Kuchokera ku TSV kupita ku TGV: Kusintha kwa Zinthu ndi Kusiyana kwa Kupanga mu Ma Interconnect a Through-Via

Pakusintha kwa ukadaulo wa ma semiconductor packaging, ma vertical interconnects nthawi zonse akhala chinthu chofunikira kwambiri chomwe chimatsimikizira magwiridwe antchito a makina, malo ogwirira ntchito, komanso kugwiritsa ntchito mphamvu. Kuyambira njira zoyambirira zolumikizira mawaya ndi flip-chip mpaka kuonekera kwa ma 3D stacked ICs, makampaniwa akhala akufunafuna mayankho apamwamba komanso afupikitsa a interconnect.

Pachifukwa ichi, TSV (Kudzera mu Silicon Via) ndi TGV (Kudzera mu Glass Via) zaonekera ngati njira ziwiri zazikulu zolumikizirana. Zimasiyana m'makina azinthu, njira zopangira, mawonekedwe a magwiridwe antchito, ndi madera ogwiritsira ntchito, zomwe zikuyimira mfundo yofunika kwambiri pakupanga ma phukusi a m'badwo wotsatira.

I. TSV: Woyambitsa wa 3D Packaging
1. Mfundo Zaukadaulo

TSV imatanthauza ma vias okhala ndi chiŵerengero chapamwamba omwe amadulidwa kudzera mu silicon substrate (nthawi zambiri amakhala ndi ma microns makumi khumi mpaka mazana ambiri), kutsatiridwa ndi kupangidwa kwa wosanjikiza woteteza, wosanjikiza wa mbewu yachitsulo, ndi kudzaza kwachitsulo (nthawi zambiri mkuwa) pamakoma a via. Ma vias olunjika awa amalola kulumikizana kwamagetsi mwachangu pakati pa zigawo za chip zolumikizidwa.

2. Kuyenda kwa Njira

Njira yodziwika bwino yopangira TSV imaphatikizapo:

Kujambula Deep Silicon Etching (DRIE): Pangani ma vias okhala ndi chiŵerengero chapamwamba mu silicon wafer.

Kuika Zinthu Zoteteza: Nthawi zambiri PECVD imaika SiO₂ kuti ichotse zitsulo kuchokera ku silicon substrate pogwiritsa ntchito magetsi.

Kuika ndi Kuyika Mbeu mu Chigawo cha Mbeu: Kuika PVD mu chigawo chachitsulo cha mbeu kutsatiridwa ndi kuyika ndi mkuwa mu chigawo chachitsulo.

Kupukuta kwa Makina Opangira Mankhwala (CMP): Chotsani chitsulo chochulukirapo kuti mupange malo olinganizidwa.

3. Ubwino ndi Zofooka

TSV imapereka njira zazifupi kwambiri zolumikizirana, kuchedwa kochepa kwa ma signal, kugwiritsa ntchito mphamvu zochepa, komanso bandwidth yayikulu, zomwe zimapangitsa kuti ikhale yofunikira kwambiri pakukonza makompyuta ogwira ntchito bwino komanso kukumbukira kwa bandwidth yayikulu.

Komabe, TSV ilinso ndi zoletsa:

Mavuto a kutentha: Kusagwirizana kwakukulu kwa CTE pakati pa silicon ndi mkuwa kungathandize kuchepetsa kudalirika.

Mtengo wokwera wa njira: Kudula kwambiri, kuyika ma electroplating, ndi CMP ndi zovuta komanso zimakhudzidwa ndi zokolola.

Mavuto okhudzana ndi kutetezedwa kwa magetsi: Kukhuthala ndi kufanana kwa gawo lotetezera kutentha kumakhudza mwachindunji mphamvu ya dielectric.

Pamene kuchuluka kwa ma chips kumawonjezeka, mikangano pakati pa zokolola ndi mtengo yapangitsa kuti pakhale kufufuza kwa zinthu zina—kupanga mwayi wa TGV.

II. TGV: Kupanga Zinthu Mwatsopano Pogwiritsa Ntchito Magalasi
1. Mfundo Zaukadaulo

TGV imagwiritsa ntchito magalasi m'malo mwa silicon. Ma vias olondola kwambiri amapangidwa ndi kuboola laser kapena kunyowa, kutsatiridwa ndi kuyika gawo la mbewu yachitsulo ndi electroplating, zomwe zimapangitsa kuti kulumikizana kolunjika kukhale kofanana ndi TSV.

Galasi imapereka chitetezo chabwino kwambiri chamagetsi, chokhazikika cha dielectric chochepa (Dk), kutayika kwa dielectric kochepa (Df), komanso kukhazikika kwabwino kwambiri, zomwe zimapangitsa TGV kukhala yokongola kwambiri potumiza ma signaling othamanga kwambiri komanso kulongedza ma optoelectronic.

2. Kuyenda kwa Njira

Njira zazikulu zopangira TGV ndi izi:

Kuboola kwa Laser: Ma laser othamanga kwambiri amapanga ma microvias mugalasi okhala ndi mainchesi kuyambira 20–150 μm.

Kuika Mbeu mu Chigawo: PVD, monga magnetron sputtering, imayika chigawo chofanana cha conductive pakhoma.

Kupaka Ma Electroplating a Chitsulo: Chosakaniza cha mkuwa kapena nickel-copper chimadzaza ma vias kuti apange maulumikizidwe amagetsi kudzera mugalasi.

Kupanga Mapulani ndi Kupanga Mapangidwe: Kumathandizira kulumikizana kwa zigawo zambiri kapena kulumikizana ndi ma chip a IC.

3. Ubwino

Poyerekeza ndi TSV, TGV ikuwonetsa zabwino zingapo:

Kutayika kochepa kwa dielectric: Glass Dk ndi pafupifupi 1/3 ya silicon, zomwe zimachepetsa kutayika kwa chizindikiro ndi kutayika kwa kuyika.

Kukhazikika kwabwino kwambiri kwa kutentha: CTE pafupi ndi zitsulo, kuchepetsa kupsinjika kwa kutentha.

Kuwonekera bwino kwa kuwala: Kumathandizira kuphatikiza kwa optoelectronic mu photonics ndi masensa.

Mtengo wowongolera: Kuboola ndi kukonza magalasi pogwiritsa ntchito laser kukukhwima, koyenera kupanga zinthu zazikulu.

III. TSV vs TGV: Kuyerekeza ndi Kugwiritsa Ntchito Ma Domain

TSV ikadali chisankho chachikulu cha logic yogwira ntchito bwino komanso kukumbukira 3D stacking, pomwe TGV ikukula mwachangu mu SiP, optoelectronic integration, masensa, ndi zida za RF.

Popeza kukula kwa galasi la substrate kufika pakupanga mapanelo (PLP), TGV ikukhala nsanja yabwino kwambiri yolumikizirana ya 5G, radar yamagalimoto, AR optics, ndi ma packaging a Mini/Micro LED.

IV. Kuchokera ku Silicon kupita ku Galasi: Ubwino wa Dongosolo

Kuyambitsa galasi sikungosintha zinthu zokha; kumatanthauza kusintha kwa nzeru za kapangidwe ka dongosolo.

Kugwira ntchito kwa magetsi: Galasi lotsika la Drk limachepetsa kwambiri kuchedwa kwa chizindikiro ndi kugwiritsa ntchito mphamvu.

Kukhazikika kwa kapangidwe kake: TGV imapereka kulinganika kwapamwamba komanso kusinthasintha kwapang'onopang'ono kwa ma CD akuluakulu.

Kusinthasintha kwa kupanga: Kukonza ndi laser pamodzi ndi vacuum PVD kumalola kuti ntchitoyo igwirizane kwambiri komanso kuti ikule.

Makamaka, pakuphatikiza kwa optoelectronic, kuwonekera bwino kwa galasi kumathandiza mapangidwe a ma CD pomwe substrate simangothandizira kulumikizana kwamagetsi komanso ma waveguide, ma lens, ndi mawindo a sensor, zomwe zimakhala zovuta kuchita ndi TSV.

V. ZhenHua Vacuum TGV Seed Layer Coating Solution

Ubwino wa Zipangizo:

Kukonza Zophimba Zakuya: Ukadaulo waukadaulo wophimba zakuya womwe ungathe kugwira ma vias ang'onoang'ono ngati 30 μm okhala ndi chiŵerengero cha >10:1, kuthana ndi zovuta zovuta zophimba zakuya.

Zosinthika pa Makulidwe Osiyanasiyana: Zimathandizira magalasi opangidwa ndi galasi kuphatikizapo 600×600 mm, 510×515 mm, kapena kuposerapo.

Kusinthasintha kwa Njira: Kugwirizana ndi Cu, Ti, Ni, Pt, ndi mafilimu ena owonda oyenda kapena ogwira ntchito kuti akwaniritse zofunikira zosiyanasiyana zamagetsi ndi kukana dzimbiri.

Kugwira Ntchito Kokhazikika & Kusamalira Kosavuta: Yokhala ndi ulamuliro wanzeru wosinthira magawo okha komanso kuyang'anira makulidwe nthawi yeniyeni; kapangidwe ka modular kamathandizira kukonza ndikuchepetsa nthawi yogwira ntchito.

Kugwiritsa Ntchito: Koyenera kupangidwa ndi TGV/TSV/TMV, komwe kumafikira mkati mwa chivundikiro cha mbewu ndi chiŵerengero cha 10:1.

—Nkhaniyi yafalitsidwa ndizida zophikira zotsukira wopanga Zhenhua Vacuum