu amancane anamathelayo aphezulu awagcini nje ngokuthuthukisa ukumelana nokuklwebheka, ukusebenza okulwa nokugqwala kweminwe, kanye nokuvikelwa kokugqwala, kodwa futhi aqinisekisa ukuthembeka kwesikhathi eside ngaphandle kokuxebuka noma ukuqhekeka. Ukuthuthukisa izixazululo zokugqoka eziqinile ezinokunamathela okuphezulu sekuyinkinga enkulu kubuchwepheshe bokugqoka nge-vacuum.
Izici Eziyinhloko Ezithinta Ukunamathela Ezimbozweni Ze-3C
Izakhiwo ze-Substrate
Izinto ezivamile emikhiqizweni ye-3C zifaka ingilazi, ipulasitiki yobunjiniyela (i-PC, i-PMMA, i-ABS), kanye nama-alloy e-aluminium. Into ngayinye ibonisa ukumanzika okuhlukile kwendawo, ukuziphatha kokukhula kokushisa, kanye nokuhambisana kwamakhemikhali—konke okuthonya amandla okubopha phakathi kwe-interfacial.
Ukwelashwa Kwangaphambi Komphezulu
Ukuhlanzeka kobuso, ubulukhuni, kanye nokusebenza kuyizimfuneko zokunamathela. Izinto eziphilayo ezisele, ama-oxide, noma izinhlayiya zingalimaza kakhulu ubuqotho befilimu, okuholela ekuhlukaniseni indawo.
Amapharamitha Okubeka Indawo
Izimo zenqubo—njengokushisa kokufakwa, ingcindezi yesisekelo, ukuthambekela kwe-substrate, kanye nesilinganiso sokufakwa—kuchaza ubuningi befilimu kanye nesimo sokucindezeleka. Ukucindezeleka okungaphakathi ngokweqile noma ukufakwa okusheshayo kakhulu kuvame ukwenza buthaka ukubopha kwe-interfacial.
Izendlalelo Eziphakathi
Ezinhlelweni ezingafani (isb., amafilimu ensimbi kuma-polymer substrates), ukufakwa ngqo akuvamile ukufeza ukunamathela okuzinzile. Ukwethula i-interlayer eyodwa noma ngaphezulu ezikhuthaza ukunamathela (njenge-SiO₂, i-Cr, noma i-Ti) kwenza kube lula ukuhambisana kwamakhemikhali kanye nokuvimbela ukucindezeleka.
Amasu Enqubo Yokumboza Okunamathelayo Okuphezulu
Ukuhlanza Ngokunembile Nokusebenza Komphezulu
Amasu anjengokuhlanza i-plasma noma ukuqhuma kwe-ion-beam kususa ukungcola futhi kwandise amandla ongaphezulu, ngaleyo ndlela kuthuthukiswe i-nucleation kanye nokunamathela.
Ama-Interlayer Anjiniyela
Ukwethula izendlalelo zokuguquka—njengamafilimu okunamathela e-Cr noma e-Ti—kuthuthukisa ukumanzi futhi kunciphisa ukucindezeleka okubangelwa ukungalingani kokukhula kokushisa phakathi kwe-substrate kanye nezingubo ezisebenzayo.
Ukulawulwa Kokufakwa Kwendawo Okulungiselelwe
Ukulungisa kahle amapharamitha okukhipha i-RF noma i-DC magnetron kunciphisa ukucindezeleka kwangaphakathi ngenkathi kuthuthukiswa ubuningi befilimu. Usizo lwe-ion yamandla aphakathi ngesikhathi sokufakwa lungaqinisa kakhulu ukubopha nokunamathela kwe-athomu.
Izakhiwo Ezihlanganisiwe Ezinezingqimba Eziningi
Ukusebenzisa ukwakheka “kwesendlalelo sokunamathela + isendlalelo esisebenzayo + isendlalelo esivikelayo” kuqinisekisa ukuthi isendlalelo ngasinye sinikeza imisebenzi ehlukile yokuxhumana kanye nokusebenza, ndawonye kuthuthukisa ukunamathela okuphelele.
Izibonelo Zokusebenza
Ingilazi yesembozo se-Smartphone: Izembozo ezilwa nokukhanya kanye neze-anti-fingerprint zidinga ukukhanya okuphezulu kanye nokumelana nokuguguleka. Ngokufaka ungqimba lwe-SiO₂/Cr phakathi kwengilazi kanye ne-activation esebenzayo, ukunamathela kuthuthukiswa kakhulu, okuvimbela ukuqhekeka ngaphansi kokujikeleza kokushisa.
Izikhonkwane zepulasitiki ezinezimbozo ze-aluminium: Inqwaba yezingqimba eziningi ze-“Cr/Ti interlayer + Al reflective layer + SiO₂ protective layer” ibonisa ukuzinza okuhle kakhulu, igcina ukunamathela ngisho nangemva kokuhlolwa okugobile okungamakhulu.
Isiphetho
Inselele yokufinyelela ukunamathela okuphezulu kwe-coating emikhiqizweni ye-3C isendaweni yokuhlangana kobunjiniyela be-interface kanye nokulawulwa kwenqubo. Ngokusebenzisa ukulungiswa kwangaphambili, ukwakheka kwe-interlayer, kanye namasu okubeka anembile, kungenzeka ukwakha izinhlelo ze-coating ze-multilayer ezinokunamathela okuqinile—ukuhlangabezana nezidingo zemboni zokuqina, ukuthembeka, kanye nobuhle kuma-electronics abathengi.
—Lesi sihloko sishicilelwe nguimishini yokumboza nge-vacuum umenzi we-Zhenhua Vacuum
Isikhathi sokuthunyelwe: Septhemba-29-2025