Mumakore achangopfuura, njere dzekugadzira, kutyaira kwega, uye machipisi emakombiyuta ane simba repamusoro zvave zvichitonga mamiriro e semiconductor. Sezvo mashandiro echip achiramba achikwira, kurongedza kwemhando mbiri (2D) hakuchakwanisi kusangana nezvinodiwa zviri kuwedzera zvekubatana kwemagetsi uye manejimendi yekupisa. Indasitiri iyi iri kufamba nekukurumidza kuenda kunguva yekubatanidzwa kwezvikamu zvitatu (3D).
Kuti zvikwanise kuenderana nehuwandu hwakawanda hwemakombiyuta uye kubatana mukati menzvimbo diki, basa rechikamu chekurongedza rave rakakosha kupfuura kare. Tekinoroji yeThrough-Silicon Via (TSV) yaimbove chiratidzo chekurongedza kwe3D, asi mutengo wayo wepamusoro, kugona kwayo kushoma, uye zvipingamupinyi zvezvinhu zvakatadzisa kushandiswa kwakapararira. Iye zvino, kune imwe makwikwi matsva ari kubuda—tekinoroji yeThrough-Glass Via (TGV).
Nheyo huru yeTGV ndeyekugadzira micron-scale vias kuburikidza ne insulating glass substrate, ichiteverwa ne simbi yekuzadza kuti pave nenzira dzakamira pakati pema chips kana substrates. Kunyange zvazvo pfungwa iyi ichiita seiri nyore, maitiro acho anosanganisira matanho akawanda akanyatsojeka apo nhanho yega yega inokanganisa zvakananga kuvimbika kwe interconnect. Pakati peizvi, kuiswa kwe seed layer - kazhinji kusingatariswe - kunoshanda sehwaro hwakavanzika hunosarudza kubudirira kwe metallization.
1. Kuyerera kweTGV Process: Mbeu Layer—“Bridge” Rinofambisa Metallization
Maitiro akajairika eTGV anosanganisira:
Kugadzirira girazi substrate → Kunyatsogadzira nekuboora → Kuisa mbeu muchikamu → Kuzadza nemagetsi → Kuronga pamusoro.
Rutivi rwembeu ifirimu rakatetepa kwazvo rinofambisa mhepo rakaiswa pamadziro emukati megirazi risingafambise mhepo. Kana chimiro cheTGV chichionekwa se "bhiriji" rakamira rekubatanidza magetsi, saka rutivi rwembeu runoshanda setambo yekutanga yesimbi inonamira bhiriji iroro. Pasina iyo, electroplating inotevera haigone kutanga, uye simbi yakafanana mukati memugwagwa inova isingagoneki.
Zvisinei, kunaka kwechikamu ichi kunoenderana zvakanyanya nechimiro chechimiro chacho. Kusiyana kwemaumbirwo echikamu ichi kunotungamira kune matambudziko akasiyana mukuwana chifukidzo chakafanana chechikamu chembeu.
2. Via Morphology: Dambudziko Guru reKufukidzwa kweMbeu Yakafanana
Magadzirirwo eTGV kuburikidza nemaprofiles anosiyana zvichienderana nemaitiro ekuboorera uye etching. Maitiro akafanana ejometri anosanganisira ma vias akaita seshavishavi, asingaonekwi, akamira, uye akaita seV, imwe neimwe ichiratidza matambudziko akasiyana ekuisa:
Shashangu kuburikidza: Chikamu chepakati chakamanikana chinokonzera mumvuri, zvichidzivirira maatomu esimbi kusvika munzvimbo yepakati. Izvi zvinoguma ne "nzvimbo dzisina kuvharwa" dzisina kuvharwa uko kuramba kwe electroplating kunorasika.
Kuburikidza ne: Kana pasi pakavharwa, kufamba kwegasi kunodzikira uye simba remaion rinodzikira, zvichikonzera mafirimu matete uye asina kunamira zvakanaka anogona kupatsanuka kana paine kushushikana kunotevera.
Kupfuura nepadivi: Zvichiratidzwa nehukuru hweaspect ratio uye mativi akatwasuka, maatomu esimbi anofamba akatwasuka uye anowanzo tadza kufukidza pasi pebhazi zvakanaka, zvichiita kuti nzira dzekufambisa dzisakwane kana kuti plating voids.
Yakaumbwa neV kuburikidza: Iyo tapered profile inovandudza kufanana kwekona yekuisa kusvika pamwero wakati, asi taper yakawandisa inogona kukonzera kusafanana kweukobvu hwefirimu uye kushushikana, zvichideredza kusimba kwechiratidzo.
Muzviitiko zvese, dambudziko guru nderekuwana simbi yakavharwa zvakanaka, yakafanana, uye yakabatana zvakanaka pamusoro pegirazi rine simba rakaderera. Chero kusabatana kana kusabatana zvakanaka muchikamu chembeu kunotungamira kumaburi, kutsemuka, kana kucheka panguva yekuisa ma electroplating, zvichikonzera kuwedzera kwekusawirirana kwekubatanidza, kunonoka kwechiratidzo, kana kutadza kushanda kwemudziyo zvachose.
Kugadzirisa matambudziko aya kunoda michina yekuputira vacuum yakanyatsogadzirwa uye yakasimba inokwanisa kuita kuti simbi inyatsobuda. Apa ndipo panoshanda mhinduro yekuvhara yeZHENHUA Vacuum's TGV.
3. ZHENHUA Vacuum's TGV Via Metallization Solution
Zvakanakira Midziyo:
Kugadzirisa Kubata Kwakadzika-Kuburikidza Nekuputira
Tekinoroji yekuputira yakadzama yeproprietary inobvumira kuiswa kwembeu zvakaenzana kunyangwe kune mavia ane dhayamita diki se30 μm, zvichiita kuti aspect ratios isvike 10:1 uye kugadzirisa zvinobudirira matambudziko esimbi mu3D yakaoma kuburikidza nemagadzirirwo.
Inogona kugadziriswa yehukuru hwakasiyana-siyana hwe substrate
Inoenderana negirazi re600 × 600 mm, 510 × 515 mm, uye mafomati makuru kuti ienderane nezvinodiwa zvakasiyana-siyana zvekugadzira.
Kuchinjika Kwemaitiro Muzvinhu Zvakawanda
Inotsigira kuiswa kweCu, Ti, W, Ni, Pt nedzimwe firimu dzinofambisa kana dzinoshanda, zvichigutsa zvinodiwa zvakasiyana zvemagetsi uye zvinodzivirira ngura.
Kushanda Kwakagadzikana & Kugadzirisa Zviri Nyore
Yakashongedzerwa nehurongwa hwekudzora hwakangwara hwekugadzirisa otomatiki maparameter uye kutarisa ukobvu hwefirimu panguva chaiyo. Dhizaini yemodular inoita kuti kugadzirisa kuve nyore uye nguva shoma yekushanda ideredzwe.
Mashandisirwo Ekushandisa:
Yakakodzera kurongedza kwepamusoro kweTGV/TSV/TMV, zvichiita kuti ikwanise kupfekedzwa zvakanaka muzvikamu zvembeu zvine aspect ratios inosvika 10:1.
Mhedziso: Kugona Kugadzira Mbeu—Nhanho Yekubatanidza 3D Yechokwadi
Kukosha kwetekinoroji yeTGV hakusi chete mukupa nzira itsva yekubatanidza mativi maviri asi mukugonesa dhizaini chaiyo yekubatanidza mativi matatu.
Pakati pekuchinja uku, kushandiswa kwesimbi muzvikamu zvembeu kunoramba kuri iko kwakakosha zvikuru asi kunowanzo regeredzwa.
Kana "nheyo inofambisa mhepo" iyi isingaoneki yasvika pakuenzana, kuwanda, uye kunamira kwakasimba ndipo chete panogona kuve nechokwadi chekuti kushanda kwe electroplating nekubatanidza zvinhu kunotevera kuchaitwa. Kuwana simbi yepamusoro-soro mukati memagirazi e micron-scale kwave chiratidzo chehunyanzvi hwepamusoro hwekurongedza.
Kuburikidza nekuvandudzwa kwemaitiro uye kushanduka kwemidziyo, ZHENHUA Vacuum inopa mhinduro dzakavimbika, dzinobereka zvakawanda dzeTGV kuburikidza nekuputira, ichipa simba vagadziri vemapakeji kuti vafambe nechivimbo kubva pakufamba kwemapilot kuenda pakugadzirwa kwakawanda, zvichikurumidzisa kuzadzikiswa kwakazara kwekubatanidzwa kwe3D.
Munguva ino ine simba remakombiyuta riri kuramba richikura uye huwandu hwemakombiyuta ari kubatanidzwa, izvi zvinopfuura kufambira mberi kwemidziyo chete—zvinomiririra danho guru rekukura kwetekinoroji yekurongedza ye3D yechizvarwa chinotevera.
—Nyaya iyi yakaburitswa namidziyo yekunamira ye vacuummugadziri Zhenhua Vacuum
Nguva yekutumira: Gumiguru-13-2025