Discuss magnetron sputtering coating technology
The basic process of plasma sputtering is that under the action of the energy-carrying ions in the plasma of the negative electrode target, the target atoms are sputtered from the target, and then condense on the substrate to form a thin film; in this process The surface of the target simultaneously emits secondary electrons, which play a key role in maintaining the stable existence of the plasma. The emergence and application of sputtering technology has gone through many stages. At first, it was just a simple two-pole and three-pole discharge sputtering deposition; An irreplaceable method for friction coefficient, corrosion resistance, decoration, and optical, electrical and other functional films. Pulsed magnetron sputtering technology is another major advance in this field.
The deposition of dense, defect-free insulating films, especially ceramic films, by DC reactive sputtering is almost impossible due to the slow deposition rate, the tendency to arc discharge in the target, and the changes in structure, composition, and properties. The use of pulsed magnetron sputtering technology can overcome these shortcomings. The pulse frequency is an intermediate frequency of 10-200kHz, which can effectively prevent target arc discharge, stabilize the reactive sputtering deposition process, and achieve high-speed deposition of high-quality reactive films. This paper mainly discusses the progress of magnetron sputtering technology in non-equilibrium magnetron sputtering, pulsed magnetron sputtering and so on. In-depth analysis of the process progress in quality and other aspects, and finally called for the development and application of magnetron sputtering technology in my country's petrochemical industry.（magnetron sputtering coating machine）
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