A cikin juyin halittar fasahar marufi ta semiconductor, haɗin kai tsaye koyaushe shine babban abin da ke ƙayyade aikin tsarin, sawun ƙafa, da amfani da wutar lantarki. Tun daga farkon dabarun haɗa waya da jujjuyawar guntu zuwa fitowar ICs masu tarawa na 3D, masana'antar tana neman mafita mafi girma da gajerun hanyoyin haɗin kai.
A wannan mahallin, TSV (Ta Hanyar Silicon Via) da TGV (Ta Hanyar Glass Via) sun fito a matsayin manyan fasahohin haɗin kai na tsaye guda biyu. Sun bambanta a tsarin kayan aiki, hanyoyin kera kayayyaki, halayen aiki, da fannoni na aikace-aikace, suna wakiltar muhimmin batu a cikin haɓaka marufi na zamani.
I. TSV: Mafarin Marufi na 3D
1. Ka'idar Fasaha
TSV yana nufin babban rabon siffa da aka zana ta cikin wani sinadari na silicon (yawanci yana da zurfin dubu zuwa daruruwan microns), sannan sai a samar da wani Layer mai rufi, Layer iri na ƙarfe, da kuma cika ƙarfe (yawanci jan ƙarfe) a kan bangon via. Waɗannan vias ɗin tsaye suna ba da damar haɗakar lantarki mai sauri tsakanin layukan guntu da aka tara.
2. Gudun Tsarin Aiki
Tsarin ƙera TSV na yau da kullun ya haɗa da:
Gilashin Silikon Mai Zurfi (DRIE): Ƙirƙiri babban rabo a cikin wafer ɗin silikon.
Ragewar Layer Mai Rufewa: Yawanci ana amfani da SiO₂ mai PECVD don ware ƙarfen da ke cike da silicon ta hanyar lantarki.
Tsarin Zane da Zane-zanen Iri: Zane-zanen PVD na layin iri na ƙarfe sannan a saka jan ƙarfe a ciki.
Gilashin Injin Sinadarai (CMP): Cire ƙarfe mai yawa don samun saman da aka tsara.
3. Fa'idodi da Iyakoki
TSV tana ba da gajerun hanyoyin haɗin kai, ƙarancin jinkirin sigina, ƙarancin amfani da wutar lantarki, da kuma babban bandwidth, wanda hakan ya sa ta zama muhimmiyar hanya don sarrafa kwamfuta mai ƙarfi da ƙwaƙwalwar bandwidth mai girma.
Duk da haka, TSV yana da iyakoki:
Matsalolin damuwa na zafi: Babban rashin daidaito a CTE tsakanin silicon da jan ƙarfe na iya rage aminci.
Babban farashin tsari: Zane mai zurfi, zane mai laushi, da CMP suna da rikitarwa kuma suna da sauƙin amfani.
Kalubalen rufin lantarki: Kauri da daidaiton layin rufin suna shafar ƙarfin dielectric kai tsaye.
Yayin da yawan haɗin guntu ke ƙaruwa, rikice-rikice tsakanin yawan amfanin ƙasa da farashi sun haifar da binciken wasu kayan aiki - wanda hakan ya haifar da damar TGV.
II. TGV: Ƙirƙirar Haɗin Gilashi Mai Tushen Gilashi
1. Ka'idar Fasaha
TGV yana amfani da abubuwan da aka yi amfani da su a gilashi maimakon silicon. Ana samar da hanyoyin sadarwa masu inganci ta hanyar haƙa laser ko kuma yin etching da ruwa, sannan a saka layin iri na ƙarfe da kuma yin electroplating, wanda hakan ke samar da haɗin kai tsaye kamar TSV.
Gilashi yana ba da kyakkyawan rufin lantarki, ƙarancin dielectric constant (Dk), ƙarancin dielectric asara (Df), da kuma kyakkyawan kwanciyar hankali, wanda ke sa TGV ya zama mai jan hankali sosai don watsa siginar sauri da marufi na optoelectronic.
2. Gudun Tsarin Aiki
Manyan matakai a cikin ƙirƙirar TGV sun haɗa da:
Hakowar Laser: Lasers masu sauri suna samar da ƙananan ƙwayoyin cuta a cikin gilashi tare da diamita yawanci daga 20-150 μm.
Tsarin Layer na Iri: PVD, kamar magnetron sputtering, yana sanya wani Layer mai sarrafawa iri ɗaya a bangon via.
Ƙarfe Mai Laushi: Gilashin jan ƙarfe ko nickel yana cike ramukan don samar da haɗin lantarki ta gilashi.
Tsarin tsari da tsari: Yana ba da damar haɗa haɗin kai mai matakai da yawa ko haɗawa zuwa guntuwar IC.
3. Fa'idodi
Idan aka kwatanta da TSV, TGV yana nuna fa'idodi da yawa:
Ƙarancin asarar dielectric: Gilashin Dk yana da kusan 1/3 na silicon, yana rage siginar magana da asarar sakawa.
Kyakkyawan kwanciyar hankali na zafi: CTE kusa da ƙarfe, yana rage damuwa ta zafi.
Bayyanar gani: Yana tallafawa haɗakar optoelectronic a cikin photonics da firikwensin.
Kudin da za a iya sarrafawa: Haƙa Laser da sarrafa gilashi suna girma, wanda ya dace da samar da manyan matakai na panel.
III. TSV vs TGV: Kwatanta da Yankunan Aikace-aikace
| Abu | TSV (Ta hanyar Silicon Via) | TGV (Ta Gilashi Ta Hanyar) |
| Substrate | Silicon monocrystalline | Gilashin musamman (Borofloat, Corning, Schott, da sauransu) |
| Diamita na rami | 5–50 μm | 20–150 μm |
| Zurfin Rami | 30–100 μm | 100–400 μm |
| Rufewa | Ana buƙatar ƙarin Layer mai hana ruwa | Gilashi mai rufewa cikin ruwa |
| Daidaita Faɗaɗa Ma'aunin Zafi | Manyan bambance-bambance idan aka kwatanta da Cu | Kama da Cu, ƙarancin matsin lamba na zafi |
| Kudin Tsarin Aiki | Babban | Ƙananan |
| Aikace-aikace | Tsarin Manhaja/Ƙwaƙwalwa na 3D | SiP, firikwensin, marufi na lantarki, eriya, MEMS |
TSV ya kasance babban zaɓi don babban dabaru da ƙwaƙwalwar ajiya na 3D, yayin da TGV ke faɗaɗa cikin sauri a cikin SiP, haɗin kai na optoelectronic, firikwensin, da na'urorin RF.
Tare da girman gilashin da ke kan marufi (PLP), TGV yana zama dandamali mai kyau don haɗin kai don sadarwa ta 5G, radar mota, na'urorin gani na AR, da kuma marufi na Mini/Micro LED.
IV. Daga Silicon zuwa Gilashi: Fa'idodin Matakin Tsarin
Gabatar da gilashi ba wai kawai maye gurbin kayan abu bane; yana wakiltar sauyi a cikin falsafar ƙira ta matakin tsarin.
Aikin lantarki: Gilashin Dk mai ƙarancin DK yana rage jinkirin sigina da amfani da wutar lantarki sosai.
Tsarin ginin: TGV yana ba da mafi girman tsari da ƙananan warpage don manyan marufi.
Sassaucin masana'antu: Sarrafa Laser tare da injin PVD yana ba da damar daidaitawa da haɓaka aiki mai girma.
Musamman ma, don haɗakar optoelectronic, bayyananniya ta gilashi tana ba da damar ƙirar marufi inda substrate ba wai kawai yana tallafawa haɗin wutar lantarki ba har ma da jagororin raƙuman ruwa, ruwan tabarau, da tagogi masu firikwensin, wanda yake da wahalar cimmawa tare da TSV.
Maganin Rufin Tsarin Iri na V. ZhenHua Vacuum TGV
Amfanin Kayan Aiki:
Inganta Rufin Ta hanyar Zurfi: Fasaha mai zurfi ta hanyar rufewa wacce ke da ikon sarrafa ƙananan hanyoyin sadarwa kamar 30 μm tare da rabon al'amari sama da 10:1, wanda ke magance matsaloli masu sarkakiya.
Ana iya keɓancewa don Girma daban-daban: Yana goyan bayan gilashin da aka yi da gilashi, gami da 600 × 600 mm, 510 × 515 mm, ko mafi girma.
Sauƙin Tsarin Aiki: Ya dace da Cu, Ti, Ni, Pt, da sauran fina-finai masu sirara ko masu aiki don biyan buƙatun juriya na lantarki da tsatsa daban-daban.
Aiki Mai Tsayi & Sauƙin Kulawa: An sanye shi da iko mai wayo don daidaita sigogi ta atomatik da sa ido kan daidaiton kauri na ainihin lokaci; ƙirar zamani tana sauƙaƙa kulawa da rage lokacin aiki.
Tsarin Aikace-aikace: Ya dace da marufi na ci gaba na TGV/TSV/TMV, cimma zurfi ta hanyar rufin Layer iri tare da rabon 10: 1.
—An buga wannan labarin ne ta hannunkayan aikin shafa injin masana'anta Zhenhua injin injin
Lokacin Saƙo: Oktoba-16-2025

