Kubva kuTSV kuenda kuTGV: Kushanduka kwezvinhu uye Musiyano wekugadzira muThrough-Via Interconnects

Mukushanduka kwetekinoroji yekurongedza ma semiconductor, vertical interconnects yagara iri chinhu chakakosha chinoona mashandiro esystem, footprint, uye kushandiswa kwesimba. Kubva pakugadzira waya dzekubatanidza ne flip-chip kusvika pakubuda kwema 3D stacked ICs, indasitiri iyi yanga ichitsvaga mhinduro dzekubatanidza mashandisirwo akawandisa uye mapfupi.

Mumamiriro ezvinhu aya, TSV (Kuburikidza neSilicon Via) neTGV (Kuburikidza neGlass Via) dzakabuda sematekinoroji maviri makuru ekubatanidza ma vertical interconnect. Dzinosiyana muhurongwa hwezvinhu, maitiro ekugadzira, hunhu hwekushanda, uye nzvimbo dzekushandisa, zvichiratidza chinhu chakakosha mukugadzirwa kwemapakeji echizvarwa chinotevera.

I. TSV: Pioneer we3D Packaging
1. Nheyo yeUnyanzvi

TSV inoreva ma "high-aspect-ratio vias" akacherwa kuburikidza ne "silicon substrate" (kazhinji anosvika makumi kusvika mazana ema microns akadzika), zvichiteverwa nekuumbwa kwe "insulating layer", "metal seed layer", uye "metal fill" (kazhinji copper) pamadziro e "via". Ma "vertical vias" aya anogonesa kubatana kwemagetsi nekukurumidza pakati pe "stacked chip layers".

2. Kuyerera Kwemaitiro

Maitiro akajairika ekugadzira TSV anosanganisira:

Kuchera Silicon Yakadzika (DRIE): Gadzira zviyereso zvemhando yepamusoro muwafer yesilicon.

Kuisa simbi muzvikamu zvesimbi: Kazhinji PECVD inoisa SiO₂ kuti ibvise simbi kubva musilicon substrate nemagetsi.

Kuisa Mbeu muchikamu chesimbi uye Kuisa Electroplating: Kuisa PVD muchikamu chesimbi kunoteverwa nekuisa electroplating yemhangura.

Kupukuta Kwemakemikari (CMP): Bvisa simbi yakawandisa kuti uite pamusoro wakarongwa.

3. Zvakanakira uye Zvisina Kukwana

TSV inopa nzira pfupi zvikuru dzekubatanidza, kunonoka kwesignali kwakaderera, kushandiswa kwesimba kwakaderera, uye bandwidth yakakwira, zvichiita kuti ive chinhu chakakosha pakushandisa komputa inoshanda zvakanyanya uye ndangariro yebandwidth yakakwira.

Zvisinei, TSV inewo miganhu:

Matambudziko ekumanikidzwa kwekupisa: Kusawirirana kukuru muCTE pakati pesilicon nemhangura kunogona kuderedza kuvimbika.

Mutengo wepamusoro wekugadzira: Kucheka kwakadzika, electroplating, uye CMP zvakaoma uye zvinokanganisa goho.

Matambudziko ekudzivirira magetsi: Ukobvu uye kufanana kwechikamu chekudzivirira magetsi kunokanganisa zvakananga simba re dielectric.

Sezvo kuwanda kwekubatanidzwa kwemachipisi kuri kuwedzera, kusawirirana pakati pegoho nemari kwakaita kuti pave nekutsvaga zvimwe zvinhu—zvichigadzira mukana weTGV.

II. TGV: Kugadzira Zvishandiso Zvine Magirazi
1. Nheyo yeUnyanzvi

TGV inoshandisa magirazi panzvimbo pesilicon. Magirazi akagadzirwa ne laser drilling kana wet etching, zvichiteverwa nekuisa simbi seed layer uye electroplating, zvichiita kuti pave ne vertical interconnects dzakafanana neTSV.

Girazi rinopa kuvharwa kwemagetsi kwakanaka, kusachinja-chinja kwemagetsi kwakaderera (Dk), kurasikirwa kwemagetsi kwakaderera (Df), uye kugadzikana kwakakura, zvichiita kuti TGV ive inokwezva zvikuru pakutumira masaini ekumhanya kwepamusoro uye kurongedza maoptoelectronic.

2. Kuyerera Kwemaitiro

Matanho makuru ekugadzira TGV anosanganisira:

Kuboorwa neLaser: MaLaser anokurumidza kugadzira ma microvia mugirazi ane dhayamita inowanzova pakati pe20–150 μm.

Kuisa Mbeu muchikamu: PVD, senge magnetron sputtering, inoisa chikamu chakafanana che conductive layer pamadziro.

Kuisa Electroplating muSimbi: Chiumbwa chemhangura kana nickel-copper chinozadza mavias kuti agadzire kubatana kwemagetsi kuburikidza negirazi.

Kuronga uye Kugadzira Mapatani: Inogonesa kubatana kwema multi-layer kana kubatana nema IC chips.

3. Zvakanakira

Kana ichienzaniswa neTSV, TGV inoratidza mabhenefiti akati wandei:

Kurasikirwa kwe dielectric kwakaderera: Glass Dk inenge 1/3 yesilicon, zvichideredza kurasikirwa kwechiratidzo che crosstalk uye insertion.

Kugadzikana kwakanyanya kwekupisa: CTE iri pedyo nesimbi, zvichideredza kushushikana kwekupisa.

Kujeka kwemaziso: Kunotsigira kubatanidzwa kwe optoelectronic mu photonics uye sensors.

Mutengo unodzorwa: Kuboorwa kwegirazi neLaser kuri kukura, zvakakodzera kugadzirwa kwepaneru yakakura munzvimbo yakakura.

III. TSV vs TGV: Kuenzanisa uye Madhomini eKushandisa

TSV ichiri sarudzo huru yekuisa zvinhu mu 3D logic ne memory 3D stacking, nepo TGV iri kukura nekukurumidza muSiP, optoelectronic integration, sensors, uye RF devices.

Nekukura kwegirazi re substrate kusvika pakuisa zvinhu padanho repamusoro (PLP), TGV iri kuva nzvimbo yakanaka yekubatanidza kutaurirana kwe5G, radar yemotokari, AR optics, uye Mini/Micro LED packaging.

IV. Kubva kuSilicon kusvika kuGirazi: Mabhenefiti eSisitimu

Kuiswa kwegirazi hakusi kungotsiva zvinhu chete; kunomiririra shanduko mupfungwa dzekugadzira magadzirirwo ehurongwa.

Kushanda kwemagetsi: Girazi reDk shoma rinoderedza zvakanyanya kunonoka kwemasaini uye kushandiswa kwesimba.

Kusimba kwechimiro: TGV inopa kurongeka kwakanyanya uye kudzika kwepage yekurongedza munzvimbo yakakura.

Kuchinjika pakugadzira: Kugadziriswa neLaser pamwe chete nePVD zvinoita kuti maitiro acho aenderane zvakanyanya uye akwanise kukura.

Kunyanya, pakubatanidzwa kwe optoelectronic, kujeka kwegirazi kunogonesa magadzirirwo emapakeji uko substrate inotsigira kwete chete kubatana kwemagetsi asiwo ma waveguides, ma lens, uye ma sensor windows, izvo zvakaoma kuita neTSV.

V. ZhenHua Vacuum TGV Seed Layer Coating Solution

Zvakanakira Midziyo:

Kugadzirisa Kuvhara Zvakadzika: Tekinoroji yekubvisa zvakadzika kubva pamadziro inokwanisa kubata ma-vias madiki se30 μm ane chiyero che>10:1, ichigadzirisa matambudziko akaomarara kubva pamadziro.

Inogona kugadziriswa yehukuru hwakasiyana: Inotsigira magirazi anosanganisira 600×600 mm, 510×515 mm, kana kuti hombe.

Kuchinjika Kwemaitiro: Inoenderana neCu, Ti, Ni, Pt, uye mamwe mafirimu matete anofambisa kana anoshanda kuti asangane nezvinodiwa zvakasiyana-siyana zvemagetsi uye zvekudzivirira ngura.

Kushanda Kwakagadzikana & Kugadzirisa Zviri Nyore: Yakashongedzerwa nehunyanzvi hwekudzora ma parameter otomatiki uye kutarisa kufanana kweukobvu panguva chaiyo; dhizaini ye modular inobatsira kugadzirisa uye inoderedza nguva yekushanda.

Mashandisirwo: Akakodzera kurongedza kwepamusoro kweTGV/TSV/TMV, zvichiita kuti ikwanise kuputirwa nembeu ine chiyero che10:1.

—Nyaya iyi yakaburitswa namidziyo yekunamira ye vacuum mugadziri Zhenhua Vacuum