(PVD sputtering coating machine) Magnetron sputtering technology
Magnetron sputtering technology can prepare decorative films, hard films, corrosion-resistant friction films, superconducting films, magnetic films, optical films, and various films with special functions. It is a very effective film deposition method. Industrial applications are very extensive.(magnetron sputtering coating machin,PVD sputtering coating machine)
"Sputtering" refers to particles with a certain energy (usually Ar+ ions) bombarding the surface of a solid (target), causing the molecules or atoms of the solid (target) to leave the solid, eject from the surface, and be deposited on the workpiece to be plated. Magnetron sputtering is to establish a magnetic field orthogonal to the electric field on the surface of the target. The electrons are accelerated by the electric field and bound by the magnetic field. The trajectory becomes a cycloid, which increases the collision probability of electrons with charged particles and gas molecules. Improve the gas ionization rate and increase the deposition rate.
Magnetron sputtering technology has higher particle energy and better film-base bonding force than evaporation technology. "Magnetron sputtering ion coating technology" is based on ordinary magnetron sputtering technology, applying a bias on the surface of the workpiece to be plated. , Metal ions are deposited on the surface of the workpiece under the force of the bias electric field, and the film quality and film base bonding force are far better than ordinary magnetron sputtering coating technology.(magnetron sputtering coating machin,PVD sputtering coating machinee)
According to the shape of the target material, magnetron sputtering targets can be divided into circular magnetron sputtering targets, planar magnetron sputtering targets and cylindrical magnetron sputtering targets. Circular targets are mainly used in scientific research and a small number of industrial applications. Planar targets and cylindrical targets are widely used in industry, especially cylindrical targets, which are more and more used due to their ultra-high target utilization rate and stable working conditions. .
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