Hauv kev hloov pauv ntawm cov thev naus laus zis ntim khoom semiconductor, kev sib txuas ntsug yeej ib txwm yog qhov tseem ceeb uas txiav txim siab txog kev ua haujlwm ntawm lub kaw lus, qhov chaw, thiab kev siv hluav taws xob. Txij li thaum ntxov txuas hlau thiab cov txheej txheem flip-chip mus rau qhov tshwm sim ntawm 3D stacked ICs, kev lag luam tau nrhiav kev daws teeb meem siab dua thiab luv dua.
Hauv cov ntsiab lus no, TSV (Through Silicon Via) thiab TGV (Through Glass Via) tau tshwm sim ua ob lub thev naus laus zis sib txuas ntsug. Lawv sib txawv hauv cov khoom siv, cov txheej txheem tsim khoom, cov yam ntxwv kev ua tau zoo, thiab cov ntawv thov, uas sawv cev rau lub hauv paus tseem ceeb hauv kev txhim kho ntim khoom tom ntej.
I. TSV: Tus thawj coj ntawm 3D Ntim Khoom
1. Txoj Cai Txuj Ci
TSV yog hais txog qhov chaw siab uas tau txiav los ntawm cov silicon substrate (feem ntau yog kaum txog pua pua microns tob), ua raws li kev tsim cov txheej rwb thaiv tsev, txheej noob hlau, thiab cov hlau sau (feem ntau yog tooj liab) ntawm cov phab ntsa via. Cov chaw ntsug no ua rau muaj kev sib txuas hluav taws xob ceev ceev ntawm cov txheej chip sib dhos.
2. Cov Txheej Txheem
Cov txheej txheem tsim khoom TSV ib txwm muaj xws li:
Kev Sib Nraus Sib Sib Zog Sib Sib Zog (DRIE): Tsim cov vias siab hauv cov silicon wafer.
Kev Tso Txheej Rwb Thaiv Kub: Feem ntau PECVD-deposited SiO₂ los cais cov hlau sau ntawm silicon substrate los ntawm hluav taws xob.
Kev Tso Txheej Noob thiab Electroplating: PVD deposition ntawm ib txheej noob hlau ua raws li tooj liab electroplating.
Kev Siv Tshuaj Txhuam Txhuam (CMP): Tshem tawm cov hlau ntau dhau kom ua tiav qhov chaw tiaj tus.
3. Cov Zoo thiab Cov Kev Txwv
TSV muaj cov kev sib txuas luv heev, lub teeb liab qis, kev siv hluav taws xob tsawg, thiab bandwidth siab, ua rau nws yog qhov tseem ceeb rau kev suav lej ua haujlwm siab thiab kev nco siab.
Txawm li cas los xij, TSV kuj muaj cov kev txwv:
Cov teeb meem kev ntxhov siab thermal: Qhov tsis sib xws loj hauv CTE ntawm silicon thiab tooj liab tuaj yeem txo qhov kev ntseeg siab.
Tus nqi txheej txheem siab: Kev khawb tob, electroplating, thiab CMP yog qhov nyuaj thiab rhiab heev rau cov txiaj ntsig.
Cov teeb meem ntawm kev rwb thaiv hluav taws xob: Qhov tuab thiab kev sib npaug ntawm cov txheej rwb thaiv tsev cuam tshuam ncaj qha rau lub zog dielectric.
Thaum qhov ntom ntawm cov chip integration nce ntxiv, kev tsis sib haum xeeb ntawm cov txiaj ntsig thiab tus nqi tau tsav kev tshawb nrhiav lwm cov ntaub ntawv - tsim kom muaj lub cib fim rau TGV.
II. TGV: Kev Tsim Kho Tshiab Los Ntawm Iav
1. Txoj Cai Txuj Ci
TGV siv cov iav substrates es tsis yog silicon. Cov vias siab raug tsim los ntawm kev siv laser drilling lossis wet etching, ua raws li kev tso cov txheej hlau noob thiab electroplating, ua tiav cov kev sib txuas ntsug zoo ib yam li TSV.
Iav muaj kev rwb thaiv hluav taws xob zoo heev, dielectric constant (Dk) qis, dielectric loss qis (Df), thiab kev ruaj khov zoo heev, ua rau TGV zoo nkauj heev rau kev xa cov teeb liab ceev ceev thiab cov khoom ntim optoelectronic.
2. Cov Txheej Txheem
Cov kauj ruam tseem ceeb hauv kev tsim TGV suav nrog:
Laser Drilling: Ultrafast lasers tsim microvias hauv iav nrog cov kab uas hla feem ntau yog li ntawm 20–150 μm.
Kev Tso Txheej Noob: PVD, xws li magnetron sputtering, tso ib txheej conductive sib xws rau ntawm phab ntsa via.
Kev Siv Hluav Taws Xob Hlau: Tooj liab lossis nickel-tooj liab alloy puv cov vias los tsim cov kev sib txuas hluav taws xob los ntawm iav.
Planarization thiab Patterning: Ua kom muaj ntau txheej sib txuas lossis sib txuas rau IC chips.
3. Cov txiaj ntsig
Piv nrog TSV, TGV qhia tau ntau yam zoo:
Kev poob qis dielectric: Iav Dk yog li ntawm 1/3 ntawm silicon, txo cov teeb liab crosstalk thiab kev poob ntxig.
Kev ruaj khov thermal zoo heev: CTE nyob ze rau cov hlau, txo qis kev ntxhov siab thermal.
Kev pom tseeb ntawm qhov muag: Txhawb kev koom ua ke ntawm optoelectronic hauv photonics thiab sensors.
Tus nqi tswj tau: Laser drilling thiab iav ua tiav lawm, tsim nyog rau thaj chaw loj ntawm vaj huam sib luag.
III. TSV vs TGV: Kev Sib Piv thiab Cov Cheeb Tsam Siv
| Khoom | TSV (Los ntawm Silicon Via) | TGV (Through Glass Via) |
| Cov khoom siv hauv qab | Monocrystalline silicon | Cov iav tshwj xeeb (Borofloat, Corning, Schott, thiab lwm yam) |
| Txoj kab uas hla ntawm qhov | 5–50 μm | 20–150 μm |
| Qhov tob ntawm qhov | 30–100 μm | 100–400 μm |
| Kev rwb thaiv tsev | Yuav tsum muaj txheej txheej rwb thaiv tsev ntxiv | Iav intrinsically insulating |
| Kev Sib Tw Coefficient ntawm Kev Nthuav Dav ntawm Thermal | Qhov sib txawv tseem ceeb piv rau Cu | Zoo ib yam li Cu, kev ntxhov siab thermal qis |
| Tus nqi txheej txheem | Siab | Qis dua |
| Cov ntawv thov | Kev Sib Sau Ua Ke / Kev Nco 3D | SiP, cov sensors, cov khoom ntim khoom siv hluav taws xob, cov kav hlau txais xov, MEMS |
TSV tseem yog qhov kev xaiv tseem ceeb rau kev ua haujlwm siab logic thiab nco 3D stacking, thaum TGV tab tom nthuav dav sai hauv SiP, optoelectronic kev koom ua ke, sensors, thiab RF khoom siv.
Nrog rau qhov loj ntawm cov iav substrate ncav cuag cov ntim khoom theem vaj huam sib luag (PLP), TGV tab tom dhau los ua lub platform sib txuas zoo tagnrho rau kev sib txuas lus 5G, tsheb radar, AR optics, thiab Mini/Micro LED ntim khoom.
IV. Los ntawm Silicon mus rau Iav: Cov txiaj ntsig ntawm theem system
Kev qhia txog iav tsis yog tsuas yog hloov cov khoom siv xwb; nws sawv cev rau kev hloov pauv hauv kev tsim qauv ntawm lub kaw lus.
Kev ua tau zoo ntawm hluav taws xob: Cov iav Dk qis txo qis qhov teeb liab qeeb thiab kev siv hluav taws xob.
Kev ruaj khov ntawm cov qauv: TGV muaj kev tiaj tiaj siab dua thiab qis dua rau kev ntim khoom loj.
Kev ywj pheej ntawm kev tsim khoom: Kev ua laser ua ke nrog PVD nqus tsev ua rau muaj kev sib raug zoo thiab kev nthuav dav.
Tshwj xeeb, rau kev koom ua ke optoelectronic, qhov pom tseeb ntawm iav ua rau cov qauv ntim khoom uas lub substrate txhawb nqa tsis yog tsuas yog kev sib txuas hluav taws xob xwb tab sis kuj tseem muaj waveguides, lenses, thiab sensor windows, uas nyuaj rau ua tiav nrog TSV.
V. ZhenHua Lub Tshuab Nqus Tsev TGV Noob Txheej Txheej Tshuaj
Cov Khoom Siv Zoo:
Kev Txhim Kho Kev Txheej Txheem Sib Sib Zog: Kev siv tshuab txheej txheem sib sib zog nqus uas muaj peev xwm tswj tau vias me me li 30 μm nrog >10:1 piv, daws cov teeb meem sib sib zog nqus.
Kho tau rau ntau qhov ntau thiab tsawg: Txhawb cov iav substrates suav nrog 600 × 600 mm, 510 × 515 mm, lossis loj dua.
Kev Ywj Pheej ntawm Cov Txheej Txheem: Sib xws nrog Cu, Ti, Ni, Pt, thiab lwm yam yeeb yaj kiab nyias nyias lossis ua haujlwm tau zoo kom ua tau raws li ntau yam kev xav tau hluav taws xob thiab kev tiv thaiv xeb.
Kev Ua Haujlwm Ruaj Kho & Kev Txij Nkawm Yooj Yim: Nruab nrog kev tswj hwm ntse rau kev hloov kho qhov tsis siv neeg thiab kev saib xyuas lub sijhawm tiag tiag ntawm qhov sib npaug ntawm cov tuab; kev tsim qauv modular pab txhawb kev txij nkawm thiab txo lub sijhawm tsis ua haujlwm.
Daim Ntawv Thov Scope: Haum rau TGV / TSV / TMV advanced ntim, ua tiav tob los ntawm cov noob txheej txheej nrog 10: 1 piv.
— Tsab xov xwm no tau luam tawm los ntawmcov khoom siv nqus tsev txheej Chaw tsim khoom Zhenhua Lub Tshuab Nqus Tsev
Lub sijhawm tshaj tawm: Lub Kaum Hli-16-2025