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What are the characteristics of vacuum magnetron sputtering coating process?

What are the characteristics of vacuum magnetron sputtering coating process?


What are the characteristics of vacuum magnetron sputtering coating process


Vacuum magnetron sputtering coating is especially suitable for reactive deposition coating. In fact, this process can deposit any thin film of oxide, carbide and nitride material. In addition, the process is also particularly suitable for the deposition of multi-layer film structures, including optical design, color films, wear-resistant coatings, nano-laminates, superlattice coatings, insulating films, etc. As early as 1970, there were high-quality optical thin film deposition cases, and a variety of optical film materials were developed. These materials include transparent conductive materials, semiconductors, polymers, oxides, carbides and nitrides, etc. As for fluorides, they are mostly used in evaporation coating processes.

vacuum coating machine


The main advantage of the magnetron sputtering process is that reactive or non-reactive coating processes can be used to deposit the film layers of these materials, and the film composition, film thickness, film thickness uniformity and film mechanical properties can be well controlled.

 The process has the following characteristics:


1High deposition rate. Due to use of the high-speed magnetron electrodes which can get large ion current , and its effectively improves the deposition rate and sputtering rate of this process. Compared with other sputtering coating processes, magnetron sputtering has high productivity and large output which is widely used in various industrial production.


2High power efficiency. Magnetron sputtering targets generally choose a voltage within the range of 200V-1000V, usually 600V, because the voltage of 600V is just within the highest effective range of power efficiency.


3Low sputtering energy. The magnetron target has a low applied voltage, and the magnetic field confines the plasma near the cathode, which can prevent higher-energy charged particles from being incident on the substrate.


4Low temperature of substrate . The anode can be used to conduct the electrons generated during discharge without the need to ground the substrate support, which can effectively reduce the electron bombardment of the substrate. Therefore, the temperature of the substrate is lower, which is very suitable for the coating of some plastic substrates that are not resistant to high temperatures.


5The surface of the magnetron sputtering target is etched unevenly. The uneven etching on the surface of the magnetron sputtering target is caused by the uneven magnetic field of the target. The local etching rate of the target is relatively large, which makes the effective utilization rate of the target material low (only 20%-30% utilization rate). Therefore, in order to increase the utilization rate of the target material, it is necessary to change the magnetic field distribution by certain means, or use a magnet to move in the cathode, which can also increase the utilization rate of the target material.


6 Composite target. It can produce composite target alloy film. At present, Ta-Ti alloy, (Tb-Dy)-Fe and Gb-Co alloy film have been successfully plated using composite magnetron target sputtering process. There are four types of composite target structures, namely round mosaic targets, cube mosaic targets, small square mosaic targets and sector mosaic targets, among which the sector mosaic target structure is the best.magnetron sputtering coating machine


7Wide range of applications. There are many elements that can be deposited in the magnetron sputtering process, the common ones are: Ag, Au, C, Co, Cu, Fe, Ge, Mo, Nb, Ni, Os, Cr, Pd, Pt, Re, Rh, Si, Ta , Ti, Zr, SiO₂, Al₂O₃, GaAs, U, W, SnO₂, etc.


Magnetron sputtering is the most widely used coating process among many high-quality thin film technologies. The use of new cathodes allows it to have a high target utilization rate and high deposition rate. The vacuum magnetron sputtering coating process is now widely used Used in the coating of large area substrates. This process is not only used for the deposition of single-layer films, but also for the deposition of multilayer films. In addition, it is also used for the coating of packaging films, optical films, and stickers in the winding process.

magnetron sputtering coating machine

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