Hauv kev tsim kho nto niaj hnub no, Physical Vapor Deposition (PVD) tau tshwm sim los ua lub hauv paus txheej txheem nqus tsev vim nws cov yeeb yaj kiab ua tau zoo heev thiab cov yam ntxwv zoo rau ib puag ncig. Tsab xov xwm no muab kev tshuaj xyuas tob txog cov ntsiab cai, kev faib tawm, thiab cov ntawv thov ntawm PVD thev naus laus zis, muab kev nkag siab txog kev txawj ntse rau cov kws tshaj lij hauv daim teb no.
No.1 Cov Ntsiab Cai Tseem Ceeb ntawm PVD Technology
PVD yog ib qho txheej txheem ua nyob rau hauv lub tshuab nqus tsev (feem ntau ≤10⁻³ Pa), uas cov khoom siv txheej txheem raug ua pa thiab tom qab ntawd condensed rau ntawm qhov chaw substrate los ua ib daim nyias nyias. Cov txheej txheem no yog tus cwj pwm los ntawm:
Qhov kub tso tawm qis dua (feem ntau <500 ° C)
Cov yeeb yaj kiab huv si thiab muaj cov khoom sib xyaw ua ke
Tus phooj ywg ib puag ncig (tsis muaj dej khib nyiab tawm)
Kev tswj hwm qhov tseeb ntawm qib nanometer
No.2 Kev faib tawm ntawmCov Khoom Siv PVDtCov Txheej Txheem
1. Lub Tshuab Nqus Tsev Evaporation Txheej
Kev ua kom cov khoom siv pleev xim sov kom txog thaum nws mus txog nws qhov siab ntawm cov pa dej thiab ua kom cov pa dej qhuav. Cov hom uas siv ntau suav nrog:
Kev Ua Kom Sov Tsis Txawj Kub
Siv cov hlau uas tsis kub xws li tungsten lossis molybdenum ua cov khoom siv cua sov. Haum rau cov khoom siv uas tsis yaj xws li txhuas (Al) thiab nyiaj (Ag).
Kev Ua Kom Tawg Hluav Taws Xob (EB-PVD)
Siv rab phom hluav taws xob (10–30 kV) los tua cov khoom siv, ua rau muaj qhov kub thiab txias tshaj 3000°C. Zoo tagnrho rau cov oxides uas yaj sai.
Molecular Beam Epitaxy (MBE)
Ib txoj kev siv tshuab ua kom raug heev uas ua nyob rau hauv lub tshuab nqus tsev siab heev (≤10⁻⁸ Pa), uas tso cai rau kev tswj hwm qib atomic rau kev loj hlob ntawm zaj duab xis epitaxial.
2. Kev Tso Tawm Sputtering
Kev siv sputtering muaj xws li cov khoom me me uas muaj zog heev uas yuav tua cov khoom siv uas xav tau, thiab yuav muab cov atoms uas tso rau ntawm lub substrate tawm. Cov hom sputtering tseem ceeb muaj xws li:
DC Sputtering (Tam Sim No Ncaj Qha)
Txoj kev yooj yim sputtering; lub hom phiaj yuav tsum yog hluav taws xob conductive.
RF Sputtering (Xov Tooj Cua Zaus)
Ua haujlwm ntawm 13.56 MHz, tso cai rau cov khoom siv rwb thaiv tsev sputtering.
Magnetron Sputtering
Hom Sib Npaug: Lub zog sib nqus ntawm 100–300 Gauss hla qhov chaw ntawm lub hom phiaj
Hom Tsis Sib Npaug: Kev sib kis ntawm cov ntshav kom zoo dua rau kev tso dej zoo dua
Nruab Nrab Zaus Ob Cathode: Daws qhov teeb meem "kev lom neeg lub hom phiaj" hauv kev sib xyaw ua ke
Kev Siv Hluav Taws Xob Loj Impulse Magnetron Sputtering (HIPIMS): Ionization rates >90%, tsim cov yeeb yaj kiab ultra-dense, non-columnar
No.3 Cov Kev Siv Tshuab PVD Ib Txwm Muaj
Cov Tshuaj Pleev Xim Rau Cov Cuab Yeej
Cov txheej tawv xws li TiN, TiAlN (hardness > 3000 HV)
Siv dav rau kev txiav cov cuab yeej thiab kev txhim kho pwm nto
Cov Txheej Txheem Kho Kom Zoo Nkauj
Cov xim kub zoo li siv ZrN, TiZrN
Siv rau cov thav duab xov tooj ntawm tes, cov khoom siv hauv chav dej, thiab cov khoom siv hauv tsev
Cov Yeeb Yaj Kiab Nyias Uas Muaj Peev Xwm
ITO (Indium Tin Oxide) cov yeeb yaj kiab pob tshab uas muaj daim ntawv tiv taus <10 Ω/□
Cov txheej txheem tiv thaiv kev cuam tshuam nrog lub teeb pom kev zoo> 99%
Kev Ntim Khoom Siv Semiconductor
Kev sib txuas ntawm cov hlau wafer (Al, Cu interconnects)
Kev siv cov txheej txheem thaiv kev siv TaN, TiN rau kev tiv thaiv diffusion
-Tsab xov xwm no yog tso tawm los ntawmlub tshuab nqus tsev txheej tshuab chaw tsim khoom Zhenhua Nqus Tsev.
Lub sijhawm tshaj tawm: Lub Rau Hli-18-2025