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What are the characteristics of S gun magnetron sputtering coating machine technology?

What are the characteristics of S gun magnetron sputtering coating machine technology?

2021-04-24

What are the characteristics of S gun magnetron sputtering coating machine technology?

 


magnetron sputtering coating machine



The S gun magnetron sputtering coating machine technology started in 1968. Clarke developed a sputtering source through the magnetic channel inside the cylindrical surface. This sputtering source is called "S gun" or "sputter gun". The S-gun magnetron sputtering coating machine not only has the unique "high speed and low temperature" coating characteristics of magnetron sputtering, but also has a high target utilization rate due to the special cooling method and target shape of the sputtering target. The film thickness is uniform, the target sputtering density is high, and the target material is easy to replace.

 

1. Features of S gun magnetron sputtering structure:

 

The unique "S gun" magnetron sputtering target structure is composed of inverted cone cathode target, auxiliary anode, grounding shield, detachable shield ring, pole shoe, permanent magnet, water cooling jacket and other components. The wall of the pvd vacuum coating machine chamber is grounded; it is connected to the cathode target with a negative potential of hundreds of volts; the auxiliary anode can also be grounded (or connected to a positive potential of tens of volts); the substrate can also be grounded (biased or suspended) .

 

2. The gap between the target material and the water cooling jacket should have an appropriate design:

 

(1) When the target is not working, keep a certain gap between the target and the water cooling jacket to facilitate the replacement of the target;

 

(2) When the target is working, due to the heat, the target and the water cooling jacket will be close together, ensuring the heat dissipation effect of the target.

 

3. Auxiliary anode:

 

The auxiliary anode can absorb low-energy electrons to reduce the electron bombardment of the substrate.

 

4. Removable shield ring:

 

The detachable shield ring can prevent sputtering of non-target parts and can be disassembled to facilitate the removal of the film deposited on the ring.

 

5. Abnormal glow discharge:

 

On the surface of the cathode target, the ring-shaped magnet forms a curvilinear magnetic field, which forms an orthogonal electromagnetic field with the electric field. Electrons make a compound motion of spiral and cycloid in the electromagnetic field to produce abnormal glow discharge.

 

Except for the above-mentioned anode, cathode, shielding ring and cooling device, the functions of other parts are basically the same as those of other magnetron targets. The main advantages of S-gun magnetron sputtering coating machine technology are long life, high speed, large area, and low sputtering source temperature. Compared with non-magnetic sputtering sources, this magnetron sputtering source can achieve lower atmospheric pressure. Work, and has a higher sputtering coating rate. With these excellent characteristics, magnetron sputtering has become the most widely used PVD coating technology.


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