Kwiminyaka yakutshanje, ubukrelekrele bokwenziwa, ukuqhuba okuzimelayo, kunye neetships zekhompyutha ezisebenzayo kakhulu ziye zalawula imeko-bume ye-semiconductor. Njengoko ukusebenza kweetships kuqhubeka kusanda, ukupakisha okuqhelekileyo okunemilinganiselo emibini (2D) akusakwazi ukuhlangabezana neemfuno ezikhulayo zoxinano lonxibelelwano kunye nolawulo lobushushu. Eli shishini lisiya ngokukhawuleza kwixesha lokudibanisa okunemilinganiselo emithathu (3D).
Ukuze kuhlangatyezwane noxinano oluphezulu lwekhompyutha kunye nonxibelelwano ngaphakathi kwendawo encinci, indima yesiseko sokupakisha iye yaba yinto ebaluleke kakhulu kunangaphambili. Itekhnoloji ye-Through-Silicon Via (TSV) yayikade imela ukupakisha kwe-3D, kodwa ixabiso layo eliphezulu, ukuphunyezwa kwayo okulinganiselweyo, kunye nemida yezinto eziphathekayo ziye zathintela ukwamkelwa ngokubanzi. Ngoku, kuvela umncintiswano omtsha—itekhnoloji yokudibanisa ye-Through-Glass Via (TGV).
Umgaqo ophambili we-TGV kukwenza ii-micron-scale vias nge-insulating glass substrate, kulandele ukuzaliswa kwesinyithi ukuseka iindlela ezithe nkqo zokuqhuba phakathi kwee-chips okanye ii-substrates. Nangona le ngcamango ibonakala ilula, le nkqubo ibandakanya amanyathelo amaninzi achanekileyo apho inqanaba ngalinye lichaphazela ngokuthe ngqo ukuthembeka kokudibanisa. Phakathi kwezi, ukufakwa komaleko wembewu—okudla ngokunganakwa—kusebenza njengesiseko esifihliweyo esimisela impumelelo iyonke yokwenziwa kwesinyithi.
1. Ukuhamba kweNkqubo ye-TGV: Umaleko weMbewu—“Ibhuloho” yoQhubo lweMetallization
Inkqubo eqhelekileyo ye-TGV ibandakanya oku:
Ukulungiswa kwesiseko seglasi → Ukuchaneka ngokugrumba → Ukufakwa kwembewu kumaleko → Ukuzaliswa kwe-electroplating → Ukucwangciswa komphezulu.
Umaleko wembewu ngokusisiseko yifilimu ebhityileyo kakhulu ehambisa umoya ebekwe eludongeni lwangaphakathi lwee-vias zeglasi ezingezizo ezihambisa umoya. Ukuba isakhiwo se-TGV sibonwa njenge-"bridge" ethe nkqo yokudibanisa umbane, ngoko umaleko wembewu usebenza njengentambo yokuqala yentsimbi ebambelela kuloo bhulorho. Ngaphandle kwayo, i-electroplating elandelayo ayinakuqala, kwaye i-metallization efanayo ngaphakathi kwi-vias ayinakwenzeka.
Nangona kunjalo, umgangatho wokubekwa kwale maleko uxhomekeke kakhulu kwimo yejiyometri ye-via ngokwayo. Ukwahluka kwemilo ye-via kukhokelela kwimingeni eyahlukeneyo ekufezekiseni ukugubungela ngokulinganayo umaleko wembewu.
2. I-Via Morphology: Umngeni Owona Mngeni Wokugubungela Umgangatho Wembewu Ofanayo
Iiprofayili ze-TGV ziyahluka ngokuxhomekeke kwinkqubo yokubhola kunye nokukrola. Iimpawu zejometri eziqhelekileyo ziquka ii-vias ezimile okwebhabhathane, ezingaboniyo, ezithe nkqo, kunye nezimile okwe-V, nganye ibangela ubunzima bokubeka:
Ibhabhathane elihamba nge: Inxalenye ephakathi exineneyo ibangela isiphumo somthunzi, ithintela ii-athomu zesinyithi ukuba zingafikeleli kummandla ophakathi. Oku kubangela "iindawo ezifileyo" ezingagqunywanga apho ukuqhubeka kwe-electroplating kulahleka khona.
I-Blind via: Xa isiseko sivaliwe, ukuhamba kwegesi kuyathintelwa kwaye amandla e-ion ayancipha, nto leyo ekhokelela kwiifilimu ezincinci nezingenamatheli kakuhle ezinokuqhekeka phantsi koxinzelelo lwenkqubo elandelayo.
I-Vertical via: Ibonakaliswa yi-aspect ratio ephezulu kunye neendonga ezithe tye, ii-athomu zesinyithi zihamba ngomgca kwaye zihlala zisilela ukugquma i-via ezantsi ngokwaneleyo, nto leyo evelisa iindlela zokuhambisa ezingaphelelanga okanye i-plating voids.
I-V-shaped via: Iprofayili enciphileyo iphucula ukufana kwe-engile ye-deposition ukuya kwinqanaba elithile, kodwa i-taper egqithisileyo inokubangela ukungalingani kwefilimu kunye noxinzelelo, inciphise ukuthembeka kwesignali.
Kuzo zonke iimeko, umngeni ophambili kukufikelela ekugubungeleni isinyithi rhoqo, ngokufanayo, kwaye sinamathele kakuhle kwiindawo zeglasi ezinomlinganiselo ophezulu kunye namandla aphantsi ngokwemvelo. Nakuphi na ukungaqhubeki okanye ukunamathela okubi kumaleko wembewu kukhokelela kwimivalo, imifantu, okanye ukwahlukana ngexesha lokufakelwa kwe-electroplating, okubangela ukwanda kokumelana kokunxibelelana, ukulibaziseka kwesignali, okanye ukusilela ngokupheleleyo kwesixhobo.
Ukujongana nale mingeni kufuna izixhobo zokugquma nge-vacuum ezichanekileyo nezizinzileyo nezikwaziyo ukufikelela kwi-deep-via metallization. Kulapho isisombululo sokugquma nge-TGV se-ZHENHUA Vacuum sisebenza khona.
3. Isisombululo se-ZHENHUA Vacuum's TGV ngeMetallization
Iingenelo zezixhobo:
Ukuphuculwa kokuCoating okuNzulu
Itekhnoloji yokugquma enzulu yobunikazi ivumela ukufakwa komgangatho wembewu ofanayo nakwii-vias ezinobubanzi obuncinci njenge-30 μm, ukufikelela kwimilinganiselo yobungakanani ukuya kwi-10:1 kunye nokusombulula ngempumelelo imiba ye-metallization kwi-3D enzima ngokusebenzisa izakhiwo.
Ingenziwa ngokwezifiso kwiisayizi ezahlukeneyo ze-substrate
Iyahambelana neziseko zeglasi ezingama-600 × 600 mm, 510 × 515 mm, kunye neefomathi ezinkulu ukuhlangabezana neemfuno ezahlukeneyo zemveliso.
Ukuguquguquka kwenkqubo kwizinto ezininzi
Ixhasa ukubekwa kweCu, Ti, W, Ni, Pt kunye nezinye iifilimu ezincinci eziqhuba okanye ezisebenzayo, zanelisa iimfuno ezahlukeneyo zombane kunye nokumelana nokugqwala.
Ukusebenza Okuzinzileyo kunye noLondolozo Olulula
Ixhotyiswe ngenkqubo yokulawula ekrelekrele yokulungisa iiparameter ngokuzenzekelayo kunye nokubeka esweni ubukhulu befilimu ngexesha langempela. Uyilo lweModular luqinisekisa ukugcinwa okulula kunye nexesha lokungasebenzi elincitshisiweyo.
Ububanzi besicelo:
Ifanelekile kwiipakethe eziphambili ze-TGV/TSV/TMV, ivumela ukugqunywa kwembewu esemgangathweni ophezulu kwii-vias ezinemilinganiselo yobungakanani ukuya kuthi ga kwi-10:1.
Isiphelo: Ukwazi Ukubeka Imbewu Kwinqanaba Eliphezulu—Inyathelo Eliya Ekudityanisweni Kwe-3D Yokwenene
Ixabiso letekhnoloji ye-TGV alikho nje ekuboneleleni ngetshaneli entsha yokunxibelelana ngokuthe nkqo kodwa nasekuvumeleni uyilo lokwenyani lokunxibelelana olunemilinganiselo emithathu.
Eyona nto iphambili kolu tshintsho, ukwenziwa kwesinyithi kwimaleko yembewu kuhlala yeyona nkqubo ibalulekileyo kodwa ehlala ingahoywa.
Kuphela xa esi "siseko sokuhambisa" singabonakaliyo sifikelela kukulingana, uxinano, kunye nokunamathela okuqinileyo apho ukusebenza kwe-electroplating kunye nokudibanisa okulandelayo kuya kuqinisekiswa. Ukufikelela kwi-metal deposition esemgangathweni ophezulu ngaphakathi kwee-micron-scale glass vias kuye kwaba luphawu olucacileyo lobuchule bokupakisha obuphambili.
Ngokusebenzisa inkqubo entsha eqhubekayo kunye nophuhliso lwezixhobo, i-ZHENHUA Vacuum inika izisombululo zokugquma ezithembekileyo nezinemveliso ephezulu ze-TGV, inika amandla abavelisi bokupakisha ukuba bahambe ngokuzithemba ukusuka ekuqhutyweni kwee-pilot ukuya kwimveliso enkulu, ikhawulezisa ukufezekiswa ngokupheleleyo kokuhlanganiswa kwe-3D.
Kwixesha eliqhutywa ngamandla ekhompyutha akhulayo kunye noxinano lokudibanisa, oku kungaphezulu kokuqhubela phambili kwezixhobo—kumele inyathelo elibalulekileyo eliya ekuvuthweni kwetekhnoloji yokupakisha ye-3D yesizukulwana esilandelayo.
—Eli nqaku lipapashwe nguizixhobo zokugquma nge-vacuumumenzi we-Zhenhua Vacuum
Ixesha lokuthumela: Okthobha-13-2025