Ceramic metallization evaporation coating process
The evaporative metallization coating method is to vacuum coat a metal film on a ceramic device through an evaporation coating equipment to achieve the purpose of metallization. In this method, the thickness of the metal thin film is controlled by the "sample resistance" during the vapor deposition of ceramic parts.
The so-called "model resistor" refers to a small glass piece (length 20mm, width 10mm, thickness 2mm), on both ends of the model resistor by evaporation coating method, the length of 5mm Ag (silver) film is coated with The aluminum foil is wrapped on the Ag film, and then led to the outside of the evaporation coating equipment through a wire. Finally, by measuring the resistance value of the metal layer evaporated on the glass sheet with an ohmmeter, the coating thickness can be converted.
For example, when evaporating Ti (titanium) film, the resistance value of the control coating is in the range of 500Ω~20Ω, while the resistance value of the control Mo (molybdenum) coating is between 30Ω~10Ω.
When performing ceramic metallization evaporation coating, the 95% Al₂O₃ ceramic parts are first ground and cleaned, and then wrapped with aluminum foil. Only the parts of the ceramic parts that need to be metalized are exposed and installed in the vacuum chamber of the evaporation coating equipment. When it reaches 4* When the vacuum degree is 10⁻³Pa, preheat the ceramic parts until it is between 300°C and 400°C, and then keep it warm for about 10 minutes. Start steaming Ti and then Al to form a metal film. A layer of 2µm thick Ni is plated on the Al metal layer, and finally an oxygen-free copper sheet with a thickness of 0.5mm is used to seal the ceramic parts with AgCu28 solder in a vacuum furnace.
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