Mukuchinja kwedhijitari kwanhasi, kukura kukuru kwekutumira data kuri kukonzerwa nekudyidzana kwakawanda mumafoni emazuva ano, ruzivo rweAR/VR rwakanyudzwa, uye mabasa akawanda emakombiyuta mumakombiyuta anoshanda zvakanyanya. Kurongedza kwekare kwe2D—nenzira refu dzekubatanidza uye kurasikirwa kukuru kwekutumira data—hakuchakwanisi kuputsa zvipingamupinyi zvekushanda.
Nekuda kweizvozvo, kuisa machip stacking uye kurongedza 3D kwave nzira huru yeindasitiri. Kuti zvikwanisike kubatana kwe3D kunoshanda zvakanaka, tekinoroji yeThrough Glass Via (TGV) yave yakasiyana nezvakanaka zvayo zvakasiyana, ichibva pakutsvaga nekuvandudza zvinhu kuenda kumaindasitiri. TGV yava kuva chinhu chikuru chinobatsira michina yemagetsi yechizvarwa chinotevera.
1. Tekinoroji yeTGV: "Bridge" rekubatana kwe3D
1.1 Pfungwa Yekutanga: Chii chinonzi TGV?
Chinhu chikuru cheTGV kugadzirwa kwema microvias akamira kuburikidza negirazi substrate. Aya ma vias anoshanda semabhiriji emagetsi, achibatanidza zvakananga machipisi akaunganidzwa kana zvikamu, zvichiita kuti masaini nemagetsi zvitumirwe. Kana zvichienzaniswa ne "planar wiring" yechinyakare, kubatana kwakamira kunopfupisa nzira dzekutumira uye kunosimbisa miniaturization yemudziyo uye kubatanidzwa kwakanyanya.
1.2 Nei Zvigadziko zveGirazi Zviri Zvishandiso zveChisikigo zveTGV
TGV inodarika TSV (Kuburikidza neSilicon Via) nekuda kwezvitatu zvakakosha zvegirazi:
Chinochinjika chemagetsi chepasi - chinodzivirira masaini ane mafrequency akakwira: Girazi rine chinochinjika chemagetsi chepasi, zvichideredza kurasikirwa kwemagetsi panguva yekutumira uye kuchengetedza kusimba kwechiratidzo mumashandisirwo ane mafrequency akakwira akadai se5G neHPC.
Kuenderana kwekuwedzera kwekupisa nesilicon - kuwedzera kuvimbika: Girazi rinoenderana zvakanyanya ne silicon's coefficient yekuwedzera kwekupisa, zvichideredza kushushikana kwe thermo-mechanical uye kukundikana panguva yekuchinja kwekupisa, nokudaro zvichiwedzera hupenyu hwemuchina.
Kujeka kwakanyanya kwemaziso - zvichiita kuti optoelectronic isanganiswe: Kusiyana nesilicon isingaonekwe, kujeka kwegirazi kunotsigira mashandisirwo emagetsi-optical hybrid. Semuenzaniso, mumamodule esilicon photonics, girazi rinogonesa kubatana kwemagetsi uye kutumira masaini emaziso; muma microdisplay eAR/VR, kujeka kunoderedza kuvharika kwemaziso uye kunatsiridza kupenya nekujeka.
1.3 Kubva kuTSV kuenda kuTGV: Kushanduka Kwechisikigo
TGV isati yatanga, TSV ndiyo yaive tekinoroji ye3D interconnect yainyanya kushandiswa. Zvisinei, TSV inosangana nematambudziko akawanda sezvo huwandu hwekubatanidza huchikwira:
Mutengo wakakwira: Kuyerera kwakaomarara kwemaitiro—kutema, kuputira, simbi—zvinoita kuti TSV isakodzere kugadzirwa kwezvinhu zvakakura.
Zvinonetsa nezvekuvimbika: Kusawirirana kwekuwedzera kwekupisa pakati pesilicon nezvimwe zvinhu kunowanzoita kuti majoini apwanyike kana kuti aputsike.
Kushandiswa kwakaganhurirwa: Kusaonekwa kweSilicon hakusanganisi TSV kubva kumapurogiramu e-optoelectronic anoda kujeka.
TGV inonyatsogadzirisa matambudziko aya, zvichiita kuti ive mhinduro inodiwa yechizvarwa chinotevera.
2. Kuburikidza neCoating: Core Enabler Inoita Kuti TGV Ishande
2.1 Ruzivo Rukuru: Pasina Kuputira, TGV ingori "Tubhu Isina Chinhu"
Magirazi egirazi anochengetedza simba uye haakwanise kufambisa magetsi. Kuti magetsi abatanidzwe, jira rinofambisa magetsi (rinowanzova firimu resimbi) rinofanira kuiswa padivi pemadziro emagetsi. Iri jira rinoshanda senzira yekuratidza kumhanya, kurasikirwa, uye kugadzikana. Machira asina kufanana kana asina kunaka anokonzera kuramba kwakanyanya, kuderedza simba remagetsi, kana kutovhura macircuit, zvichiita kuti kuburikidza nesimbi ive nzira yekubatsira tekinoroji yeTGV.
2.2 Matambudziko: Matambudziko Maviri Akakosha
Kufukidzwa kweChiyero Chepamusoro
Madhayamita eTGV ikozvino ari muhukuru hwema micrometer (kusvika ~30 μm) nekudzika kunodarika 10:1 aspect ratios. Nzira dzekare dzekuisa zvinhu dzinonetsa kuwana kufukidza pasi uye mafirimu akafanana emativi, kazhinji zvichisiya "nzvimbo dzakafa" dzisina kuputirwa dzinoderedza mashandiro ekubatanidza.
Kudzora Zvisina Kunaka - Muurayi Akavanzika
Makona nemakombama ari pamativi anowanzoita maburi kana mabubbles. Kukanganisika uku kunokonzera maspikes ekudzivirira ari munzvimbo imwe chete kana macircuit akavhurika, zvichikanganisa zvakananga kubatana pakati pemachipisi nemidziyo. Saka kudzvanywa kwezvikanganiso ndiko dambudziko guru rekuputira TGV.
3. Nzira ina dzekuputira: Simba nemiganhu
Kubviswa kweUtsi hweMuviri (PVD): Hwakakura asi Hushoma
Maitiro akadai se evaporation uye sputtering anopa mafirimu akachena kwazvo uye anonamatira zvakasimba. Zvisinei, nekuda kwe "line-of-sight" yayo, PVD inonetseka ne high aspect ratio vias uye inonyanya kukodzera ma vias ari pasi pe ~5:1 aspect ratios.
Kubviswa kweUtsi hweMakemikari (CVD): Chiyero cheAspect Ratio Chinokwanisa Asi Chinodhura
CVD inoshandisa magasi anogadzira zvinhu anopararira kuburikidza nemadziro emativi, zvichiita kuti pave nejira rakafanana kunyangwe muchimiro cheaspect ratio chakakwirira. Zvisinei, tembiricha yakakwira uye mamiriro ekumanikidzwa zvinogona kukanganisa magirazi, uye mutengo wemidziyo wakakwira, zvichiita kuti ive yakakodzera kushandiswa kwepamusoro-soro.
Kugadzwa kweElectrochemical (ECD): Kugadzirwa kweMazhinji Kunoshanda Nemutengo Wakawanda
Mafirimu eECD anoisa ma "conductive films" nekuderedza ma "metal ions" kuburikidza nemadziro emativi. Izvi zvinopa mari shoma uye simba rakawanda, zvakanakira kugadzirwa kwe "volume". Zvisinei, kudzora kwakasimba kwe "electrolyte concentration" uye "current density" kwakakosha—kutsauka kunotungamira kumafirimu ane maburi kana kusvibiswa. Kazhinji inoiswa kuma "vias" ane dhayamita ye5–50 μm.
Kugadzika kweAtomic Layer (ALD): Mhinduro Yakarurama
ALD inokwanisa kudzora ukobvu hweatomu uye ine hunyanzvi hwekuita zvinoenderana nezvinodiwa, zvichiita kuti ive yakakodzera kune mavhisi ehuwandu hweaspect ratio akakwira. Inogadzirisa dambudziko rekuvhara asi ine mwero wekudzika kwekuisa zvinhu zvishoma nezvishoma uye inodhura zvakanyanya. Saka, ALD inonyanya kuchengeterwa masensa emuchadenga uye akavimbika zvakanyanya.
4. Kukosha kweTGV Coating: Kufambisa 3D Interconnection Performance
Kubudirira Kwekukurumidza - Kubatana Kwakananga Kwekukurumidza Kwakanyanya
Mumapakeji e2D, masaini anofanirwa kufamba daro refu, zvichiwedzera kurasikirwa. Nekugadzirwa kwesimbi kweTGV, kubatana kwe chip-to-board uye chip-to-system kunova kupfupi, kwakamira, uye kushoma kurasikirwa. Mumaseva eHPC, ma vias ane TGV anogonesa kumhanya kwekutaurirana kweCPU-to-memory/GPU kuvandudzwa neanopfuura 30%, zvichideredza kunonoka uye kuwedzera kushanda zvakanaka kwesystem.
Kushanda Nesimba - Kunonoka Kushoma uye Kushandiswa Kwesimba
Nzira pfupi dzekubatanidza dzinoderedza kunonoka, nepo machira asingapindi simba zvakanyanya anoderedza kupisa kweJoule. Semuenzaniso, kurongedza machipisi efoni ane TGV kunogona kuderedza kushandiswa kwesimba guru ne15–20%, kuwedzera hupenyu hwebhatiri uye kuvandudza ruzivo rwemushandisi.
5. Zhenhua Vacuum: Mhinduro dzepamusoro dzeTGV Coating
Zvakanakira Midziyo
Kugadzirisa Kudzika-Kupfuura
Tekinoroji yekuputira yakadzama yemunhu inogonesa kuisa mbeu dzakafanana kunyangwe muzvidimbu zvidiki se30 μm zvine chiyero chinopfuura 10:1—kugadzirisa rimwe rematambudziko akaomesesa muindasitiri.
Kubata Substrate Kunogona Kugadziriswa
Inotsigira saizi dzakasiyana dzegirazi, kusanganisira 600 × 600 mm / 510 × 515 mm, ine kugona kukura kune mafomati akakura.
Kuchinjika Kwemaitiro - Kuenderana Kwezvinhu Zvakawanda
Inotsigira mafirimu anofambisa mhepo uye anoshanda akadai seCu, Ti, W, Ni, uye Pt, ichizadzisa zvinodiwa zvakasiyana-siyana zvekushandisa kuti irambe ngura uye kudonha.
Kushanda Kwakagadzikana uye Kugadzirisa Kuri Nyore
Yakashongedzerwa nemasisitimu ekudzora maitiro akangwara ekutarisa kufanana kweukobvu hwefirimu panguva chaiyo, uye dhizaini yemodular kuti ive nyore kugadzirisa uye kuderedza nguva yekushanda.
Chikamu Chekushandisa
Inoshanda paTGV/TSV/TMV advanced packaging, zvichiita kuti mbeu ikwanise kuiswa mu deep vias ine aspect ratios ye10:1.
—Nyaya iyi yakaburitswa na midziyo yekunamira ye vacuum mugadziri Zhenhua Vacuum
Nguva yekutumira: Gunyana-27-2025