Lub tshuab nqus tsev feem ntau suav nrog lub tshuab nqus tsev vapor deposition, sputtering txheej thiab ion txheej, tag nrho cov no yog siv los tso ntau yam hlau thiab cov yeeb yaj kiab tsis yog hlau rau ntawm qhov chaw ntawm cov yas los ntawm distillation lossis sputtering nyob rau hauv lub tshuab nqus tsev, uas tuaj yeem tau txais cov txheej txheej nyias nyias nrog rau qhov zoo tshaj plaws ntawm kev ceev adhesion, tab sis tus nqi kuj tseem siab dua, thiab cov kev ua haujlwm ntawm cov hlau feem ntau siv tau. cov khoom qib siab.
Lub tshuab nqus tsev vapor deposition yog ib txoj kev ua kom sov cov hlau nyob rau hauv lub tshuab nqus tsev siab, ua rau nws yaj, evaporate, thiab tsim ib tug nyias hlau zaj duab xis rau saum npoo ntawm cov qauv tom qab txias, nrog ib tug tuab ntawm 0.8-1.2 um. Nws nyob rau hauv qhov me me concave thiab convex nyob rau saum npoo ntawm cov khoom tsim kom tau ib daim iav zoo li qhov chaw.Thaum lub tshuab nqus tsev vapor deposition yog ua los kom tau txais cov iav tsom iav los yog lub tshuab nqus tsev vaporize cov hlau uas tsis muaj adhesion, hauv qab yuav tsum tau coated.
Sputtering feem ntau yog hais txog magnetron sputtering, uas yog ib qho kev kub ceev qis-kub sputtering. Cov txheej txheem yuav tsum muaj lub tshuab nqus tsev li ntawm 1 × 10-3Torr, uas yog 1.3 × 10-3Pa lub tshuab nqus tsev uas muaj cov roj inert argon (Ar), thiab nruab nrab ntawm cov yas substrate (anode) thiab lub hom phiaj hlau (cathode) ntxiv rau high-voltage direct tam sim no, vim yog electron excitation ntawm inert gas generated los ntawm glow plasma tawm, produles. ntawm lub hom phiaj hlau thiab tso lawv rau ntawm cov yas substrate. Feem ntau ntawm cov txheej txheem hlau feem ntau siv DC sputtering, thaum cov ntaub ntawv uas tsis yog-conductive ceramic siv RF AC sputtering.
Ion txheej yog ib txoj hauv kev uas cov pa tawm tau siv los ua ib feem ionize cov pa los yog cov khoom evaporated nyob rau hauv lub tshuab nqus tsev, thiab cov khoom evaporated los yog nws cov reactants tso rau ntawm lub substrate los ntawm kev foob pob roj ions lossis ions ntawm cov khoom evaporated. Cov no muaj xws li magnetron sputtering ion txheej, reactive ion txheej, hollow cathode paug ion txheej (hollow cathode vapor deposition txoj kev), thiab multi-arc ion txheej (cathode arc ion txheej).
Vertical double-sided magnetron sputtering nruam txheej hauv kab
Kev siv dav dav, tuaj yeem siv rau cov khoom siv hluav taws xob xws li phau ntawv plhaub EMI shielding txheej, cov khoom lag luam tiaj tus, thiab txawm tias tag nrho cov khoom siv khob khob hauv ib qhov siab tshwj xeeb tuaj yeem tsim tau. Muaj peev xwm thauj khoom loj, compact clamping thiab staggered clamping ntawm conical lub teeb khob rau ob sab txheej, uas tuaj yeem muaj peev xwm thauj khoom loj dua. ruaj khov zoo, zoo sib xws ntawm zaj duab xis txheej los ntawm batch mus rau batch. High degree ntawm automation thiab cov nqi ua haujlwm qis.
– Zaj lus no yog tso tawm los ntawmtshuab nqus tsev txheej tshuab manufacturersGuangdong Zhenhua
Post lub sij hawm: Jan-23-2025