What is reactive sputtering coating(PVD sputtering coating machine)?
If the sputtering material is also passed into the reactive gas at the same time, then it is reactive sputtering. There are two forms of reactive PVD sputtering coating:
One is the use of compound coating targets. During sputtering, the target compound is decomposed due to the effect of ion bombardment. For example, after using pure argon as the sputtering gas, the chemical composition of the newly produced film will be distorted. In order to make up for the loss of understanding of the components, a certain amount of reaction gas can be added to the argon to generate compounds, so as to ensure that the composition of the film remains unchanged.
The second is to use pure metals, alloys or mixtures as coating targets. In a mixed sputtering atmosphere composed of inert gas and reactive gas, a compound film is obtained by sputtering and chemical reaction.
The main difference between the two forms is the deposition rate and the reaction gas pressure. The reactive gases that can be used for reactive sputtering are: air, oxygen or water vapor (to generate oxide film), nitrogen or NH3, (to generate nitride film), oxygen plus nitrogen (to generate oxynitride film), H2S (to generate sulfide film) ), As (formation of arsenic film), etc. Some of these gases must pay attention to safety issues during use.
At present, the diameter of the cylindrical magnetron sputtering target has reached 2.5 meters, and the length of the planar magnetron sputtering target has reached 6.5m. The appearance of high-power and large-area magnetron sputtering targets has opened up a broad way for the application in mass industrial production.(PVD sputtering coating machine)
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