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Film formation process of PVD vacuum coating equipment

Film formation process of PVD vacuum coating equipment

2021-04-05

Film formation process of PVD vacuum coating equipment



PVD vacuum coating equipment


 

The film production process of PVD vacuum coating equipment is simply a process of transferring one material (film material) to the surface of another material (substrate) to form a film firmly bonded to the substrate. Therefore, any PVD vacuum coating film production method includes three important links: source evaporation, migration and condensation.

 

1. Coating evaporation source

 

The function of "source" is to provide the material of the coating (or a certain component in the material to be plated). Make the coating material into a gaseous substance through physical or chemical methods.

 

Second, the migration process

 

The "migration" process is carried out in the gas phase. In order to ensure the quality of the film during the migration of gaseous substances, it is generally carried out in a vacuum or inert atmosphere, and external conditions such as electric field, magnetic field or high frequency are applied to activate it. , In order to increase the energy of the gaseous substance reaching the substrate, and provide the energy for the gaseous substance to react, that is, to provide the activation energy of the gaseous substance reaction.

 

Three, cohesion

 

The formation process of the film on the substrate is a complicated process, which includes: the nucleation and growth of the film, the interaction between the film and the surface of the substrate, and so on.

 

In recent years, the film production of PVD vacuum coating equipment has also applied auxiliary means such as electric field, magnetic field, and ion beam bombardment on the substrate, all of which are aimed at controlling the quality and performance of the film formed by the suspected polymer. According to the basic principles of the film forming method, it can be divided into physical vapor deposition, chemical vapor deposition, and plasma enhanced chemical vapor deposition with both physical and chemical methods.


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