Mu iterambere ry’ikoranabuhanga ryo gupakira ibikoresho bya semiconductor, imiyoboro ihagaze yahoraga ari ikintu cy’ingenzi kigena imikorere ya sisitemu, aho ikoreshwa ry’amashanyarazi riherereye, n’ikoreshwa ry’ingufu. Kuva ku ikubitiro rya tekiniki zo guhuza insinga n’izikoresha chip kugeza ku ivuka rya 3D stacked ICs, inganda zagiye zishaka ibisubizo by’ubucucike bwinshi n’ubugufi bw’imiyoboro ihagaze.
Muri uru rwego, TSV (Kunyura kuri Silicon Via) na TGV (Kunyura kuri Glass Via) byagaragaye nk'ikoranabuhanga rikuru rihuza ibikoresho. Bitandukanye mu buryo bw'ibikoresho, uburyo bwo gukora, imikorere, n'uburyo bwo gukoresha, bikaba ari ingenzi mu iterambere ry'ibipaki by'ibikoresho byo mu gisekuru gitaha.
I. TSV: Umuhanga mu gupakira ibintu mu buryo bwa 3D
1. Ihame rya tekiniki
TSV yerekeza ku bipimo by’ubuso buhanitse byashushanyijwe binyuze muri substrate ya silikoni (ubusanzwe igera kuri mikoroni icumi kugeza ku magana), hagakurikiraho ikorwa ry’urwego rukingira ubushyuhe, urwego rw’imbuto z’icyuma, n’icyuma cyuzuye (ubusanzwe umuringa) ku nkuta z’ibipimo. Ibi bipimo bihagaze bifasha guhuza amashanyarazi yihuta cyane hagati y’ibipimo by’ibice byashyizwe hamwe.
2. Inzira y'Ibikorwa
Uburyo busanzwe bwo gukora TSV burimo:
Gushushanya Silicone Imbitse (DRIE): Kora vias zifite imiterere yo hejuru muri wafer ya silicon.
Gushyiramo icyuma gikingira: Ubusanzwe icyuma gishyirwamo SiO₂ cya PECVD kugira ngo gikuremo icyuma gitwikiriye icyuma cya silicon mu buryo bw'amashanyarazi.
Gushyira imbuto mu cyiciro no kuzisiga amashanyarazi: Gushyira PVD mu gice cy'imbuto cy'icyuma bikurikirwa no kuzisiga umuringa.
Gutunganya ibyuma bikoresha imiti (CMP): Kuraho icyuma gisigaye kugira ngo ubone ubuso bumeze nk'ubufite imiterere.
3. Ibyiza n'imbogamizi
TSV itanga inzira ngufi cyane zo guhuza amakuru, gutinda guke k'amakuru, ikoreshwa ry'ingufu nke, hamwe n'uburyo bwo kugenzura amakuru buri hejuru, bigatuma iba ingenzi mu gukoresha mudasobwa zikora neza no kubika amakuru mu buryo bworoshye.
Ariko, TSV ifite kandi imbogamizi:
Ibibazo by'ubushyuhe: Kutageranya cyane kwa CTE hagati ya silikoni na umuringa bishobora kugabanya ubwizerwe.
Igiciro cyo hejuru cyo gutunganya: Gushushanya mu buryo bwimbitse, gukoresha amashanyarazi, na CMP ni ibintu bigoye kandi bigabanya umusaruro.
Imbogamizi ku bushyuhe bw'amashanyarazi: Ubunini n'ubugari bw'urwego rw'ubushyuhe bigira ingaruka ku buryo butaziguye ku mbaraga za dielectric.
Uko ubucucike bw'ibikoresho byo guhuza utumashini (chip integration) bwiyongera, amakimbirane hagati y'umusaruro n'ikiguzi byatumye habaho ubushakashatsi ku bikoresho bishya—bitanga amahirwe yo gukoresha TGV.
II. TGV: Udushya mu guhuza hakoreshejwe ikirahure
1. Ihame rya tekiniki
TGV ikoresha substrates z'ibirahuri aho gukoresha silikoni. Ibikoresho bigezweho bikozwe hakoreshejwe uburyo bwa laser cyangwa se icukurwa ry'amazi, bigakurikirwa no gushyiramo urwego rw'imbuto z'icyuma no gusigwa hakoreshejwe electroplating, bigatuma habaho guhuza ibintu nk'uko TSV ibikora.
Ikirahure gitanga ubushyuhe bwiza bw'amashanyarazi, amashanyarazi adahindagurika cyane (Dk), amashanyarazi adahindagurika cyane (Df), kandi gitanga ubuziranenge budasanzwe, bigatuma TGV irushaho kuba nziza mu kohereza ibimenyetso byihuse no gupakira ibikoresho mu buryo bwa optoelectronic.
2. Inzira y'Ibikorwa
Intambwe z'ingenzi mu gukora TGV zirimo:
Gucukura hakoreshejwe laser: Laser yihuta cyane ikora microvias mu kirahure ifite uburebure busanzwe buri hagati ya 20–150 μm.
Gutera imbuto mu buryo bwa "Layer Layer": PVD, nko gutera magnetron, ishyira urwego rumwe ruyobora amazi ku nkuta.
Gushyiramo amashanyarazi mu byuma: Ifu y'umuringa cyangwa nikeli-umuringa yuzura imiyoboro y'amashanyarazi kugira ngo ikore imiyoboro y'amashanyarazi inyura mu kirahuri.
Gushyira hamwe no Gushushanya: Bituma habaho guhuza cyangwa guhuza ibice byinshi bya IC.
3. Ibyiza
Ugereranyije na TSV, TGV igaragaza ibyiza byinshi:
Igihombo gito cya dielectric: Glass Dk ni hafi 1/3 cya silikoni, bigabanya igihombo cy'amajwi n'igihombo cyo kwinjira.
Ubushyuhe buhamye cyane: CTE yegereye ibyuma, bigabanya ubushyuhe.
Gutanga urumuri rw'amajwi: Bishyigikira guhuza optoelectronic muri fotoniki na sensor.
Ikiguzi gishoboka kugenzurwa: Gucukura no gutunganya ibirahuri hakoreshejwe laser biri gukura, bikwiriye gukorwa mu gice kinini cy’ibirahuri.
III. TSV vs TGV: Igereranya n'Ikoreshwa ry'Imbuga
| Ikintu | TSV (Inyuze kuri Silicon Via) | TGV (Inyura mu Girazi) |
| Inzu ntoya | Silikoni imwe ikoze mu cyuma gitukura | Ibirahuri byihariye (Borofloat, Corning, Schott, nibindi) |
| Ingano y'umwobo | 5–50 μm | 20–150 μm |
| Ubujyakuzimu bw'Umwobo | 30–100 μm | 100–400 μm |
| Ubwikorezi bw'ubushyuhe | Hakenewe urwego rw'inyongera rwo kwirinda ubushyuhe | Ikirahure gikingira ubushyuhe mu buryo bw'inyuma |
| Guhuza igipimo cy'ubushyuhe mu kwagura ubushyuhe | Itandukaniro rikomeye ugereranije na Cu | Kimwe na Cu, ubushyuhe buke |
| Ikiguzi cy'ibikorwa | Hejuru | Hasi cyane |
| Porogaramu | Uburyo bwo gushyira hamwe 3D mu buryo bwa Logic/Memory | SiP, sensors, gupakira ibikoresho by'ikoranabuhanga, antene, MEMS |
TSV ikomeje kuba amahitamo akomeye yo gushyiramo logique ifite imikorere myiza no gushyiramo memori ya 3D, mu gihe TGV irimo kwaguka vuba muri SiP, optoelectronic integration, sensors, na RF devices.
Kubera ko ingano y'ibirahure igera ku rwego rwo gupakira (PLP), TGV iri kuba urubuga rwiza rwo guhuza itumanaho rya 5G, radar y'imodoka, optique ya AR, na Mini / Micro LED packing.
IV. Kuva kuri Silicon kugera ku kirahure: Ibyiza ku rwego rwa sisitemu
Gushyira ikirahure mu mwanya wacyo si ugusimbura ibikoresho gusa, ahubwo bigaragaza impinduka mu miterere y’imiterere y’ibikoresho.
Imikorere y'amashanyarazi: Ikirahure gito cya Drk kigabanya cyane gutinda kw'amajwi n'ikoreshwa ry'amashanyarazi.
Ubuziranenge bw'imiterere: TGV itanga imiterere myiza kandi ifite ubushobozi bwo gupfunyika mu bice binini.
Uburyo bworoshye bwo gukora: Gutunganya hakoreshejwe laser hamwe na PVD y'ubusa bitanga ubushobozi bwo guhuza no kwaguka kw'imikorere.
By’umwihariko, ku bijyanye no guhuza optoelectronic, uburyo ikirahure gikoresha urumuri rugaragara butuma habaho imiterere y’ibipfunyika aho substrate idashyigikira gusa imiyoboro y’amashanyarazi ahubwo inashyigikira inzira z’amashanyarazi, lenses, n’amadirishya apima, ibi bikaba bigoye kugeraho ukoresheje TSV.
V. Umuti wo gusiga imbuto mu buryo bwa V. ZhenHua Vacuum TGV
Ibyiza by'Ibikoresho:
Gutunganya Ingufu Zinyuze mu Bujyakuzimu: Ikoranabuhanga ry’ingufu zinyuze mu bujyakuzimu rishobora gufata imiyoboro mito nka 30 μm ifite igipimo cya >10:1, rikemura ibibazo bikomeye binyuze mu bujyakuzimu.
Ishobora guhindurwa ku bunini butandukanye: Ishyigikira ibirahure birimo 600×600 mm, 510×515 mm, cyangwa binini.
Uburyo bworoshye bwo guhindura imikorere: Ikorana na Cu, Ti, Ni, Pt, n'izindi filime nto zikora cyangwa zikora neza kugira ngo ihuze n'ibisabwa bitandukanye byo kurwanya amashanyarazi n'ingese.
Imikorere Ihamye & Kubungabunga Byoroshye: Ifite uburyo bwo kugenzura bugezweho bwo guhindura ibipimo byikora no gukurikirana ubugari mu buryo nyabwo; igishushanyo mbonera cy'uburyo bwo gutunganya ibintu byoroshye kandi kikagabanya igihe cyo kudakora.
Uburyo bwo Gukoresha: Bikwiriye gupakira neza TGV/TSV/TMV, bikwirakwira mu buryo bwimbitse binyuze mu gusiga imbuto ku gipimo cya 10:1.
—Iyi nkuru yasohotse naibikoresho byo gusiga irangi ry'umwuka uruganda rwa Zhenhua Vacuum
Igihe cyo kohereza: Ukwakira 16-2025