Intshayelelo: Ukusuka kwii-Interconnects ukuya kwi-Micron-Level Challenges
Ngokukhula ngokukhawuleza konxibelelwano lwe-5G, iiseva ze-AI, kunyeubuchwepheshe obuphambili bokupakisha,Ukwenziwa kwe-PCB (Printed Circuit Board) kuye kwaguquka kwaba yiplatifomu enoxinano olukhulu, eqhutywa yi-microvia. Ukwamkelwa kweebhodi ze-HDI, ii-PCB ezinee-multilayer, kunye ne-IC Substrates kubonisa utshintsho oluya kwixesha lokwenziwa kwe-micron-scale, apho ukubhola kudlala indima ebalulekileyo ekwenzeni uqhagamshelo lombane olunokuthenjwa phakathi kwee-interlayer (Via Interconnects). Nangona kunjalo, njengoko ububanzi bokubhola buncipha ngaphantsi kwe-0.2 mm kunye ne-0.1 mm, iindlela zoomatshini eziqhelekileyo azikwazi ukuhlangabezana neemfuno zezinto ezisetyenziswa rhoqo kunye nemveliso echanekileyo kakhulu, okwenza ukuba izixhobo ziguge, ukuqhekeka kwe-micro drill, kunye nemingeni engagungqiyo yomgangatho wodonga olunemingxunya ebalulekileyo echaphazela isivuno se-PCB kunye nokuhambelana kokwenziwa.
Imingeni yokucubungula kwiMicrovia Drilling
Kwimveliso ye-PCB enoxinano oluphezulu, ukubhola okuncinci yinkqubo ebuthathaka kakhulu elawulwa yimeko yesixhobo, indlela izinto ezisebenza ngayo, kunye nokuguquguquka kokusika. Kwisantya esiphezulu se-spindle, esidla ngokufikelela kumashumi amawaka ukuya kumakhulu amawaka e-RPM, umda wokusika omncinci kakhulu we-micro drills ubenza babe sengozini enkulu yeziphumo zobushushu, ezikhawulezisa ukuguguleka kwesixhobo, zonyuse i-coefficient of friction, kwaye zikhokelele kwiimeko zokusika ezingazinzanga. Njengoko umda wokusika usiba, ukususwa kwezinto kuyaguquka kube kukuguquguquka nokukrazula, okubangela uburhabaxa bodonga lwemingxuma, ukwakheka kwe-burr, kunye nokunamathela kwe-resin, zonke eziqokelelana kwii-microvia arrays ezixineneyo kwaye zinciphisa kakhulu uzinzo lwenkqubo.
Le ngxaki iba nkulu ngakumbi xa kusetyenzwa izinto ezisemgangathweni ophezulu ezifana ne-PTFE, i-BT resin, kunye nezinto ze-ABF, apho iimpawu ze-modulus ephantsi kunye nokunamathela okuphezulu zikhuthaza i-resin smear (Smear) kunye neziphumo ze-wicking (Wicking) kwiindonga ezidlulayo. Ezi ziphene zijika nge-geometry, zibeka emngciphekweni ukuchaneka kobukhulu, kwaye zichaphazela kakubi iinkqubo ezisezantsi kubandakanya i-metalization kunye nokuthembeka kwe-electroplating, nto leyo ebeka umngcipheko omkhulu kwizicelo eziphezulu ezifana ne-IC Substrates, apho ukunyamezela iziphene kuphantsi kakhulu.
Ukukhethwa koBunjineli boMphezulu kunye neTekhnoloji yokuGcoba
Ukuphucula ukusebenza kwe-micro drill, ubunjineli bomphezulu ngokusebenzisa ubuchwepheshe obuphambili bokugquma bubalulekile. Nangona i-electroless plating kunye ne-CVD (Chemical Vapor Deposition) zinokuphucula ubulukhuni bomphezulu ngandlela ithile, zinika imida kwizicelo ze-micro-scale, kubandakanya ukufana okungalunganga kobukhulu be-coating, ubushushu obuphezulu bokufaka, umonakalo onokubakho we-substrate, kunye noxinzelelo oluphezulu olushiyekileyo olukhokelela ekuqhekekeni kwe-coating phantsi kweemeko zoomatshini ezikhawulezayo.
Ngokwahlukileyo koko, iTekhnoloji yokuCoating iVacuum yePVD (Physical Vapor Deposition) inika isisombululo esifanelekileyo kwizicelo zokubhola ezincinci, njengoko ivumela ukufakwa kweefilimu ezixineneyo nezifanayo kubushushu obuphantsi ezinokunamathela okugqwesileyo, umlinganiselo wokungqubana ophantsi, kunye nokumelana nokuguguleka okuphuculweyo, iqinisekisa ukuzinza ngempumelelo kwenkqubo yokusika ngelixa inciphisa i-resin smear kwaye iphucula ukuthembeka kodonga lwemingxuma.
Isisombululo se-Zhenhua Vacuum Micro Drill Coating
Inkqubo yokuCoating ye-MFA0605 PVD yenzelwe ngokukodwa ukusetyenziswa kwezixhobo zokucoating ezisebenza kakuhle kwishishini le-PCB. Ixhotyiswe ngenkqubo yokucoca i-arc ion plating eyenzelwe ngokwayo, isusa ngokufanelekileyo ii-macro-particles eziveliswa ngexesha lokufakwa, iqinisekisa umgangatho ophezulu wefilimu kunye nokufana kwe-coating. Le nkqubo ixhasa i-Ta-C (tetrahedral amorphous carbon) coatings ephucukileyo, inika ubunzima obuphezulu kakhulu ukuya kuthi ga kwi-63 GPa, kunye ne-friction coefficient ephantsi, ukumelana nokugqwala okugqwesileyo, kunye nobomi bezixhobo obongezelelekileyo. Kwangaxeshanye, iyakwazi ukufaka uluhlu olubanzi lwezixhobo zokucoating ezisebenza kakuhle ezifana ne-AlTiN, AlCrN, TiCrAlN, TiAlSiN, kunye ne-CrN, okwenza ukuba ikwazi ukuguquguquka kakhulu kwi-PCB micro drills, izixhobo zokusika, ii-molds ezichanekileyo, kunye nezixhobo zeemoto, ngelixa igcina ukunamathela okuzinzileyo kwe-coating, ukuhambelana okuhle kwe-batch, kunye nokusebenza okuphezulu kwe-thin film deposition kwiindawo zemveliso enkulu.
Isiphelo
Njengoko ukwenziwa kwe-PCB kuqhubeka nokuqhubela phambili ukuya kuxinano oluphezulu, ii-vias ezincinci, kunye nezakhiwo ezintsonkothileyo, amandla okubhola amancinci abe yinto echaza umgangatho wemveliso kunye nokukhuphisana. Kule meko, ukugquma izixhobo akuseyonto eyongezelelweyo kodwa bubuchwepheshe obubalulekileyo obuvumelayo obumisela ngokuthe ngqo ubomi besixhobo, umgangatho wemingxuma, kunye nokuzinza kwenkqubo iyonke. Ukusebenzisa iTekhnoloji yokuGcoba i-PVD Vacuum, i-Zhenhua Vacuum iphucula rhoqo ukufana kokugquma, uzinzo lwefilimu, kunye nokuhambelana kwemveliso, okuvumela ukusebenza okuthembekileyo kwizixhobo ezisebenzisa amaza amaninzi kunye nokubhola i-microvia ecolekileyo kakhulu.
— Ipapashwe nguZhenhua Vacuum, omnye wabavelisi abalishumi abaphambilif izixhobo zokugquma nge-vacuum
Ixesha leposi: Matshi-16-2026