Kwinguquko yedijithali yanamhlanje, ukukhula okukhulu kokudluliselwa kwedatha kuqhutywa kukunxibelelana rhoqo kwiifowuni eziphathwayo, amava e-AR/VR angenamsebenzi, kunye nomthwalo omkhulu wemisebenzi yekhompyutha kwikhompyutha esebenza kakhulu. Ukupakisha kwendabuko kwe-2D—eneendlela ezinde zokunxibelelana kunye nokulahlekelwa okukhulu kokudluliselwa—akunakuphinda kudlule kwiingxaki zokusebenza.
Ngenxa yoko, ukufakwa kweetships kunye nokupakishwa kwe-3D kuye kwavela njengesikhokelo esicwangcisiweyo soshishino. Ukuze kusebenze uqhagamshelo lwe-3D olusebenza kakuhle ngokwenene, ubuchwepheshe be-Through Glass Via (TGV) buvelele ngeenzuzo zalo ezikhethekileyo, ukusuka kwiindawo ezigciniweyo ze-R&D ukuya kwizicelo zoshishino. I-TGV ngoku iba sisixhobo esibalulekileyo sokuxhasa izixhobo ze-elektroniki zesizukulwana esilandelayo.
1. Itekhnoloji ye-TGV: "Ibhulorho" yoNxibelelwano lwe-3D
1.1 Ingcamango Engundoqo: Yintoni kanye kanye i-TGV?
Eyona nto iphambili kwi-TGV kukwenziwa kwee-microvias ezithe nkqo nge-substrate yeglasi. Ezi vias zisebenza njengeebhulorho zombane, zidibanisa ngokuthe ngqo iitships okanye izinto ezihlanganisiweyo, zivumela ukuhanjiswa kwesignali kunye namandla. Xa kuthelekiswa "nentambo yeplanar" yendabuko, ukunxibelelana ngokuthe nkqo kunciphisa kakhulu iindlela zokuhambisa kwaye kuxhasa ukwenziwa kwezixhobo ezincinci kunye nokuhlanganiswa okuphezulu.
1.2 Kutheni iiGlasi ezingaphantsi komhlaba ziyiMthwali wendalo we-TGV
I-TGV idlula i-TSV (NgeSilicon Via) ngenxa yeenzuzo ezintathu ezibalulekileyo zeglasi:
I-dielectric constant ephantsi - ikhusela imiqondiso ye-high-frequency: Iglasi ngokwayo ine-dielectric constant ephantsi, inciphisa ukulahleka kwe-dielectric ngexesha lokudluliselwa kwaye igcina ukuthembeka kwesignali kwizicelo ze-high-frequency ezifana ne-5G kunye ne-HPC.
Ukuhambelana kokwandiswa kobushushu kunye ne-silicon – okwandisa ukuthembeka: Iglasi ihambelana ngokusondeleyo ne-coefficient ye-silicon yokwandiswa kobushushu, inciphisa uxinzelelo lwe-thermo-mechanical kunye nokungaphumeleli ngexesha lokujikeleza kobushushu, ngaloo ndlela yandisa ubomi besixhobo.
Ukukhanya okuphezulu kwe-optical – okuvumela ukuhlanganiswa kwe-optoelectronic: Ngokungafaniyo ne-silicon engacacanga, ukukhanya kweglasi kuxhasa usetyenziso lwe-electro-optical hybrid. Umzekelo, kwiimodyuli ze-silicon photonics, iglasi ivumela zombini ukunxibelelana kombane kunye nokudluliselwa kwesignali ye-optical; kwi-AR/VR microdisplays, ukukhanya kunciphisa ukuvaleka kwe-optical kwaye kuphucula ukukhanya kunye nokucaca.
1.3 Ukusuka kwi-TSV ukuya kwi-TGV: Uguquko Lwendalo
Ngaphambi kwe-TGV, i-TSV yayiyeyona teknoloji iphambili yokudibanisa i-3D. Nangona kunjalo, i-TSV ijongene nemingeni ekhulayo njengoko uxinano lokudibanisa lusanda:
Ixabiso eliphezulu: Ukuhamba kweenkqubo ezinzima—ukugrumba, ukufudumala, ukwenziwa kwesinyithi—kwenza i-TSV ingafanelekanga kangako kwimveliso emikhulu.
Iingxaki zokuthembeka: Ukungalingani kokukhula kobushushu phakathi kwe-silicon nezinye izinto kudla ngokukhokelela ekuqhekekeni okanye ekusileleni kwejoyinti ye-solder.
Ububanzi besicelo obulinganiselweyo: Ukungacaci kweSilicon akubandakanyi i-TSV kwizicelo ze-optoelectronic ezifuna ukucaca.
I-TGV ijongana ngempumelelo nezi ngongoma zentlungu, nto leyo eyenza ukuba ibe sisisombululo esithandwayo soqhagamshelwano lwesizukulwana esilandelayo.
2. Ngokusebenzisa iCoating: I-Core Enabler Eyenza i-TGV Isebenze
2.1 Ingqiqo ephambili: Ngaphandle kokugquma, i-TGV "yityhubhu engenanto" nje
Iiglasi ze-vias zikhusela ngokwemvelo kwaye azikwazi ukuqhuba umbane. Ukuze kusebenze uqhagamshelo, kufuneka kubekwe umaleko oqhubayo ohambelanayo (odla ngokuba yifilimu yesinyithi) ecaleni kweendonga ze-vias. Olu maleko lusebenza njengomgaqo wendlela yesignali—omisela isantya, ukulahleka, kunye nokuzinza. Iingubo ezingalinganiyo okanye ezineziphene zibangela ukuxhathisa okuphezulu, ukuncitshiswa kwesignali, okanye kwaneesekethe ezivulekileyo, okwenza nge-metallization ibe yindlela yokuphila yetekhnoloji ye-TGV.
2.2 Imingeni: Amanqaku amabini abalulekileyo entlungu
Ubungakanani boMlinganiselo oPhezulu
Iidayamitha ze-TGV ngoku zikwinqanaba le-micrometer (ukuya kuthi ga kwi-~30 μm) kunye nobunzulu obudlula i-10:1 aspect ratios. Iindlela zemveli zokubeka izinto ziyasokola ukufikelela ekugubungeleni ezantsi kunye neefilimu ezifanayo ezisecaleni, zihlala zishiya "ii-dead zones" ezingagqunywanga ezinciphisa ukusebenza konxibelelwano.
Ulawulo Olugqibeleleyo – Umbulali Ofihlakeleyo
Iikona kunye neengxolo ezidlula kwiindonga ezisecaleni zinokuba neembobo okanye amaqamza. Ezi ziphene zibangela ukujiya kokumelana kwendawo okanye iisekethe ezivulekileyo, ziphule ngokuthe ngqo unxibelelwano phakathi kweetships kunye nezixhobo. Ngoko ke ukucinezelwa kweziphene ngumceli mngeni ophambili wokugquma kwe-TGV.
3. Iindlela ezine zokugquma: Amandla kunye nokulinganiselwa
Ukususwa koMphunga woMzimba (i-PVD): Kuvuthiwe kodwa kunqongophele
Iinkqubo ezifana nokuphuma komoya kunye nokutshiza zibonelela ngeefilimu ezicocekileyo kakhulu nezinamathelayo. Nangona kunjalo, ngenxa yendalo yayo "yokubona umgca", iPVD iyasokola ngee-vias ezinomlinganiselo ophezulu kwaye ifanelekile kwii-vias ezingaphantsi kwe-5:1 aspect ratios.
Ukususwa koMphunga weKhemikhali (i-CVD): Umlinganiselo ophezulu woBume obufanelekileyo kodwa obiza kakhulu
I-CVD isebenzisa ii-precursors zegesi ezisasazeka ngeendonga ezisemacaleni, zivelisa iingubo ezifanayo nakwiindawo ezinomlinganiselo ophezulu. Nangona kunjalo, ubushushu obuphezulu kunye neemeko zoxinzelelo zibeka emngciphekweni wokonakalisa ii-substrates zeglasi, kwaye iindleko zezixhobo ziphezulu, nto leyo eyenza ukuba zifaneleke kakhulu kwiindlela eziphezulu zokusetyenziswa.
Ukuchithwa kwe-Electrochemical (ECD): Imveliso yoBuninzi eSebenza ngexabiso eliphantsi
Iifilimu eziqhuba i-ECD zibeka iipleyiti ze-conductive ngokunciphisa ii-ion zesinyithi kwiindonga ezisecaleni. Inika ixabiso eliphantsi kunye nomthamo ophezulu, ilungele imveliso yomthamo. Nangona kunjalo, ulawulo oluqinileyo loxinzelelo lwe-electrolyte kunye noxinano lwangoku lubalulekile—ukuphambuka kukhokelela kwiifilimu ezinemingxuma okanye ungcoliseko. Ihlala isetyenziswa kwii-vias ezinobubanzi obuyi-5–50 μm.
Ukubekwa kweAtomic Layer (ALD): Isisombululo esichanekileyo
I-ALD ifikelela kulawulo lobukhulu be-atomic-scale kunye nokuhambelana okuhle, okwenza ukuba ilungele ii-vias ze-aspect ratio ephezulu kakhulu. Isombulula umngeni wokugubungela kodwa ineengxaki zokubeka izinto kancinci kakhulu kunye neendleko eziphezulu. Ke ngoko, i-ALD igcinelwe ikakhulu ii-aerospace kunye nee-sensors ezithembekileyo kakhulu.
4. Ixabiso le-TGV Coating: Ukuqhuba Ukusebenza koNxibelelwano lwe-3D
Uphuhliso lwesantya – Uqhagamshelo oluthe ngqo oluhamba ngesantya esiphezulu
Kwiphakheji ye-2D, imiqondiso kufuneka ihambe imigama emide, nto leyo eyonyusa ilahleko. Ngokwenziwa kwe-TGV metallization, unxibelelwano lwe-chip-to-board kunye ne-chip-to-system luba lufutshane, luthe nkqo, kwaye alunalahleko ingako. Kwiiseva ze-HPC, ii-vias ezine-TGV-coated zivumela isantya sonxibelelwano lwe-CPU-to-memory/GPU ukuba siphucuke ngaphezulu kwe-30%, nto leyo enciphisa ukubambezeleka kwaye iphucula ukusebenza kakuhle kwenkqubo.
Ukusebenza kakuhle kwamandla – Ukulibaziseka okuphantsi kunye nokusetyenziswa kwamandla
Iindlela ezimfutshane zokunxibelelana zinciphisa ukulibaziseka, ngelixa iingubo ezithintela ukuxhathisa okuncinci zinciphisa ukufudumeza kweJoule. Umzekelo, ukupakishwa kweetshiphusi zefowuni ezisebenzisa iTGV kunokunciphisa ukusetyenziswa kwamandla angundoqo nge-15–20%, kwandisa ubomi bebhetri kwaye kuphucule amava omsebenzisi.
5. I-Zhenhua Vacuum: Izisombululo zokuGcoba zeTGV eziPhambili
Iingenelo zezixhobo
Ukwenziwa ngcono kwe-Deep-Via
Itekhnoloji yokugquma enzulu yomniniyo ivumela ukufakwa komgangatho wembewu ofanayo nokuba kwii-vias ezincinci njenge-30 μm kunye nomlinganiselo wobungakanani obungaphezulu kwe-10:1—ukusombulula enye yezona ngxaki zinzima kushishino.
Ukuphathwa kweSubstrate enokwenziwa ngokwezifiso
Ixhasa uluhlu lweesayizi zeglasi, kuquka i-600 × 600 mm / 510 × 515 mm, kunye nobukhulu obuphezulu ukuya kwiifomathi ezinkulu.
Ukuguquguquka kwenkqubo - Ukuhambelana kwezinto ezininzi
Ixhasa iifilimu eziqhuba umbane nezisebenzayo ezifana neCu, Ti, W, Ni, kunye nePt, ezihlangabezana neemfuno ezahlukeneyo zokusetyenziswa kombane kunye nokumelana nokugqwala.
Ukusebenza Okuzinzileyo Nokulungiswa Okulula
Ixhotyiswe ngeenkqubo zokulawula iinkqubo ezikrelekrele zokujonga ubunye befilimu ngexesha langempela, kunye noyilo oluyimodyuli ukuze kube lula ukuyilungisa kunye nexesha lokungasebenzi elincitshisiweyo.
Ububanzi besicelo
Isebenza kwiphakheji ephucukileyo ye-TGV/TSV/TMV, evumela ukufakwa kwembewu ngendlela efanayo kwii-vias ezinzulu ezinemilinganiselo ye-aspect ratios ye-10:1.
—Eli nqaku lipapashwe ngu izixhobo zokugquma nge-vacuum umenzi we-Zhenhua Vacuum
Ixesha leposi: Sep-27-2025