Nyob rau hauv kev hloov pauv digital niaj hnub no, kev loj hlob ntawm kev xa cov ntaub ntawv tau raug tsav los ntawm kev sib cuam tshuam siab hauv cov xov tooj ntse, kev paub txog AR / VR, thiab kev ua haujlwm loj heev hauv kev suav lej siab. Cov ntim khoom 2D ib txwm muaj - nrog cov kev sib txuas ntev thiab kev poob siab ntawm kev xa mus - tsis tuaj yeem tawg los ntawm kev ua haujlwm bottlenecks.
Yog li ntawd, kev sib sau ua ke ntawm cov chips thiab 3D packaging tau tshwm sim los ua qhov kev taw qhia tseem ceeb ntawm kev lag luam. Txhawm rau kom muaj kev sib txuas 3D zoo tiag tiag, thev naus laus zis Through Glass Via (TGV) tau sawv tawm nrog nws cov txiaj ntsig tshwj xeeb, txav mus los ntawm R&D cov khoom khaws cia mus rau hauv kev siv hauv kev lag luam. TGV tam sim no tab tom dhau los ua qhov tseem ceeb rau cov khoom siv hluav taws xob tiam tom ntej.
1. TGV Technology: Lub "Choj" ntawm 3D Interconnection
1.1 Lub Ntsiab Lus Tseem Ceeb: TGV yog dab tsi tiag?
Lub ntsiab lus ntawm TGV yog kev tsim cov microvias ntsug los ntawm lub khob iav. Cov vias no ua haujlwm ua cov choj hluav taws xob, txuas ncaj qha rau cov chips lossis cov khoom sib dhos, ua rau muaj kev sib kis teeb liab thiab lub zog. Piv nrog rau cov "planar wiring" ib txwm muaj, kev sib txuas ntsug ua rau txoj kev sib kis luv dua thiab txhawb nqa cov khoom siv me me thiab kev sib koom ua ke siab.
1.2 Vim li cas cov iav substrates yog cov khoom siv ntuj rau TGV
TGV hla dhau TSV (Through Silicon Via) vim peb qhov zoo tseem ceeb ntawm cov khoom siv iav:
Qhov tsis tu ncua dielectric qis - tiv thaiv cov teeb liab zaus siab: Iav muaj qhov tsis tu ncua dielectric qis, txo qhov poob dielectric thaum lub sijhawm xa xov thiab khaws cia qhov tseeb ntawm cov teeb liab hauv cov ntawv thov zaus siab xws li 5G thiab HPC.
Kev sib raug zoo ntawm kev nthuav dav thermal nrog silicon - txhim kho kev ntseeg tau: Iav sib phim ze rau silicon tus coefficient ntawm kev nthuav dav thermal, txo qhov kev ntxhov siab thermo-mechanical thiab kev ua tsis tiav thaum lub sijhawm thermal cycling, yog li ua rau lub cuab yeej siv tau ntev dua.
Kev pom tseeb ntawm qhov muag - ua rau muaj kev sib koom ua ke ntawm optoelectronic: Tsis zoo li cov silicon uas tsis pom tseeb, kev pom tseeb ntawm iav txhawb nqa cov ntawv thov electro-optical hybrid. Piv txwv li, hauv cov silicon photonics modules, iav ua rau muaj kev sib txuas hluav taws xob thiab kev xa cov teeb liab optical; hauv AR/VR microdisplays, kev pom tseeb txo qhov kev thaiv qhov muag thiab txhim kho qhov ci thiab kev meej.
1.3 Los ntawm TSV mus rau TGV: Kev Hloov Pauv Ntuj
Ua ntej TGV, TSV yog lub tshuab 3D interconnect tseem ceeb. Txawm li cas los xij, TSV ntsib teeb meem ntau ntxiv thaum kev sib koom ua ke nce ntxiv:
Tus nqi siab: Cov txheej txheem nyuaj - etching, rwb thaiv tsev, metallization - ua rau TSV tsis haum rau kev tsim khoom loj.
Kev txhawj xeeb txog kev ntseeg tau: Kev sib txawv ntawm thermal expansion mismatch ntawm silicon thiab lwm yam khoom siv feem ntau ua rau tawg lossis solder sib koom ua tsis tiav.
Daim ntawv thov txwv: Silicon qhov opacity tsis suav nrog TSV los ntawm cov ntawv thov optoelectronic uas xav tau pob tshab.
TGV daws tau cov teeb meem no tau zoo, ua rau nws yog qhov kev daws teeb meem sib txuas lus rau tiam tom ntej.
2. Via Coating: Lub hauv paus tseem ceeb uas ua rau TGV ua haujlwm tau zoo
2.1 Lub Ntsiab Lus Tseem Ceeb: Yog tsis muaj txheej txheej, TGV tsuas yog "Lub raj khoob" xwb
Cov iav vias yog cov khoom rwb thaiv tsev thiab tsis tuaj yeem coj hluav taws xob. Yuav kom ua tau kev sib txuas, ib txheej conformal conductive (feem ntau yog zaj duab xis hlau) yuav tsum tau muab tso rau ntawm cov via sidewalls. Cov txheej no ua haujlwm ua txoj kev loj ntawm lub teeb liab - txiav txim siab qhov ceev, kev poob, thiab kev ruaj khov. Cov txheej txheem tsis sib xws lossis tsis zoo ua rau muaj kev tiv thaiv ntau dua, kev txo qis ntawm lub teeb liab, lossis txawm tias qhib cov voj voog, ua rau via metallization yog txoj sia ntawm TGV thev naus laus zis.
2.2 Cov Kev Sib Tw: Ob Qhov Teeb Meem Tseem Ceeb
Kev Pab Them Nqi Siab Tshaj Plaws
Cov kab uas hla ntawm TGV tam sim no nyob rau hauv qhov ntau ntawm micrometer (mus txog ~ 30 μm) nrog qhov tob tshaj 10: 1 piv. Cov txheej txheem tso dej ib txwm muaj teeb meem kom ua tiav qhov kev npog hauv qab thiab cov yeeb yaj kiab phab ntsa sib xws, feem ntau tawm hauv "cov cheeb tsam tuag" tsis muaj txheej uas ua rau kev ua haujlwm ntawm kev sib txuas tsis zoo.
Kev Tswj Xyuas Qhov Tsis Zoo - Tus Neeg Tua Neeg Zais Cia
Cov ces kaum thiab cov phab ntsa ntxhib yog qhov yooj yim rau cov dej ntws lossis cov npuas dej. Cov qhov tsis zoo no ua rau muaj kev tiv thaiv hauv zos lossis qhib cov voj voog, ncaj qha rhuav tshem kev sib txuas ntawm cov chips thiab cov khoom siv. Yog li ntawd, kev tshem tawm qhov tsis zoo yog qhov teeb meem tseem ceeb ntawm TGV txheej.
3. Plaub Txoj Kev Txheej: Lub Zog thiab Kev Txwv
Kev Tso Pa Hluav Taws Xob (PVD): Laus tab sis Txwv
Cov txheej txheem xws li kev ua kom qhuav thiab sputtering muab cov yeeb yaj kiab uas huv si thiab nplaum zoo. Txawm li cas los xij, vim nws qhov "kab pom kev", PVD muaj teeb meem nrog cov vias loj thiab zoo tshaj plaws rau cov vias qis dua ~ 5: 1 piv.
Kev Tso Pa Tshuaj Lom Zem (CVD): Muaj Peev Xwm Loj Tab Sis Kim Heev
CVD siv cov pa roj uas kis mus rau ntawm cov phab ntsa, ua rau cov txheej txheem sib xws txawm tias nyob hauv cov qauv sib piv siab. Txawm li cas los xij, qhov kub thiab txias siab thiab siab yuav ua rau cov khoom siv iav puas tsuaj, thiab tus nqi khoom siv siab, ua rau nws tsim nyog rau cov ntawv thov siab.
Kev Tsim Khoom Siv Hluav Taws Xob (ECD): Kev Tsim Khoom Loj Uas Pheej Yig
ECD phaj cov yeeb yaj kiab conductive los ntawm kev txo cov hlau ions ntawm cov phab ntsa. Nws muab cov nqi qis thiab cov khoom siv siab, zoo tagnrho rau kev tsim khoom ntau. Txawm li cas los xij, kev tswj hwm nruj ntawm electrolyte concentration thiab tam sim no ceev yog qhov tseem ceeb - kev hloov pauv ua rau cov yeeb yaj kiab porous lossis kev ua qias tuaj. Nws feem ntau yog siv rau vias 5–50 μm hauv txoj kab uas hla.
Atomic Layer Deposition (ALD): Kev daws teeb meem meej
ALD ua tiav kev tswj qhov tuab ntawm atomic-scale thiab kev sib raug zoo heev, ua rau nws zoo tagnrho rau qhov sib piv ntawm qhov siab heev. Nws daws qhov teeb meem kev them nqi tab sis raug kev txom nyem los ntawm cov nqi tso tawm qeeb heev thiab tus nqi siab. Yog li, ALD feem ntau yog tseg rau kev tsav dav hlau thiab cov sensors muaj kev ntseeg siab.
4. Tus Nqi ntawm TGV Txheej: Tsav Tsheb 3D Kev Sib Txuas Lus Zoo
Kev Ua Kom Ceev - Kev Sib Txuas Ncaj Qha Ceev
Hauv 2D ntim khoom, cov teeb liab yuav tsum mus deb heev, ua rau poob ntau ntxiv. Nrog TGV metallization, chip-to-board thiab chip-to-system interconnects ua luv luv, ntsug, thiab poob tsawg. Hauv HPC servers, TGV-coated vias ua rau CPU-rau-nco/GPU kev sib txuas lus ceev kom zoo dua 30%, txo latency thiab txhawb kev ua haujlwm ntawm lub system.
Kev Siv Hluav Taws Xob Zoo - Kev Ncua Sijhawm Tsawg Dua thiab Kev Siv Hluav Taws Xob
Cov kev sib txuas luv dua txo qhov kev ncua sijhawm, thaum cov txheej txheem tiv thaiv qis txo qhov kub ntawm Joule. Piv txwv li, cov khoom ntim khoom siv hluav taws xob ntawm lub xov tooj ntse TGV tuaj yeem txo qhov kev siv hluav taws xob ntawm lub hauv paus los ntawm 15-20%, ua kom lub roj teeb siv tau ntev dua thiab txhim kho kev paub ntawm tus neeg siv.
5. Zhenhua Lub Tshuab Nqus Tsev: Kev daws teeb meem TGV txheej txheem siab heev
Cov Khoom Siv Zoo
Kev Txhim Kho Deep-Via
Cov txheej txheem txheej tob tob uas tsim tshwj xeeb ua rau cov noob txheej sib npaug txawm tias nyob rau hauv vias me me li 30 μm nrog cov piv txwv ntawm cov yam ntxwv tshaj 10: 1 - daws ib qho ntawm cov teeb meem nyuaj tshaj plaws hauv kev lag luam.
Kev Tswj Xyuas Cov Khoom Siv Uas Koj Xav Tau
Txhawb ntau yam qhov loj ntawm cov iav substrate, suav nrog 600 × 600 mm / 510 × 515 mm, nrog rau kev nthuav dav mus rau cov hom ntawv loj dua.
Kev Yooj Yim ntawm Cov Txheej Txheem - Kev Sib Xws ntawm Ntau Yam Khoom Siv
Txhawb cov yeeb yaj kiab conductive thiab functional xws li Cu, Ti, W, Ni, thiab Pt, ua tau raws li ntau yam kev thov rau conductivity thiab corrosion resistance.
Kev Ua Haujlwm Ruaj Kho thiab Kev Txij Nkawm Yooj Yim
Nruab nrog cov txheej txheem tswj kev txawj ntse rau kev saib xyuas lub sijhawm tiag tiag ntawm cov zaj duab xis tuab sib xws, thiab kev tsim qauv modular rau kev saib xyuas yooj yim thiab txo lub sijhawm tsis ua haujlwm.
Daim Ntawv Thov Scope
Siv tau rau TGV/TSV/TMV cov ntim khoom siab heev, ua rau cov noob txheej conformal tso rau hauv qhov tob nrog cov piv ntawm 10:1.
— Tsab xov xwm no tau luam tawm los ntawm cov khoom siv nqus tsev txheej Chaw tsim khoom Zhenhua Lub Tshuab Nqus Tsev
Lub sijhawm tshaj tawm: Cuaj hlis-27-2025