Nyob rau xyoo tas los no, kev txawj ntse ntawm lub tshuab (artificial intelligence), kev tsav tsheb tsis siv neeg (anonymous driving), thiab cov chips computing ua haujlwm tau zoo heev tau tswj hwm lub ntiaj teb semiconductor. Raws li kev ua haujlwm ntawm cov chips txuas ntxiv mus, cov ntim khoom ob-seem (2D) ib txwm tsis tuaj yeem ua tau raws li qhov xav tau ntawm kev sib txuas thiab kev tswj hwm thermal. Kev lag luam tab tom txav mus rau lub sijhawm sib koom ua ke peb-seem (3D).
Yuav kom ua tau raws li qhov kev siv computer ntau dua thiab kev sib txuas lus hauv qhov chaw tsawg, lub luag haujlwm ntawm cov khoom ntim khoom tau dhau los ua qhov tseem ceeb dua puas tau. Cov thev naus laus zis Through-Silicon Via (TSV) ib zaug yog lub cim ntawm kev ntim khoom 3D, tab sis nws tus nqi siab, kev siv khoom tsawg, thiab cov khoom siv tsis txaus tau cuam tshuam kev siv dav dav. Tam sim no, ib qho kev sib tw tshiab tab tom tshwm sim - Through-Glass Via (TGV) kev sib txuas lus thev naus laus zis.
Lub hauv paus ntsiab lus ntawm TGV yog los tsim cov micron-scale vias los ntawm lub khob iav insulating, ua raws li kev sau hlau los tsim cov kab ntsug conductive ntawm cov chips lossis substrates. Txawm hais tias lub tswv yim zoo li yooj yim, cov txheej txheem cuam tshuam nrog ntau kauj ruam precision qhov twg txhua theem cuam tshuam ncaj qha rau kev sib txuas kev ntseeg siab. Ntawm cov no, cov noob txheej deposition - feem ntau tsis quav ntsej - ua haujlwm ua lub hauv paus zais cia uas txiav txim siab qhov kev vam meej tag nrho ntawm metallization.
1. Cov Txheej Txheem TGV: Cov Txheej Txheem Noob - "Choj" ntawm Metallization
Ib qho txheej txheem TGV ib txwm muaj xws li:
Kev npaj cov iav substrate → Kev ua kom raug ntawm kev khawb → Kev tso cov noob txheej → Electroplating sau → Kev npaj qhov chaw.
Cov txheej noob yog ib daim zaj duab xis nyias nyias uas muab tso rau ntawm phab ntsa sab hauv ntawm cov iav vias uas tsis yog conductive. Yog tias lub tsev TGV raug saib ua ib lub "choj" ntsug rau kev sib txuas hluav taws xob, ces cov txheej noob ua haujlwm ua thawj txoj hlua hlau uas khi lub choj ntawd. Yog tsis muaj nws, kev siv hluav taws xob tom qab ntawd yuav tsis tuaj yeem pib, thiab kev sib xyaw ua ke hauv lub via yuav ua tsis tau.
Txawm li cas los xij, qhov zoo ntawm cov txheej no nyob ntawm seb cov qauv geometric ntawm txoj hlab ntsha nws tus kheej zoo li cas. Cov duab sib txawv ntawm txoj hlab ntsha ua rau muaj kev cov nyom sib txawv hauv kev ua tiav cov txheej noob sib npaug.
2. Via Morphology: Qhov Kev Sib Tw Kawg rau Kev Npog Txheej Noob Sib Xws
Cov profiles ntawm TGV sib txawv nyob ntawm seb cov txheej txheem drilling thiab etching. Cov geometries feem ntau muaj xws li npauj npaim-zoo li, dig muag, ntsug, thiab V-zoo li vias, txhua qhov muaj teeb meem tshwj xeeb:
Npauj npaim ntawm: Qhov nruab nrab uas nqaim ua rau muaj qhov cuam tshuam ntxoov ntxoo, tiv thaiv cov hlau atoms kom tsis txhob mus txog thaj chaw nruab nrab. Qhov no ua rau muaj "cheeb tsam tuag" uas tsis tau pleev xim qhov twg electroplating continuity ploj mus.
Qhov muag tsis pom kev: Yog tias hauv qab kaw, cov pa roj ntws raug txwv thiab lub zog ion txo qis, ua rau cov zaj duab xis nyias thiab tsis nplaum zoo uas yuav tawg ua tej daim me me raws li cov txheej txheem tom qab.
Ntsug ntawm txoj kab: Tus yam ntxwv los ntawm qhov sib piv siab thiab cov phab ntsa ncaj, cov hlau atoms taug kev linearly thiab feem ntau tsis ua tiav cov txheej txheem hauv qab ntawm txoj kab, ua rau cov kev conductive tsis tiav lossis plating voids.
V-zoo li ntawm: Qhov profile tapered txhim kho qhov sib npaug ntawm lub kaum sab xis ntawm qhov chaw tso tawm rau qee qhov, tab sis taper ntau dhau tuaj yeem ua rau cov zaj duab xis tuab tsis sib npaug thiab ua rau muaj kev ntxhov siab, ua rau lub teeb liab tsis zoo.
Hauv txhua qhov xwm txheej, qhov kev sib tw tseem ceeb yog kom ua tiav cov hlau uas txuas ntxiv mus, sib npaug, thiab nplaum zoo rau ntawm cov iav uas muaj qhov sib piv siab nrog lub zog ntawm qhov chaw qis. Txhua qhov tsis sib txuas lossis kev nplaum tsis zoo hauv cov txheej noob ua rau muaj qhov khoob, tawg, lossis tawg thaum lub sijhawm electroplating, ua rau muaj kev tiv thaiv kev sib txuas ntxiv, kev ncua sijhawm ntawm lub teeb liab, lossis kev ua tsis tiav ntawm lub cuab yeej.
Kev daws cov teeb meem no xav tau cov khoom siv nqus tsev uas muaj qhov tseeb siab thiab ruaj khov uas muaj peev xwm ua tiav kev sib xyaw ua ke tob. Qhov no yog qhov uas ZHENHUA Vacuum txoj kev daws teeb meem TGV los ua si.
3. ZHENHUA Vacuum's TGV Via Metallization Solution
Cov Khoom Siv Zoo:
Kev Txhim Kho Txheej Txheem Sib Sib Zog
Cov txheej txheem txheej tob tob uas tsim tshwj xeeb ua rau cov noob txheej sib npaug txawm tias rau vias nrog txoj kab uas hla me me li 30 μm, ua tiav qhov sib piv txog li 10: 1 thiab daws tau cov teeb meem metallization hauv cov qauv 3D nyuaj.
Kho tau rau ntau qhov ntau thiab tsawg ntawm cov khoom siv
Siv tau nrog cov iav substrates ntawm 600 × 600 mm, 510 × 515 mm, thiab cov hom ntawv loj dua kom tau raws li ntau yam kev xav tau ntawm kev tsim khoom.
Kev Ua Haujlwm Yooj Yim hla ntau yam khoom siv
Txhawb kev tso cov Cu, Ti, W, Ni, Pt thiab lwm yam yeeb yaj kiab nyias lossis ua haujlwm tau zoo, ua kom tau raws li qhov xav tau hluav taws xob thiab kev tiv thaiv xeb sib txawv.
Kev Ua Haujlwm Ruaj Khov & Kev Txij Nkawm Yooj Yim
Nruab nrog lub kaw lus tswj hwm ntse rau kev hloov kho qhov tsis siv neeg thiab kev saib xyuas tuab zaj duab xis tiag tiag. Kev tsim qauv modular ua kom yooj yim rau kev saib xyuas thiab txo lub sijhawm tsis ua haujlwm.
Daim Ntawv Thov Scope:
Haum rau TGV/TSV/TMV cov ntim khoom siab heev, ua kom muaj cov txheej txheej noob zoo hauv vias nrog cov piv txwv txog li 10:1.
Xaus Lus: Kev Tswj Xyuas Txheej Noob - Ib Kauj Ruam Mus Rau Kev Sib Koom Tes 3D Tseeb
Qhov txiaj ntsig ntawm TGV thev naus laus zis tsis yog tsuas yog muab ib txoj kab sib txuas ntsug tshiab xwb tab sis kuj ua rau muaj kev sib txuas peb-seem tiag tiag.
Hauv plawv ntawm qhov kev hloov pauv no, cov txheej txheem metallization noob tseem yog qhov tseem ceeb tshaj plaws tab sis feem ntau tsis quav ntsej.
Tsuas yog thaum lub hauv paus "conductive" uas tsis pom no ua tiav qhov sib npaug, qhov ceev, thiab kev nplaum zoo tuaj yeem ua kom tiav electroplating thiab kev sib txuas ua ke. Kev ua tiav cov hlau zoo hauv micron-scale iav vias tau dhau los ua tus qauv tseem ceeb ntawm kev muaj peev xwm ntim khoom siab heev.
Los ntawm kev tsim kho tshiab tas mus li thiab kev hloov pauv ntawm cov khoom siv, ZHENHUA Vacuum muab cov kev daws teeb meem TGV tob tob uas txhim khu kev qha, muaj txiaj ntsig zoo, ua rau cov chaw tsim khoom ntim khoom txav mus los ntawm kev sim ua haujlwm mus rau kev tsim khoom loj, ua kom nrawm dua qhov kev paub txog 3D kev koom ua ke.
Nyob rau hauv ib lub caij nyoog uas tsav los ntawm kev siv zog xam thiab kev sib koom ua ke ntau ntxiv, qhov no yog ntau tshaj li kev txhim kho khoom siv xwb - nws sawv cev rau ib kauj ruam txiav txim siab mus rau kev loj hlob ntawm cov thev naus laus zis ntim khoom 3D tiam tom ntej.
— Tsab xov xwm no tau luam tawm los ntawmcov khoom siv nqus tsev txheejChaw tsim khoom Zhenhua Lub Tshuab Nqus Tsev
Lub sijhawm tshaj tawm: Lub Kaum Hli-13-2025