Eminyakeni yamuva nje, ubuhlakani bokwenziwa, ukushayela okuzenzakalelayo, kanye nama-chip ekhompyutha asebenza kahle kakhulu kuye kwabusa indawo ye-semiconductor. Njengoba ukusebenza kwama-chip kuqhubeka nokwenyuka, ukupakisha okuvamile kwezinhlangothi ezimbili (2D) akusakwazi ukuhlangabezana nezidingo ezikhulayo zobuningi bokuxhumana kanye nokuphathwa kokushisa. Imboni iqhubekela phambili ngokushesha enkathini yokuhlanganiswa kwezinhlangothi ezintathu (3D).
Ukuze kuhlangatshezwane nobuningi bekhompyutha kanye nokuxhumana okuphezulu ngaphakathi kwesikhala esilinganiselwe, indima yesisekelo sokupakisha isibe yinto ebaluleke kakhulu kunanini ngaphambili. Ubuchwepheshe be-Through-Silicon Via (TSV) bake baba uphawu lokupakisha kwe-3D, kodwa izindleko zabo eziphakeme, ukudlula okulinganiselwe, kanye nemikhawulo yezinto ezibonakalayo kuye kwavimbela ukwamukelwa kabanzi. Manje, kuvela umncintiswano omusha—ubuchwepheshe bokuxhumanisa be-Through-Glass Via (TGV).
Isimiso esiyinhloko se-TGV ukwakha ama-micron-scale vias nge-insulating glass substrate, kulandelwe ukugcwaliswa kwensimbi ukuze kusungulwe izindlela eziqondile zokuqhuba phakathi kwama-chips noma ama-substrate. Nakuba lo mqondo ubonakala ulula, inqubo ihilela izinyathelo eziningi zokunemba lapho isigaba ngasinye sithinta ngqo ukuthembeka kokuxhumana. Phakathi kwalokhu, ukufakwa kwengqimba yembewu—okuvame ukunganakwa—kusebenza njengesisekelo esifihliwe esinquma impumelelo iyonke yokwenza insimbi.
1. Ukugeleza Kwenqubo ye-TGV: Ungqimba Lwembewu—“Ibhuloho” Eliqhuba Ukwenziwa Kwensimbi
Inqubo ejwayelekile ye-TGV iqukethe:
Ukulungiswa kwe-substrate yengilazi → Ukunemba ngokubhoboza → Ukufakwa kwengqimba yembewu → Ukugcwalisa nge-electroplating → Ukuhlela umphezulu.
Ingqimba yembewu empeleni iyifilimu encane kakhulu yokuhambisa umoya ebekwe ezindongeni zangaphakathi ze-vias zengilazi ezingezona ezokuhambisa umoya. Uma isakhiwo se-TGV sibhekwa “njengebhuloho” eliqondile lokuxhumanisa ugesi, khona-ke ungqimba lwembewu lusebenza njengekhebula lokuqala lensimbi eliqinisa lelo bhuloho. Ngaphandle kwalo, ukufakwa kwe-electroplating okulandelayo ngeke kuqalise, futhi ukwenziwa kwensimbi okufanayo ngaphakathi kwe-vias akunakwenzeka.
Kodwa-ke, ikhwalithi yokubekwa kwalolu ngqimba incike kakhulu ekubunjweni kwejometri kwe-via ngokwayo. Ukwakheka okuhlukile kwe-via kuholela ezinseleleni ezihlukile ekufinyeleleni ukumbozwa okufanayo kwengqimba yembewu.
2. I-Via Morphology: Inselele Eyinhloko Yokumbozwa Kwezingqimba Zembewu Ezifanayo
Amaphrofayili e-TGV ahlukahluka kuye ngenqubo yokubhoboza nokuqopha. Amajiyometri avamile afaka phakathi ama-via amise okwebhabhathane, ayimpumputhe, aqondile, kanye namise okwe-V, ngalinye liveza ubunzima obuhlukile bokubekwa:
Uvemvane nge: Ingxenye ephakathi encishisiwe ibangela umphumela wokufihla, ivimbela ama-athomu ensimbi ukuthi angafinyeleli esifundeni esiphakathi. Lokhu kuphumela "ezindaweni ezifile" ezingamboziwe lapho ukuqhubeka kwe-electroplating kulahleka khona.
I-Blind via: Uma iphansi livaliwe, ukugeleza kwegesi kunqunyelwe futhi amandla e-ion ayancipha, okuholela kumafilimu amancane nanganamatheli kahle angase ahlukane ngaphansi kokucindezeleka kwenqubo okulandelayo.
I-Vertical via: Ibonakala nge-aspect ratio ephezulu kanye nezindonga eziqondile, ama-athomu ensimbi ahamba ngokulandelana futhi avame ukwehluleka ukumboza phansi kwe-via ngokwanele, okukhiqiza izindlela zokuhambisa ezingaphelele noma izikhala ze-plating.
Okumise okwe-V nge: Iphrofayili enciphile ithuthukisa ukufana kwe-engeli yokufaka ngezinga elithile, kodwa ukuncipha ngokweqile kungabangela ukungalingani kwefilimu kanye nokugxila kokucindezeleka, okwehlisa ubuqotho besignali.
Kuzo zonke izimo, inselele eyinhloko ukufeza ukumbozwa kwensimbi okuqhubekayo, okufanayo, nokunamathela kahle ezindaweni zengilazi ezinesilinganiso esiphezulu ngamandla aphansi ngokwemvelo. Noma yikuphi ukungaqhubeki noma ukunamathela okubi kungqimba lwembewu kuholela ezimbotsheni, emifantwini, noma ekuhlukaniseni ngesikhathi sokufakelwa kwe-electroplating, okuholela ekwandeni kokumelana kokuxhumana, ukubambezeleka kwesignali, noma ukwehluleka okuphelele kwedivayisi.
Ukubhekana nalezi zinselele kudinga imishini yokumboza nge-vacuum enembile kakhulu, ezinzile kakhulu ekwazi ukufeza i-deep-via metallization. Yilapho ikhambi lokumboza le-TGV le-ZHENHUA Vacuum lisebenza khona.
3. Isixazululo se-ZHENHUA Vacuum's TGV nge-Metallization
Izinzuzo Zemishini:
Ukuthuthukisa Ukugqoka Okujulile Nge-Deep-Via
Ubuchwepheshe bokumboza imigodi ejulile bobunikazi buvumela ukufakwa kwezingqimba zembewu okufanayo ngisho nasezintweni ezinobubanzi obuncane njengo-30 μm, kufinyelela isilinganiso sesici esifinyelela ku-10:1 futhi kuxazululwe ngempumelelo izinkinga ze-metallization ku-3D eyinkimbinkimbi ngezakhiwo.
Kungenziwa ngezifiso ngosayizi abahlukahlukene be-substrate
Iyahambisana nezingxenye zengilazi ezingama-600 × 600 mm, 510 × 515 mm, kanye namafomethi amakhulu ukuze kuhlangatshezwane nezidingo zokukhiqiza ezahlukahlukene.
Ukuzivumelanisa Nezimo Kwenqubo Kuzo Zonke Izinto Eziningi
Isekela ukufakwa kwe-Cu, Ti, W, Ni, Pt kanye namanye amafilimu amancane aqhuba noma asebenzayo, okwanelisa izidingo ezahlukene zikagesi kanye nokumelana nokugqwala.
Ukusebenza Okuzinzile Nokulungiswa Okulula
Ifakwe uhlelo lokulawula oluhlakaniphile lokulungisa amapharamitha ngokuzenzakalelayo kanye nokuqapha ukujiya kwefilimu ngesikhathi sangempela. Umklamo we-Modular uqinisekisa ukulungiswa okulula kanye nesikhathi esincishisiwe sokungasebenzi.
Ububanzi Bokusetshenziswa:
Ifanelekela ukupakishwa okuthuthukisiwe kwe-TGV/TSV/TMV, okuvumela ukumbozwa kwezingqimba zembewu zekhwalithi ephezulu kuma-vias anezilinganiso zobukhulu obufika ku-10:1.
Isiphetho: Ukwazi Uhlaka Lwembewu—Isinyathelo Esiya Ekuhlanganisweni Kwangempela Kwe-3D
Inani lobuchwepheshe be-TGV alikho nje ekuhlinzekeni isiteshi esisha sokuxhumana esiqondile kodwa nasekuvumeleni ukwakheka kwangempela kokuxhumana okunezinhlangothi ezintathu.
Enhliziyweni yalolu shintsho, ukwenziwa kwensimbi kwengqimba yembewu kusalokhu kuyinqubo ebaluleke kakhulu kodwa evame ukunganakwa.
Kuphela uma lesi "sisekelo esiqhubayo" esingabonakali sifinyelela ukufana, ubuningi, kanye nokunamathela okuqinile lapho ukusebenza kwe-electroplating kanye nokuxhuma okulandelayo kungaqinisekiswa khona. Ukufinyelela ukufakwa kwensimbi esezingeni eliphezulu ngaphakathi kwama-vias engilazi e-micron-scale sekube uphawu oluchazayo lwekhono lokupakisha elithuthukisiwe.
Ngokusebenzisa inqubo eqhubekayo yokusungula izinto ezintsha kanye nokuguquka kwemishini, i-ZHENHUA Vacuum iletha izixazululo zokumboza ezithembekile nezikhiqiza kakhulu ze-TGV, inika amandla abakhiqizi bokupakisha ukuthi basuke ekugijimeni kokuhlola baye ekukhiqizeni ngobuningi, okusheshisa ukugcwaliseka okugcwele kokuhlanganiswa kwe-3D.
Enkathini eqhutshwa amandla okusebenzisa ikhompyutha kanye nobuningi bokuhlanganiswa, lokhu kungaphezu kokuthuthuka kwemishini—kumele isinyathelo esibalulekile sokuvuthwa kobuchwepheshe bokupakisha be-3D besizukulwane esilandelayo.
—Lesi sihloko sishicilelwe nguimishini yokumboza nge-vacuumumenzi we-Zhenhua Vacuum
Isikhathi sokuthunyelwe: Okthoba-13-2025