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Evaporation coating equipment is often abbreviated as

Evaporation coating equipment is often abbreviated as

2021-01-15


Evaporation coating equipment is often abbreviated as "evaporator"



Evaporation coating equipment is often abbreviated as "evaporator", and its high vacuum system is very important to the selection of materials. The first thing to consider is that the vapor pressure of the selected material is low, otherwise the air load will be large. For example, brass contains zinc with high vapor pressure, low-melting alloy contains tin-lead, etc., and plastic, grease, rubber, etc. are not suitable for use. Second, consider the thermal stability of the material.






Evaporative deposition coating and sputtering deposition coating specifically include many types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, sol-gel method and so on.


1. For evaporation coating:

Generally, the target is heated to vaporize the surface components in the form of radicals or ions.


The thickness uniformity mainly depends on:

1. The degree of lattice matching between the substrate material and the target material

2. Surface temperature of substrate

3. Evaporating power and rate

4. Vacuum

5. Coating time and thickness.


Component uniformity:

The uniformity of the evaporation coating composition is not easy to guarantee. The specific factors that can be adjusted are the same as above, but due to the limitation of the principle, the uniformity of the evaporation coating composition is not good for non-single-component coatings.


Uniformity of crystal orientation:

1. Lattice matching

2. Substrate temperature

3. Evaporation rate


There are many types of sputtering coating. Generally speaking, the difference from evaporation coating is that the sputtering rate will become one of the main parameters.

The laser sputtering coating pld in the sputtering coating is easy to maintain the uniformity of the composition, but the thickness uniformity of the atomic scale is relatively poor (because it is pulse sputtering), and the control of the crystal orientation (outer edge) growth is relatively general.




 ( PVD vaccum coating equipment,PVD vaccum coating equipment,PVD Vacuum coating machine,PVD Vacuum coating machine)


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