What are the advantages of LED ceramic substrate PVD coating technology？
Although the cost of LED ceramic packaging is higher than of metal substrates, because of the lower price of substrates and the increase in packaging integration, many international manufacturers or domestic companies have begun to use ceramic substrates for LED packaging heat dissipation materials. Of course, this also depends on a key factor-LED ceramic substrate coating technology.
For the technical advantages of LED package ceramic substrates, there are the following four points:
1. High surface flatness and high graphics accuracy.
2. Electroplating hole filling and laser drilling technology, the upper and lower surfaces of the ceramic substrate are vertically interconnected, which meets the packaging requirements of device integration and miniaturization, and is a true ceramic circuit board.
3. The thickness of the surface metal circuit layer is controllable (10-100um) to meet the needs of high current transmission and high temperature applications.
4. The LED ceramic substrate coating technology is adopted, which is carried out through a vacuum sputtering deposition process in a working environment below 200 ℃, which can meet the use of low temperature as low as -200 ℃, high temperature as high as 300 ℃ and sudden temperature changes. demand. The bonding strength between ceramic and metal is about 30MPa.
After 2013, in addition to traditional outdoor lights such as LED street lights and tunnel lights, and strong flashlights, the LED ceramic substrate coating technology has also expanded to UV LED lights, mobile phone flashes, and automotive headlights. Beginning in 2015, UV LED lights have developed rapidly and quickly become popular, with an average annual growth rate of more than 35%. In 2016, the global high-power LED packaging substrate has a market size of more than 10 billion yuan, of which only 2 billion yuan belongs to the field of ceramic substrates, and most of them are monopolized by Japanese companies and Taiwan. It is estimated that by 2021, the global high-power LED packaging substrate will have a market size of 15 billion yuan, of which ceramic substrates will account for about 3 billion yuan.
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