What is the difference between sputter coating and evaporation coating in vacuum coating equipment?
Evaporation heating target surface components are evaporated in the form of free radicals or ions, vacuum coating machine and processed on the substrate surface. The film-forming process (layer growth of vagus nerve structure with scattering island structure) forms a film.
It is difficult to ensure the uniformity of evaporation coating components. The vacuum coating machine and specific factors can be controlled, but due to the limited principle, the uniformity of evaporation coating components is not good for non single component coatings.
Sputtering can be simply understood as the use of electron or high-energy laser bombarding the target. The vacuum coating machine sputters the free radicals or ions of the surface components and deposits them on the substrate surface. In the film-forming process, experience and finally form the film. Equipment of vacuum coating machine
Sputtering is divided into many types. Vacuum coater and evaporation will become a main parameter at different sputtering rates.
The composition uniformity of laser sputtered PLD sputtered coating is easy to maintain, and the thickness uniformity of atomic scale is poor (because of pulse sputtering), and the control of crystal orientation (external) growth is also more general.
Hello, please leave your name and email here before chat online so that we won't miss your message and contact you smoothly.