Vacuum coating equipment and Molecular sieve adsorption trap
The molecular sieve adsorption trap has a particularly large adsorption surface area. Using molecular sieve to adsorb the reflux vapor from the pump is better than the oxygen-free copper foil trap. The main advantages of the molecular sieve adsorption trap are its simple structure design, low price and avoiding the maintenance cost of operation.
There are many types of coating equipment, and there are different differences between different equipment. Below we are going to talk about the difference between sputtering and evaporation coating.
Evaporation heating target surface components in the form of free radicals or ions are evaporated, and processed on the surface of the substrate, the film formation process (scattering-island structure of the vagus nerve structure layered growth) to form a thin film.
The uniformity of the evaporation coating composition is not easy to guarantee, and specific factors can be controlled, but due to limited principles, the uniformity of the evaporation coating composition is not good for non-single-component coatings. Sputtering can be simply understood as the use of electrons or high-energy lasers to bombard the target, so that the surface components are sputtered in the form of free radicals or ions and deposited on the surface of the substrate during the film formation process, experience, and finally form a film. Equipment of vacuum coater Sputtering is divided into many types, and evaporation will become a major parameter at different points of sputtering rate.
The composition uniformity of the laser sputtering PLD sputtering coating is easy to maintain, and the atomic-scale thickness uniformity is poor (because of pulse sputtering), and the control of crystal orientation (outside) growth is more general.
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